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Motorola
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Part No. |
MC33399
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OCR Text |
...50 +165 +125 150 200 20 C C C C/w C C V VSUP VSUP Vwake Vlog Vbus -18 -150 Vinh -0.3 tbd VHesd -2 -4 VMesd -200 +200 V +2 +4 kV Vsup+0.3 tbd...20ua typical. GND Ground Pin Device gnd connection. In case ground disconnection at the module level... |
Description |
Automotive “Local Interconnect Network” Physical Interface
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File Size |
111.08K /
9 Page |
View
it Online |
Download Datasheet |
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BRILLIANCE SEMICONDUCTOR, INC. BSI[Brilliance Semiconductor]
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Part No. |
BH616UV1610AIG70 BH616UV1610 BH616UV1610AI BH616UV1610AI-70
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OCR Text |
...25 -60 to +150 1.0 20
C C
w mA
n CAPACITANCE
(1)
(TA = 25 C, f = 1.0MHz)
O
1. Stresses greater than those listed under ...20ua at VCC=1.8V/3.6V and TA=0OC ~ 70OC. R0201-BH616UV1610 Revision 1.0 Jul. 2005
3
BSI
n DAT... |
Description |
Ultra Low Power/High Speed CMOS SRAM
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File Size |
130.02K /
10 Page |
View
it Online |
Download Datasheet |
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BRILLIANCE SEMICONDUCTOR, INC. BSI[Brilliance Semiconductor]
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Part No. |
BH62UV1600AIG70 BH62UV1600 BH62UV1600AI BH62UV1600AI-70
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OCR Text |
...25 -60 to +150 1.0 20
C C
w mA
n CAPACITANCE
(1)
(TA = 25 C, f = 1.0MHz)
O
1. Stresses greater than those listed under ...20ua at VCC=1.8V/3.6V and TA=0OC ~ 70OC.
O O
n DATA RETENTION CHARACTERISTICS (TA = -25 C to +85... |
Description |
Ultra Low Power/High Speed CMOS SRAM 2M X 8 bit
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File Size |
123.63K /
9 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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