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For unsawn Found Datasheets File :: 221 Search Time::2.344ms
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				Atmel
Part No.	T2527 T2527N740-DDW
OCR Text	...Ordering Information Delivery: unsawn wafers (DDW) in box, SO8 (150 mil) and TSSOP8 (3 mm body). Extended Type Number T2527N0xx -yyy (1) (5) PL(2) 2 1 2 1 2 1 RPU(3) 30 30 40 40 30 30 D(4) 2000 2000 1333 1333 3060 3060 Type S...
Description	Low-voltage Highly Selective IR Receiver IC Low-voltage highly selective IR receiver IC. Carrier frequency 40 kHz.
File Size	126.49K / 11 Page	View it Online	Download Datasheet

				INFINEON TECHNOLOGIES AG
Part No.	SLE4406SPEC SLE4406SPEMFC3 SLE4406SPEM3
OCR Text	... sle 4406sp c die (on wafer) unsawn sle 4406sp d die (on wafer) sawn sle 4406sp m3 t-m3.2-6 sle 4406sp mfc3 s-mfc3.1-6-1 fcos? data of 3rd byte are programmed by infineon exclusively sle 4406spe c die (on wafer) unsawn sle ...
Description	512 X 1 EEPROM 5V, UUC 512 X 1 EEPROM 5V, DMA
File Size	257.30K / 6 Page	View it Online	Download Datasheet

				PLX Technology, Inc. NXP Semiconductors
Part No.	PCF8564ACX9_1 PCF8564ACX9_B_1 PCF8564A PCF8564AU_10AA_1 PCF8564AU_10AB_1 PCF8564AU_5BB_1 PCF8564AU_5BD_1 PCF8564AU_5GB_1 PCF8564AU_5GE_1 PCF8564ACX9/1 PCF8564ACX9/B/1 PCF8564AU/10AA/1 PCF8564AU/5BD/1 PCF8564AU/5GB/1 PCF8564AU/5GE/1 PCF8564AU/10AB/1 PCF8564AU/5BB/1
OCR Text	...s wire bond die; 9 bonding pads unsawn wafer; thickness 280 m unsawn wafer; thickness 687 m wafer sawn on FFC; thickness 200 m unsawn wafer; thickness 280 m unsawn wafer; thickness 687 m wafer sawn on FFC; thickness 200 m wafer sawn on FFC;...
Description	REAL TIME CLOCK, UUC9 DIE-9 Real time clock and calendar
File Size	198.23K / 44 Page	View it Online	Download Datasheet

				STMicroelectronics ST Microelectronics
Part No.	XRA00 XRA00-SBN18I XRA00-W4I
OCR Text	... XXX Package W4I =180m 15 m unsawn Inkless Wafer SBN18I = 180m 15 m Bumped and Sawn Inkless Wafer on 8-inch Frame Customer Code XXX = Given by STMicroelectronics REVISION HISTORY Table 3. Document Revision History Date 27-Aug-2003 ...
Description	UHF, EPCglobal, Contactless Memory IC 96 bit ePC with Inventory and Kill Function UHF/ EPCglobal/ Contactless Memory IC 96 bit ePC with Inventory and Kill Function EEPROM (Electrically-Erasable PROM) - Datasheet Reference From old datasheet system
File Size	93.13K / 4 Page	View it Online	Download Datasheet

				意法半导 ST Microelectronics STMICROELECTRONICS[STMicroelectronics]
Part No.	STDELIV SMARTCARD ST19SF08CD45XXXZ
OCR Text	...uction need, ST offers sawn and unsawn wafers deliveries, listed in Table 3. Figure 1. Delivery form s 4 4 Table 1. Micromodules in super 35 standard tape Type D1, D2 D15 D3, D4 D5 D68 D7 C7 D8 Description 8 contacts for memory cards ...
Description	ORDERING INFORMATION FOR PACKAGE AND DELIVERY ORDERING INFORMATION FOR PACKAGE AND DELIVERY
File Size	31.03K / 2 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	FD120L03A5
OCR Text	...form) fd120xxxx5 b inked probed unsawn wafer (wafer in box) 1000 fd120xxxx5 r probed die in tape & reel n/a fd120xxxx5 p probed die in waffle pack 1000 fd120xxxx5 f inked probed sawn wafer on film 1000 device description minimum order quant...
Description	Fred Die
File Size	46.53K / 3 Page	View it Online	Download Datasheet

For unsawn Found Datasheets File :: 221 Search Time::2.344ms
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