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solder-bond Datasheet PDF File

For solder-bond Found Datasheets File :: 1939 Search Time::3.578ms
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				RECTRON[Rectron Semiconductor]
Part No.	BAT54C
OCR Text	...p Materials SOT-23 42 Alloy Solder Plating Au Epoxy Silicon Electrical Characteristics per diode (Ta=25oC) Ratings Minimum Repetitive Peak Reverse Voltage Maximum Repetitive Peak Forward Current Maximum Forward Voltage IF= 100uA ...
Description	DUAL SURFACE MOUNT SCHOTTKY
File Size	16.35K / 1 Page	View it Online	Download Datasheet

				MACOM[Tyco Electronics]
Part No.	MA4SPS302
OCR Text	...hese diodes are well suited for solder attachment onto hard and soft substrates. The use of 80/20 Au/Sn and 60/40 Sn/Pb solder is recommended. Conductive epoxy paste for attachment may also be used, this can be silk-screened, or used with a...
Description	Surface Mount Monolithic PIN Diode Chip 表面贴装芯片单片PIN二极
File Size	55.50K / 3 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	PHD12N10E
OCR Text	...f die Measured from source lead solder point to source bond pad MIN. 4.0 TYP. 5.5 660 140 60 10 25 60 40 3.5 7.5 MAX. 825 200 100 20 40 90 55 UNIT S pF pF pF ns ns ns ns nH nH REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS Tj = 25 C ...
Description	PowerMOS transistor
File Size	78.59K / 7 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	PHD5N20E
OCR Text	...f die Measured from source lead solder point to source bond pad VGS = 0 V; VDS = 25 V; f = 1 MHz SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS Tj = 25 C unless otherwise specified SYMBOL IS ISM VSD trr Qrr PARAMETER Continuous source c...
Description	PowerMOS transistor
File Size	50.47K / 7 Page	View it Online	Download Datasheet

				MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No.	PM400DAS060 PM400HSA12 PM800HSA06 PM75RVA060 PM400DVA060 PM100CVA120
OCR Text	...ic substrate without the use of solder is used in these modules. This substrate provides the improved thermal characteristics and greater cu...BOND WIRES DBC AIN CERAMIC SUBSTRATE Sep.1998 MITSUBISHI SEMICONDUCTORS POWER MODULES MOS ...
Description	USING INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE
File Size	922.36K / 31 Page	View it Online	Download Datasheet

				MOTOROLA[Motorola, Inc]
Part No.	MPX5100 MPX5100A MPX5100AP MPX5100D MPX5100DP MPX5100GP MPX5100GSX MPXV5100GC7U MPXV5100 MPXV5100GC6U
OCR Text	...e correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, 0.660 16.76 the packages will self align when subjected to a solder reflow process. It is always recommended to d...
Description	MPX5100 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
File Size	394.62K / 12 Page	View it Online	Download Datasheet

				NICHIA CORPORATION Electronic Theatre Controls, Inc. ETC[ETC] List of Unclassifed Manufacturers
Part No.	NSPW300 NSPW300BS
OCR Text	...uld be paid during soldering. * Solder the LED no closer than 3mm from the base of the epoxy bulb. Soldering beyond the base of the tie bar ...bond failure or resin deterioration, will occur. Nichia's LEDs should not be soldered directly to do...
Description	NICHIA WHITE LED
File Size	329.17K / 15 Page	View it Online	Download Datasheet

				NICHIA CORPORATION ETC[ETC] List of Unclassifed Manufacturers
Part No.	NSPW310BS
OCR Text	...uld be paid during soldering. * Solder the LED no closer than 3mm from the base of the epoxy bulb. Soldering beyond the base of the tie bar ...bond failure or resin deterioration, will occur. Nichia's LEDs should not be soldered directly to do...
Description	SPECIFICATION FOR NICHIA WHITE LED
File Size	320.49K / 15 Page	View it Online	Download Datasheet

				NICHIA CORPORATION List of Unclassifed Manufacturers ETC[ETC] Electronic Theatre Controls, Inc.
Part No.	NSPW500BS
OCR Text	...uld be paid during soldering. * Solder the LED no closer than 3mm from the base of the epoxy bulb. Soldering beyond the base of the tie bar ...bond failure or resin deterioration, will occur. Nichia's LEDs should not be soldered directly to do...
Description	SPECIFICATION FOR NICHIA WHITE LED
File Size	409.00K / 15 Page	View it Online	Download Datasheet

				IXYS[IXYS Corporation]
Part No.	IXUC120N10
OCR Text	...4 V ns Note: All terminals are solder plated. 1 - Gate 2 - Drain 3 - Source IF = 75 A, di/dt = -200 A/s, VDS = 30 V Note: 1. MOSFET chip capability 2. Intrinsic diode capability 3. Pulse test, t 300 s, duty cycle d 2 % IXYS rese...
Description	Trench Power MOSFET ISOPLUS220
File Size	55.54K / 2 Page	View it Online	Download Datasheet

For solder-bond Found Datasheets File :: 1939 Search Time::3.578ms
Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |