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				Maxim Integrated Products, Inc.
Part No.	AN884
OCR Text	...lithic flow sensor module, wire-bonded to the ceramic carrier, connects to the two sensor-signal processors (MAX1458s), which are also wire-bonded and mounted as dice. Figure 6 illustrates a micro-fluidic dosing and analysis system, in whic...
Description	Miniature Flow Sensor Has Electronic Temperature Compensation
File Size	287.11K / 6 Page	View it Online	Download Datasheet

				INTERSIL[Intersil Corporation]
Part No.	BYW51-100 BYW51-150 BYW51-200 FN1374.PDF FN1412
OCR Text	...sistance * Planar Design * Wire-bonded Construction Applications * General Purpose * Power Switching Circuits to 100kHz * Full-Wave Rectification Ordering Information PACKAGING AVAILABILITY PART NUMBER BYW51-100 BYW51-150 BYW51-200 ...
Description	25C 16 190/38 BC PVC,PVC 8A/ 100V - 200V Ultrafast Dual Diodes 8A, 100V - 200V Ultrafast Dual Diodes From old datasheet system
File Size	24.36K / 3 Page	View it Online	Download Datasheet

				Compensated Deuices Inc... CDI-DIODE[Compensated Deuices Incorporated] CDL Compensated Devices Incorporated
Part No.	CDLL1A100 CDLL1A30 CDLL1A60 1N5819UR JV6761UR-1 JX6761UR-1 J6761UR-1 JX5819UR-1 CDLL1A20 CDLL1A40 CDLL1A50 CDLL1A80 CDLL5817 CDLL5818 CDLL5819 CDLL6760 CDLL6761 J5819UR-1 JS5819UR-1 JS6761UR-1 JV5819UR-1 CDLL6759
OCR Text	...SURFACE MOUNT * METALLURGICALLY bonded 1N5819UR and CDLL5817 thru CDLL5819 and CDLL6759 thru CDLL6761 and CDLL1A20 thru CDLL1A100 MAXIMUM RATINGS Operating Temperature: -55C to +125C Storage Temperature: -55C to +150C Average Rectifi...
Description	1 AMP SCHOTTKY BARRIER RECTIFIERS Schottky Barrier Rectifiers(肖特基势垒整流二极管)
File Size	33.09K / 2 Page	View it Online	Download Datasheet

				RECTRON[Rectron Semiconductor]
Part No.	FM220 FM230 FM280 FM240 FM260 FM2100 FM250
OCR Text	...leakage current Metallurgically bonded construction Mounting position: Any Weight: 0.098 gram DO-214AA MECHANICAL DATA * Epoxy: Device has UL flammability classification 94V-O 0.083 (2.11) 0.077 (1.96) 0.180 (4.57) 0.160 (4.06) 0.15...
Description	SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER (VOLTAGE RANGE 20 to 100 Volts CURRENT 2.0 Amperes) CONN HEADR .05 20POS DL T/H R/A
File Size	29.09K / 2 Page	View it Online	Download Datasheet

				HP[Agilent(Hewlett-Packard)] Agilent (Hewlett-Packard)
Part No.	HBCS-4999 HBCS-A995 HBCS-A999 HBCS-T999 HBCS-2999 HBCS-A998
OCR Text	...sists of a rugged sapphire ball bonded to a transparent polycarbonate assembly . The HBCS-A995 optical assembly is an integral part of the HBCSA998/A999 tip and HBCS-AXXX wand construction. The HBCSA995 can be bonded to a tip or a case by e...
Description	Bar Code Reader Tips and Optical Nest Assembly 条码阅读器的提示和光学燕窝大 MICRO 15 M 10" RBW JACKS 条码阅读器的提示和光学燕窝大
File Size	193.86K / 3 Page	View it Online	Download Datasheet

				Powerex Power Semicondu... Powerex, Inc. POWEREX[Powerex Power Semiconductors] http:// Powerex Power Semiconductor...
Part No.	P3Z7ACT700W P2Z9ABA900W P7Z7ABB700 P7Z7ABC700 P7Z9AAA900W P7Z7ABB700W P2Z7ACB700W P2Z7ABB700W P3Z9ACT900W P1Z7AAR700W P1Z7ABR700W P1Z9AAR900W P1Z9ACR900W P1Z9ADR900V P2Z9AAA900W P2Z9ACA900W P3Z7AAT800W P3Z7ABT700W P3Z7ABT800W P3Z7ACT800W P3Z9AAT900W P3Z9ABT900W P7Z7ABC700W P7Z9AAB900W P7Z9AAC900W
OCR Text	...KTM Modules utilize Compression bonded Encapsulation (CBE) mounting and double side cooling of the semiconductor elements. The Z7A outline POW-R-BRIKTM uses 33mm or 38mm elements and the Z9A outline POW-R-BRIKTM uses 50mm elements. Standard...
Description	Phase Control Modules (345-800 Amperes/400-3000 Volts) 相位控制模块45-800 Amperes/400-3000伏特
File Size	92.04K / 6 Page	View it Online	Download Datasheet

				List of Unclassifed Man... Electronic Theatre Controls, Inc. ETC[ETC] List of Unclassifed Manufacturers
Part No.	PA21A PA21 PA26 PA25 PA25A
OCR Text	...top performance. Ultrasonically bonded aluminum wires provide reliable interconnections at all operating temperatures. The 8-pin TO-3 package is hermetically sealed and electrically isolated. The use of compressible isolation washers voids ...
Description	POWER DUAL OPERATIONAL AMPLIFIERS POWER DUAL OPERATIONAL AMPLIFIERS 功耗双运算放大
File Size	83.30K / 5 Page	View it Online	Download Datasheet

				MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No.	PM400DAS060 PM400HSA12 PM800HSA06 PM75RVA060 PM400DVA060 PM100CVA120
OCR Text	...ss in which copper patterns are bonded directly to the ceramic substrate without the use of solder is used in these modules. This substrate provides the improved thermal characteristics and greater current carrying capabilities that are nee...
Description	USING INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE
File Size	922.36K / 31 Page	View it Online	Download Datasheet

				STMicroelectronics N.V. ST Microelectronics STMICROELECTRONICS[STMicroelectronics]
Part No.	TEA2025B TEA2025D TEA2025 TEA-2025
OCR Text	...th j-amb is measured on devices bonded on a 10 x 5 x 0.15cm glass-epoxy substrate with a 35m thick copper surface of 5 cm2. 2/9 TEA2025B - TEA2025D ELECTRICAL CHARACTERISTICS (Tamb = 25C, VCC = 9V, Stereo unless otherwise specified) ...
Description	STEREO AUDIO AMPLIFIER 立体声音频放大器
File Size	80.89K / 9 Page	View it Online	Download Datasheet

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