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wire-bond Datasheet PDF File

For wire-bond Found Datasheets File :: 3708 Search Time::17.25ms
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				http:// Advanced Micro Devices, Inc. AMD[Advanced Micro Devices]
Part No.	AM29LV800B-1 AM29LV800BB-120DG5C AM29LV800BB-120DG5C1 AM29LV800BB-120DG5I AM29LV800BB-120DG5I1 AM29LV800BB-120DP5C AM29LV800BB-120DP5C1 AM29LV800BB-120DP5I AM29LV800BB-120DP5I1 AM29LV800BB-120DT5C AM29LV800BB-120DT5C1 AM29LV800BB-120DT5I AM29LV800BB-120DT5I1 AM29LV800BB-120DW5C AM29LV800BB-120DW5C1 AM29LV800BB-120DW5I AM29LV800BB-120DW5I1 AM29LV800BB-90DG5C AM29LV800BB-90DG5C1 AM29LV800BB-90DG5I AM29LV800BB-90DG5I1 AM29LV800BB-90DP5C AM29LV800BB-90DP5C1 AM29LV800BT-90DG5C AM29LV800BT-90DG5C1 AM29LV800BT-90DG5I AM29LV800BT-90DG5I1 AM29LV800BT-90DP5C AM29LV800BT-90DP5C1 AM29LV800BT-90DP5I AM29LV800BT-90DP5I1 AM29LV800BT-90DT5C AM29LV800BT-90DT5C1 AM29LV800BT-90DT5I AM29LV800BT-90DT5I1 AM29LV800BT-90DW5C AM29LV800BT-90DW5C1 AM29LV800BT-90DW5I AM29LV800BT-90DW5I1 AM29LV800BB-90DP5I AM29LV800BB-90DP5I1 AM29LV800BB-90DT5C AM29LV800BT-120DG5C AM29LV800BT-120DG5C1 AM29LV800BT-120DG5I AM29LV800BT-120DG5I1 AM29LV800BT-120DP5C AM29LV800BT-120DP5C1 AM29LV800BT-120DP5I AM29LV800BT-120DP5I1 AM29LV800BT-120DT5C AM29LV800BT-120DT5C1 AM29LV800BT-120DT5I AM29LV800BT-120DT5I1 AM29LV800BT-120DW5C AM29LV800BT-120DW5C1 AM29LV800BT-120DW5I AM29LV800BT-120DW5I1 AM29LV800BB-90DT5C1 AM29LV800BB-90DT5I AM29L
OCR Text	...ad 1 and can be used to operate wire bonding equipment. Am29LV800B Known Good Die 5 SUPPLEMENT ORDERING INFORMATION Standard Pro...Bond Pad Size . . . . . . . . . . . . . . 3.94 mils x 3.94 mils . . . . . . . . . . . . . . . . . . ...
Description	8 megabit CMOS 3.0 volt-only, boot sector flash memory- die revision 1 LED Lamp; LED Color:White; Luminous Intensity:160ucd; Viewing Angle:120 ; Forward Current:20mA; Forward Voltage:3.6V; Operating Temperature Range:-30 C to C; Color:White; Leaded Process Compatible:Yes; Lens Color:Clear RoHS Compliant: Yes LED Lamp; LED Color:Red; Luminous Intensity:9ucd; Viewing Angle:140 ; Forward Current:20mA; Forward Voltage:2V; Operating Temperature Range:-30 C to 85 C; Color:Red; Leaded Process Compatible:Yes RoHS Compliant: Yes LED Lamp; LED Color:Red; Luminous Intensity:40ucd; Viewing Angle:140 ; Forward Current:20mA; Forward Voltage:1.7V; Operating Temperature Range:-40 C to 85 C; Color:Red; Leaded Process Compatible:Yes RoHS Compliant: Yes LED Lamp; LED Color:Yellow; Luminous Intensity:80mcd; Viewing Angle:140 ; Forward Current:20mA; Forward Voltage:2.1V; Operating Temperature Range:-40 C to 85 C; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes RoHS Compliant: Yes Toggle Switch; Circuitry:SPST; Switch Operation:On-None-On; Contact Current Max:15A; Actuator Style:Flat Lever; Switch Terminals:Solder Lug; Current Rating:15A; Leaded Process Compatible:Yes; Mounting Type:Panel RoHS Compliant: Yes 8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash MemoryDie Revision 1 8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory-Die Revision 1 8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 3.0 Volt-only/ Boot Sector Flash Memory-Die Revision 1 8 megabit CMOS 3.0 volt-only boot sector flash memory- die revision 1
File Size	79.83K / 9 Page	View it Online	Download Datasheet

				RECTRON[Rectron Semiconductor]
Part No.	BAT54C
OCR Text	...g e Lead Frame Lead Finish Bond Wire Mold Resin Chip Materials SOT-23 42 Alloy Solder Plating Au Epoxy Silicon Electrical Characteristics per diode (Ta=25oC) Ratings Minimum Repetitive Peak Reverse Voltage Maximum Repetitive Peak...
Description	DUAL SURFACE MOUNT SCHOTTKY
File Size	16.35K / 1 Page	View it Online	Download Datasheet

				International Rectifier Seme LAB
Part No.	IRF140SMD
OCR Text	...ource pad to end of source bond wire) nH Notes 1) Pulse Test: Pulse Width 300ms, d 2% 2) Repetitive Rating - Pulse width limited by maximum junction temperature. Semelab plc. Telephone +44(0)1455 556565. Fax +44(0)1455 552612....
Description	N-CHANNEL POWER MOSFET
File Size	22.30K / 2 Page	View it Online	Download Datasheet

				SemeLAB SEME-LAB[Seme LAB]
Part No.	IRF150SMD
OCR Text	...ource pad to end of source bond wire) nH Notes 1) Pulse Test: Pulse Width 300ms, d 2% 2) Repetitive Rating - Pulse width limited by maximum junction temperature. Semelab plc. Telephone +44(0)1455 556565. Fax +44(0)1455 552612....
Description	N-CHANNEL POWER MOSFET
File Size	22.29K / 2 Page	View it Online	Download Datasheet

				SemeLAB SEME-LAB[Seme LAB] Air Cost Control
Part No.	IRF240SMD
OCR Text	...ource pad to end of source bond wire) nH Notes 1) Pulse Test: Pulse Width 300ms, d 2% 2) Repetitive Rating - Pulse width limited by maximum junction temperature. Semelab plc. Telephone +44(0)1455 556565. Fax +44(0)1455 552612....
Description	N.CHANNEL POWER MOSFET N-Channel Power MOSFET(Vdss:200V,Id(cont):13.9A,Rds(on):0.18Ω)(N沟道功率MOS场效应管(Vdss:200V,Id(cont):13.9A,Rds(on):0.18Ω)) N沟道功率MOSFET（减振钢板基本：200伏，身份证（续）3.9A，的Rds（on）：0.18Ω）（不适用马鞍山沟道功率场效应管（减振钢板基本00伏，身份证（续）3.9A时，RDS（对）：0.18Ω））
File Size	22.29K / 2 Page	View it Online	Download Datasheet

				SemeLAB SEME-LAB[Seme LAB]
Part No.	IRF250SMD
OCR Text	...ource pad to end of source bond wire) nH Notes 1) Pulse Test: Pulse Width 300ms, d 2% 2) Repetitive Rating - Pulse width limited by maximum junction temperature. Semelab plc. Telephone +44(0)1455 556565. Fax +44(0)1455 552612....
Description	N.CHANNEL POWER MOSFET
File Size	23.37K / 2 Page	View it Online	Download Datasheet

				IRF[International Rectifier]
Part No.	IR2111
OCR Text	...ethod of Saw Method of Die Bond Wire Bond Leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thickness Material Thickness Package Remarks: Method Material Material Die Area Lead Plating Types Mater...
Description	HALF-BRIDGE DRIVER
File Size	237.91K / 7 Page	View it Online	Download Datasheet

				IRF[International Rectifier] HITACHI
Part No.	IR2125 HD74HC138
OCR Text	...ethod of Saw Method of Die Bond Wire Bond Leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thickness Material Thickness Material Thickness Package Remarks: * Patent Pending Method Material Materi...
Description	3-to-8-line Decoder/Demultiplexer CURRENT LIMITING SINGLE CHANNEL DRIVER
File Size	437.69K / 16 Page	View it Online	Download Datasheet

				ICST[Integrated Circuit Systems]
Part No.	ICS843001 ICS843001AG ICS843001AGT
OCR Text	...ure at the junction of the bond wire and bond pad and directly affects the reliability of the device. The maximum recommended junction temperature for HiPerClockSTM devices is 125C. The equation for Tj is as follows: Tj = JA * Pd_total + T...
Description	FEMTO CLOCKS CRYSTAL-TO- 3.3V LVPECL CLOCK GENERATOR
File Size	235.10K / 15 Page	View it Online	Download Datasheet

				ICST[Integrated Circuit Systems]
Part No.	ICS843023 ICS843023AG ICS843023AGT
OCR Text	...ure at the junction of the bond wire and bond pad and directly affects the reliability of the device. The maximum recommended junction temperature for HiPerClockSTM devices is 125C. The equation for Tj is as follows: Tj = JA * Pd_total + T...
Description	3.3V, 250MHZ LVPECL CLOCK GENERATOR
File Size	167.19K / 10 Page	View it Online	Download Datasheet

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