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substrates Datasheet PDF File

For substrates Found Datasheets File :: 1677 Search Time::1.625ms
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				Micross Components
Part No.	HMC486
OCR Text	... mil) thick alumina thin fi lm substrates are recommended for bringing rf to and from the chip (figure 1). if 0.254mm (10 mil) thick alumina thin fi lm substrates must be used, the die should be raised 0.150mm (6 mils) so that the surf...
Description	Point-to-Multi-Point Radios
File Size	917.04K / 11 Page	View it Online	Download Datasheet

				Analog Devices
Part No.	HMC-ALH435
OCR Text	... mil) thick alumina thin fi lm substrates are recommended for bringing rf to and from the chip (figure 1). if 0.254mm (10 mil) thick alumina thin fi lm substrates must be used, the die should be raised 0.150mm (6 mils) so that the surf...
Description	GaAs HEMT MMIC LOW NOISE AMPLIFIER
File Size	287.02K / 6 Page	View it Online	Download Datasheet

				Micross Components
Part No.	HMC292
OCR Text	...il) thick alumina thin flm substrates are recommended for bringing rf to and from the chip (figure 1). if 0.254mm (10 mil) thick alumina thin flm substrates must be used, the die should be raised 0.150mm (6 mils) so that the surfac...
Description	GaAs MMIC DOUBLE-BALANCED
File Size	985.86K / 9 Page	View it Online	Download Datasheet

				Hittite Microwave Corpo...
Part No.	HMC292-09
OCR Text	... mil) thick alumina thin fi lm substrates are recommended for bringing rf to and from the chip (figure 1). if 0.254mm (10 mil) thick alumina thin fi lm substrates must be used, the die should be raised 0.150mm (6 mils) so that the surf...
Description	GaAs MMIC DOUBLE-BALANCED MIXER, 18 - 32 GHz
File Size	209.85K / 6 Page	View it Online	Download Datasheet

				NXP Semiconductors N.V. M/A-COM Technology Solutions, Inc.
Part No.	MA4E2508MSP-T MADS-002508-1112HT MA4E2508L-1112 MA4E2508L-1112T MA4E2508L-1112W MA4E2508H-1112 MA4E2508H-1112W MA4E2508M-1112 MA4E2508M-1112W
OCR Text	...manent Die Bonding For hard substrates, we recommend utilizing a vacuum tip and force of 60 to 100 grams applied uniformly to the top surface of the device, using a hot gas bonder with equal heat applied across the bottom mounting pads ...
Description	SILICON, LOW BARRIER SCHOTTKY, KU BAND, MIXER DIODE CASE 1112, 2 PIN SURMOUNTTM Low, Medium, & High Barrier Silicon Schottky Diodes: Anti-Parallel Pair
File Size	94.71K / 4 Page	View it Online	Download Datasheet

				AVAGO TECHNOLOGIES LIMI... Broadcom Corporation.
Part No.	HPND-4005
OCR Text	...y. this method is good for hard substrates only. wobble: this method picks up the device, places it on the substrate and forms a thermo-compression bond all in one operation. this is described in the latest version of mi...
Description	Beam Lead PIN Diode
File Size	92.64K / 4 Page	View it Online	Download Datasheet

				M/A-COM Technology Solu... M/A-COM Technology Solutions, Inc.
Part No.	MA4E2514M-1116 MA4E2514M-1116T MA4E2514M-1116W MADS-002514-1116LP MADS-002514-1116MP MA4E2514L-1116 MA4E2514L-1116T MA4E2514L-1116W
OCR Text	... Model Die Bonding For Hard substrates, we recommend utilizing a vacuum tip and force of 60 to 100 grams applied uniformly to the top surface of the device, using a hot gas bonder with equal heat applied across the bottom mounting pads ...
Description	SURMOUNTTM Low and Medium Barrier Silicon Schottky Diodes: Tee Pair
File Size	95.19K / 4 Page	View it Online	Download Datasheet

				ONSEMI[ON Semiconductor]
Part No.	MC14007 MC14007UB MC14007UBCP MC14007UBD MC14007UBDR2 MC14007UBDT MC14007UBF MC14007UBFEL
OCR Text	...= OPEN INPUT 6 13 8 10 substrates of P-channel devices internally connected to VDD; substrates of N-channel devices internally connected to VSS. 7 VSS Figure 1. Typical Application: 2-Input Analog Multiplexer http://ons...
Description	Dual Complementary Pair Plus Inverter
File Size	240.35K / 8 Page	View it Online	Download Datasheet

				M/A-COM Technology Solutions, Inc.
Part No.	MADS-002502-1246HP MADS-002502-1246LP MADS-002502-1246MP MA4E2502H-1246 MA4E2502H-1246T MA4E2502H-1246W MA4E2502L-1246 MA4E2502L-1246T MA4E2502L-1246W MA4E2502 MA4E2502H MA4E2502M-1246W MA4E2502M-1246T
OCR Text	...ure solder attachment onto hard substrates. 80Au/20Sn and Sn63/Pb37 solders are acceptable for usage. Die attach with Electrically Conductive Silver Epoxy is Not Recommended. For Hard substrates, we recommend utilizing a vacuum tip and forc...
Description	SILICON, HIGH BARRIER SCHOTTKY, KU BAND, MIXER DIODE SURMOUNTTM Low, Medium, and High Barrier Silicon Schottky Diodes
File Size	106.93K / 5 Page	View it Online	Download Datasheet

				M/A-COM Technology Solutions, Inc.
Part No.	MADS-002545-1307 MADS-002545-1307H MADS-002545-1307HT MADS-002545-1307L MADS-002545-1307LG MADS-002545-1307LT MADS-002545-1307M MADS-002545-1307HG
OCR Text	...ure solder attachment onto hard substrates. 80Au/20Sn and Sn63/Pb36 solders are acceptable for usage. 1. Operation of this device above any one of these parameters may cause permanent damage. Die Bonding For Hard substrates, we recom...
Description	SURMOUNTTM Schottky Diodes: Cross-Over Quad Series Ultra-Small 600x600um Surface-Mount Chip
File Size	56.46K / 3 Page	View it Online	Download Datasheet

For substrates Found Datasheets File :: 1677 Search Time::1.625ms
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