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  metalized Datasheet PDF File

For metalized Found Datasheets File :: 599    Search Time::1.172ms    
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    IRF[International Rectifier]
Part No. IRF6631
OCR Text ... footprint full size board with metalized back and with small clip heatsink. Notes: TC measured with thermocouple incontact with top (Drain) of part. R is measured at TJ of approximately 90C. Surface mounted on 1 in. square Cu boa...
Description DirectFET Power MOSFET

File Size 238.38K  /  9 Page

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    IRF6645

IRF[International Rectifier]
Part No. IRF6645
OCR Text ... footprint full size board with metalized back and with small clip heatsink. Notes: TC measured with thermocouple incontact with top (Drain) of part. R is measured at TJ of approximately 90C. Surface mounted on 1 in. square Cu boa...
Description    DirectFET Power MOSFET Typical calues (unless otherwise specified)

File Size 240.48K  /  9 Page

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    AFP630V105K AFP630V154K AFP630V155K AFP630V224K AFP630V225K AFP450V684K AFP450V104K AFP450V104K-14 AFP450V105K AFP450V15

Okaya Electric America, Inc.
Okaya Electric America, Inc...
Okaya Electric America,...
Part No. AFP630V105K AFP630V154K AFP630V155K AFP630V224K AFP630V225K AFP450V684K AFP450V104K AFP450V104K-14 AFP450V105K AFP450V154K AFP450V224K AFP450V225K AFP450V155K AFP450V334K AFP450V474K
OCR Text ...30v105k afp630v155k afp630v225k metalized polypropylene film capacitor rated voltage capacitance tolerance of capacitance 31 afp series pfc capacitor metalized polypropylene film capacitor 0.1 f 0.22 f 0.33 f 0.47 f 1.0 f 1.5 f 2...
Description PFC CAPACITOR

File Size 75.79K  /  2 Page

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    PDI-E838

Advanced Photonix, Inc.
Part No. PDI-E838
OCR Text ...] .060 [1.52] C L WIRE BONDS metalized CERAMIC .250 [6.35] ENCAPSOLATE CONTACT B CONTACT A metalized Ceramic Package FEATURES * Low Cost * 660 nm +/- 3nm * 2 drive line DESCRIPTION The PDI-E838 is a two drive line dua...
Description GaAlAs High power IR LED Emitters

File Size 75.80K  /  1 Page

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    IRF6621

IRF[International Rectifier]
Part No. IRF6621
OCR Text ... footprint full size board with metalized back and with small clip heatsink. Notes: TC measured with thermocouple incontact with top (Drain) of part. R is measured at TJ of approximately 90C. Surface mounted on 1 in. square Cu (st...
Description The IRF6621 combines the latest HEXFET Power MOSFET Silicon technology with the advanced DirectFET packaging to achieve the lowest on-state resistance

File Size 249.06K  /  9 Page

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    PDI-E837

Advanced Photonix, Inc.
Part No. PDI-E837
OCR Text ... [5.71] CLEAR ENCAPSULATE metalized CERAMIC SUBSTRATE 3X SOLDER PAD CONTACT C CONTACT B CONTACT A metalized Ceramic Package FEATURES * Low Cost * 660 nm +/- 3nm * 3 drive line DESCRIPTION The PDI-E837 is a three drive li...
Description GaAlAs High power IR LED Emitters (660nm/880nm)

File Size 74.45K  /  1 Page

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    PDI-E835

Advanced Photonix, Inc.
Part No. PDI-E835
OCR Text ... [5.71] CLEAR ENCAPSULATE metalized CERAMIC SUBSTRATE 3X SOLDER PAD CONTACT C CONTACT B CONTACT A metalized Ceramic Package FEATURES * Low Cost * 660 nm +/- 3nm * 3 drive line DESCRIPTION The PDI-E835 is a three drive li...
Description GaAlAs High power IR LED Emitters (660nm/940nm)

File Size 74.28K  /  1 Page

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    IRF6610

IRF[International Rectifier]
Part No. IRF6610
OCR Text ... footprint full size board with metalized back and with small clip heatsink. TC measured with thermocouple incontact with top (Drain) of part. R is measured at TJ of approximately 90C. Surface mounted on 1 in. square Cu board (still air)...
Description HEXFET Power MOSFET Silicon Technology with the advanced DirectFETTM

File Size 234.19K  /  9 Page

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    PDI-E833

Advanced Photonix, Inc.
Part No. PDI-E833
OCR Text ...] .060 [1.52] C L WIRE BONDS metalized CERAMIC .250 [6.35] ENCAPSOLATE CONTACT B CONTACT A metalized Ceramic Package FEATURES * Low Cost * 660 nm +/- 3nm * 2 drive line DESCRIPTION The PDI-E833 is a two drive line dua...
Description GaAlAs High power IR LED Emitters (660nm/940nm)

File Size 75.77K  /  1 Page

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    5962F0151601QXA 5962F0151601QXC 5962F0151601QXX 5962F0151601QYA 5962F0151601QYX 5962F0151601QYC 5962F0151601VXA 5962F015

Aeroflex Circuit Technology
Part No. 5962F0151601QXA 5962F0151601QXC 5962F0151601QXX 5962F0151601QYA 5962F0151601QYX 5962F0151601QYC 5962F0151601VXA 5962F0151601VXX 5962F0151601VXC 5962F0151601VYA 5962F0151601VYC 5962G0151601QXA 5962F0151601VYX 5962G0151601QXC 5962G0151601QXX 5962G0151601QYA 5962G0151601QYC 5962G0151601QYX 5962G0151601VXA 5962G0151601VXC 5962G0151601VXX 5962G0151601VYA 5962G0151601VYC 5962G0151601VYX 5962H0151601QXA 5962H0151601QXC 5962H0151601QXX 5962H0151601QYA 5962H0151601QYC 5962H0151601QYX 5962R0151601QXA 5962R0151601QXC 5962R0151601QXX 5962R0151601QYA 5962R0151601QYC 5962R0151601QYX 5962R0151601VXA 5962H0151601VXA 5962H0151601VXX 5962H0151601VYA 5962H0151601VYC 5962H0151601VXC 5962R0151601VXC 5962R0151601VXX
OCR Text ...ically isolated. 2. all exposed metalized areas to be plated per mil-prf-38535. 3. ceramic to be opaque. 4. dimension letters refer to mil-std-1835. 5. total weight is approximately 5.0 grams. d 1.400 0.020 pin no. 1 id. s1 0.005 min...
Description Radiation-hardenet 8K x 8 PROM: SMD. 55ns access time, CMOS compatible inputs and CMOS compapible outputs. Class Q. Lead finish solder. Total dose 3E5 rads(Si).
Radiation-hardenet 8K x 8 PROM: SMD. 55ns access time, CMOS compatible inputs and CMOS compapible outputs. Class Q. Lead finish gold. Total dose 3E5 rads(Si).
Radiation-hardenet 8K x 8 PROM: SMD. 55ns access time, CMOS compatible inputs and CMOS compapible outputs. Class Q. Lead finish optional. Total dose 3E5 rads(Si).
Radiation-hardenet 8K x 8 PROM: SMD. 55ns access time, CMOS compatible inputs and CMOS compapible outputs. Class V. Lead finish solder. Total dose 3E5 rads(Si).
Radiation-hardenet 8K x 8 PROM: SMD. 55ns access time, CMOS compatible inputs and CMOS compapible outputs. Class V. Lead finish optional. Total dose 3E5 rads(Si).
Radiation-hardenet 8K x 8 PROM: SMD. 55ns access time, CMOS compatible inputs and CMOS compapible outputs. Class V. Lead finish gold. Total dose 3E5 rads(Si).
Radiation-hardenet 8K x 8 PROM: SMD. 55ns access time, CMOS compatible inputs and CMOS compapible outputs. Class Q. Lead finish solder. Total dose 5E5 rads(Si).
Radiation-hardenet 8K x 8 PROM: SMD. 55ns access time, CMOS compatible inputs and CMOS compapible outputs. Class Q. Lead finish gold. Total dose 5E5 rads(Si).
Radiation-hardenet 8K x 8 PROM: SMD. 55ns access time, CMOS compatible inputs and CMOS compapible outputs. Class Q. Lead finish optional. Total dose 5E5 rads(Si).
Radiation-hardenet 8K x 8 PROM: SMD. 55ns access time, CMOS compatible inputs and CMOS compapible outputs. Class V. Lead finish solder. Total dose 5E5 rads(Si).
Radiation-hardenet 8K x 8 PROM: SMD. 55ns access time, CMOS compatible inputs and CMOS compapible outputs. Class V. Lead finish gold. Total dose 5E5 rads(Si).
Radiation-hardenet 8K x 8 PROM: SMD. 55ns access time, CMOS compatible inputs and CMOS compapible outputs. Class V. Lead finish optional. Total dose 5E5 rads(Si).
Radiation-hardenet 8K x 8 PROM: SMD. 55ns access time, CMOS compatible inputs and CMOS compapible outputs. Class Q. Lead finish solder. Total dose 1E6 rads(Si).
Radiation-hardenet 8K x 8 PROM: SMD. 55ns access time, CMOS compatible inputs and CMOS compapible outputs. Class Q. Lead finish gold. Total dose 1E6 rads(Si).
Radiation-hardenet 8K x 8 PROM: SMD. 55ns access time, CMOS compatible inputs and CMOS compapible outputs. Class Q. Lead finish optional. Total dose 1E6 rads(Si).
Radiation-hardenet 8K x 8 PROM: SMD. 55ns access time, CMOS compatible inputs and CMOS compapible outputs. Class Q. Lead finish solder. Total dose 1E5 rads(Si).
Radiation-hardenet 8K x 8 PROM: SMD. 55ns access time, CMOS compatible inputs and CMOS compapible outputs. Class Q. Lead finish gold. Total dose 1E5 rads(Si).
Radiation-hardenet 8K x 8 PROM: SMD. 55ns access time, CMOS compatible inputs and CMOS compapible outputs. Class Q. Lead finish optional. Total dose 1E5 rads(Si).
Radiation-hardenet 8K x 8 PROM: SMD. 55ns access time, CMOS compatible inputs and CMOS compapible outputs. Class V. Lead finish solder. Total dose 1E5 rads(Si).
Radiation-hardenet 8K x 8 PROM: SMD. 55ns access time, CMOS compatible inputs and CMOS compapible outputs. Class V. Lead finish solder. Total dose 1E6 rads(Si).
Radiation-hardenet 8K x 8 PROM: SMD. 55ns access time, CMOS compatible inputs and CMOS compapible outputs. Class V. Lead finish optional. Total dose 1E6 rads(Si).
Radiation-hardenet 8K x 8 PROM: SMD. 55ns access time, CMOS compatible inputs and CMOS compapible outputs. Class V. Lead finish gold. Total dose 1E6 rads(Si).
Radiation-hardenet 8K x 8 PROM: SMD. 55ns access time, CMOS compatible inputs and CMOS compapible outputs. Class V. Lead finish gold. Total dose 1E5 rads(Si).
Radiation-hardenet 8K x 8 PROM: SMD. 55ns access time, CMOS compatible inputs and CMOS compapible outputs. Class V. Lead finish optional. Total dose 1E5 rads(Si).

File Size 78.31K  /  11 Page

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For metalized Found Datasheets File :: 599    Search Time::1.172ms    
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