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For bonded Found Datasheets File :: 4309 Search Time::2.25ms
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				ST Microelectronics
Part No.	STV0056AF
OCR Text	... 1% is required. a 12v double bonded main power pin for the audio/fm section of the chip. the two bond connections are to the esd and to power the circuit and on chip regulators/references. a gnd l this ground pin is double bonded : 1) to...
Description	SATELLITE SOUND AND VIDEO PROCESSOR
File Size	425.45K / 27 Page	View it Online	Download Datasheet

				Merrimac Industries, Inc.
Part No.	ILC-3F-2.14G
OCR Text	...C-F in-line couplers are fusion bonded multilayer stripline assemblies. The fusion bonding process yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical performance that is superior to conventiona...
Description	IN-LINE COUPLERS
File Size	140.05K / 5 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation Hittite Microwave Corpo...
Part No.	HMC33001
OCR Text	...ith the chip mounted and ribbon bonded into a 50-ohm microstrip test fixture that contains 5-mil alumina substrates between the chip and K-connectors. Measured data includes the parasitic effects of the assembly. RF connections to the chip ...
Description	GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 25 - 40 GHz GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 25 - 40 GHz
File Size	204.96K / 6 Page	View it Online	Download Datasheet

				Yamaichi Electronics Co., Ltd. http://
Part No.	FLEX-B210-7-0.1 FLEX-B216-7_0.1 FLEX-S216-7_0.1 FLEX-B226-7_0.1 FLEX-B210-7_0.1 FLEX-S210-7_0.1 FLEX-S234-7_0.1 FLEX-S268-7_0.1 FLEX-B2100-7_0.1 FLEX-B220-7_0.1 FLEX-S226-7_0.1 FLEX-B250-7_0.1 FLEX-S250-7_0.1 FLEX-S240-7_0.1 FLEX-B230-7_0.1 FLEX-B234-7_0.1 FLEX-B268-7_0.1 FLEX-S230-7_0.1 FLEX-B240-7_0.1 FLEX-B264-7_0.1 FLEX-S264-7_0.1 FLEX-S2100-7_0.1 FLEX-S220-7_0.1 FLEX-S260-7_0.1 FLEX-S280-7_0.1 FLEX-S234-7/0.1 FLEX-B234-7/0.1 FLEX-B216-7/0.1 FLEX-B220-7/0.1 FLEX-B210-7/0.1 FLEX-B2100-7/0.1 FLEX-S226-7/0.1 FLEX-B226-7/0.1 FLEX-S216-7/0.1 FLEX-S2100-7/0.1 FLEX-S210-7/0.1 FLEX-B230-7/0.1 FLEX-S230-7/0.1 FLEX-B240-7/0.1 FLEX-S240-7/0.1 FLEX-S220-7/0.1 FLEX-S264-7/0.1 FLEX-B264-7/0.1 FLEX-B268-7/0.1 FLEX-S268-7/0.1 FLEX-B260-7/0.1 FLEX-S260-7/0.1 FLEX-B280-7/0.1 FLEX-B250-7/0.1 FLEX-S280-7/0.1 FLEX-S250-7/0.1
OCR Text	...red edge including regular 30mm bonded and 70mm unbonded sections Number of Conductors - 2 * - 7/0.1 Materials and Finish Insulation: PVC Conductor: 30 AWG (7/0.1mm) stranded Cu-wire Features 25MIL (0.635mm) pitch flat ca...
Description	25MIL (0.635mm) OKIFLEX-B&S Type (150V, 105隆?C) 25MIL (0.635mm) OKIFLEX-B&S Type (150V, 105掳C) 25MIL (0.635mm) OKIFLEX-B&S Type (150V, 105°C)
File Size	39.13K / 1 Page	View it Online	Download Datasheet

				Yamaichi Electronics Co., Ltd.
Part No.	FLEX-S416-7-0.1 FLEX-S416-7_0.1 FLEX-S16-7_0.1 FLEX-S416-7_0.13030 FLEX-S16-7_0.13030 FLEX-S416-7_0.17030 FLEX-S16-7_0.17030 FLEX-S420-7_0.13030 FLEX-S20-7_0.13030 FLEX-S420-7_0.17030 FLEX-S20-7_0.17030 FLEX-S20-7_0.1 FLEX-S420-7_0.1 FLEX-S16-7/0.17030 FLEX-S416-7/0.17030 FLEX-S16-7/0.13030 FLEX-S416-7/0.13030 FLEX-S420-7/0.17030 FLEX-S20-7/0.17030 FLEX-S20-7/0.13030 FLEX-S420-7/0.13030
OCR Text	...le: 3030 = 30mm Unbonded / 30mm bonded 7030 = 70mm Unbonded / 30mm bonded - S* ** - 7/0.127 * Materials and Finish Insulation: PVC Conductor: 28 AWG (7/0.127mm) stranded copper wire Features Identical to 50 MIL (1.27 mm) OK...
Description	50MIL (1.27mm) OKIFLEX-S Type (300V, 105隆?C) 50MIL (1.27mm) OKIFLEX-S Type (300V, 105掳C) 50MIL (1.27mm) OKIFLEX-S Type (300V, 105°C)
File Size	47.79K / 1 Page	View it Online	Download Datasheet

				Microsemi Corporation
Part No.	1N5937BUR-1 1N5913BUR-1 1N5945BUR-1 1N5930BUR-1 1N5955BUR-1 1N5928BUR-1 1N5914BUR-1 1N5940BUR-1 1N5950BUR-1 1N5929BUR-1 1N5918BUR-1 1N5931BUR-1 1N5946BUR-1 1N5941BUR-1 1N5924BUR-1 1N5939BUR-1 1N5949BUR-1 1N5926BUR-1
OCR Text	bonded GLASS SURFACE MOUNT 1.5 WATT ZENERS DESCRIPTION This surface mountable 1.5 W Zener diode series in the JEDEC DO-213AB package is similar in electrical features to the JEDEC registered 1N5913B thru 1N5956B axial-leaded package for ...
Description	METALLURGICALLY bonded GLASS SURFACE MOUNT 1.5 WATT ZENERS
File Size	188.84K / 3 Page	View it Online	Download Datasheet

				Holtek Semiconductor Inc
Part No.	HT66F03 HT66F04 HT68F03 HT68F04
OCR Text	...C power supply. The AVDD pin is bonded together internally with VDD. **: VSS is the device ground pin while AVSS is the ADC ground pin. The AVSS pin is bonded together internally with VSS. PRM PRM PRM PRM 3/4 CO CO CO 3/4 3/4 3/4 3/4 CPC Fu...
Description	Small Package Enhanced Flash Type 8-Bit MCU with EEPROM
File Size	1,390.33K / 139 Page	View it Online	Download Datasheet

				Merrimac Industries, Inc.
Part No.	CSD-20H-0.9G
OCR Text	...directional couplers are fusion bonded multilayer stripline assemblies. The fusion bonding process yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical performance that is superior to conventiona...
Description	DIRECTIONAL COUPLER
File Size	145.49K / 5 Page	View it Online	Download Datasheet

				Merrimac Industries, Inc.
Part No.	CSD-20H-1.9G
OCR Text	...directional couplers are fusion bonded multilayer stripline assemblies. The fusion bonding process yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical performance that is superior to conventiona...
Description	DIRECTIONAL COUPLERS
File Size	180.25K / 5 Page	View it Online	Download Datasheet

				SIGE[SiGe Semiconductor Inc.] SIGE[SiGe Semiconductor, Inc.]
Part No.	SE1031W SE103
OCR Text	... chip. Only one pad needs to be bonded. Input pad (connect to photodetector anode). Negative supply (0V) - Note this is separate ground for the input stage, which is AC coupled on chip. There is no DC current through this pad. Negative supp...
Description	LightCharger?/a> 2.5 Gb/s Transimpedance Amplifier LP Final LightCharger 2.5 Gb/s Transimpedance Amplifier LP Final LightCharger⑩ 2.5 Gb/s Transimpedance Amplifier LP Final
File Size	79.89K / 7 Page	View it Online	Download Datasheet

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