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SGS Thomson Microelectronics
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| Part No. |
AN451
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| OCR Text |
.... because gold and aluminum are bonded using different techniques this has necessitated a two- step bonding operation. moreover, because of the combination of different bonding metals the lead- frame has to be plated with a special gold all... |
| Description |
HIGH/CURRENT MOTOR DRIVER ICS BRING AUTOMOTIVE MULTIPLEX CLOSER
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| File Size |
207.33K /
7 Page |
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it Online |
Download Datasheet
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Ecliptek, Corp.
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| Part No. |
PTX.0103.100 PTX.0103.200 PTX.2503.100 PTX.0203.100 PTX.0503.100 PTX.4003.100 PTX.0503.200 PTX.0203.200 PTX.2503.200 PTX.1003.100 PTX.1003.200
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| OCR Text |
...ration:
>50g G1/4 (1/4BSP) for bonded seal G /4 ( /4BSP) with integral seal
1 1 9
/16 UNF (37 Flare to SAE J514, size 6) NPTF1/4 (ANSI B1.20 3-1976)
Minimum over pressure:
Rated pressure times 1.5min
Installation:
Spanner size ... |
| Description |
DRUCKSENSOR MIKRO DIN ANSCHL 0 BIS 250
DRUCKSENSOR MIKRO DIN ANSCHL 0 BIS 20
DRUCKSENSOR MIKRO DIN ANSCHL 0 BIS 50
DRUCKSENSOR MIKRO DIN ANSCHL 0 BIS 400
DRUCKSENSOR FREIE ANSCHL LEIT 0 BIS 50
DRUCKSENSOR FREIE ANSCHL LEIT 0 BIS 20
DRUCKSENSOR FREIE ANSCHL LEIT 0 BIS 250
DRUCKSENSOR MIKRO DIN ANSCHL 0 BIS 100
DRUCKSENSOR FREIE ANSCHL LEIT 0 BIS 10 DRUCKSENSOR柏林自由ANSCHLя赖国际清算银行10
DRUCKSENSOR FREIE ANSCHL LEIT 0 BIS 100
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| File Size |
327.41K /
4 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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