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Renesas
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Part No. |
HSM2836C
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OCR Text |
...s ? fast recovery time. ? mpak package is suitable for high density surface mounting and high speed assembly. ordering information type no. laser mark package code hsm2836c a4 mpak pin arrangement 1. cathode 2. cathode 3. ... |
Description |
Diodes>Switching
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File Size |
77.70K /
7 Page |
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it Online |
Download Datasheet
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Renesas
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Part No. |
HSM223C
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OCR Text |
.... ? fast recovery time. ? mpak package is suitable for high density surface mounting and high speed assembly. ordering information type no. laser mark package code hsm223c a8 mpak pin arrangement 21 3 1. nc 2. cathode 3. a... |
Description |
Diodes>Switching
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File Size |
76.53K /
7 Page |
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it Online |
Download Datasheet
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Hitachi,Ltd.
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Part No. |
HVM306
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OCR Text |
...eries resistance. low cost. mpak package is suitable for high density surface mounting and high speed assembly. ordering information type no. laser mark package code hvm306 t9 mpak pin arrangement 1 anode
2 anode
3 cathode (top vie... |
Description |
Silicon Epitaxial Planar Diode for Lowpass Circuit(低通电路的平面外延二极
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File Size |
31.35K /
5 Page |
View
it Online |
Download Datasheet
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Price and Availability
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