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CSE32E5 SDUR1030 KSB810 VS3244QX CPH5702 PE3736LF 1N2109 F16C40PT
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  EPC-1300-022-4 Datasheet PDF File

For EPC-1300-022-4 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    EPC-1300-0.5-2

EPIGAP optoelectronic GmbH
Part No. EPC-1300-0.5-2
Description Photodiode-Chip
File Size 122.90K  /  2 Page

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Toshiba Electronic Devices & Storage Corporation
Part No. XPN1300ANC
Description N-ch MOSFET, 100 V, 30 A, 0.0133 Ω@10V, TSON Advance(WF)
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    EPC-1300-3.0-4

EPIGAP optoelectronic GmbH
Part No. EPC-1300-3.0-4
Description Photodiode-Chip
File Size 122.13K  /  2 Page

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Amphenol Communications Solutions
Part No. 54112-109401300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    EPC-1300-3.0-3

EPIGAP optoelectronic GmbH
Part No. EPC-1300-3.0-3
Description Photodiode-Chip
File Size 119.90K  /  2 Page

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Amphenol Communications Solutions
Part No. 54121-407061300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    EPC-1300-3.0-2

EPIGAP optoelectronic GmbH
Part No. EPC-1300-3.0-2
Description Photodiode-Chip
File Size 122.22K  /  2 Page

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Amphenol Communications Solutions
Part No. 54112-107241300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 24 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    EPC-1300-3.0-1

EPIGAP optoelectronic GmbH
Part No. EPC-1300-3.0-1
Description Photodiode-Chip
File Size 121.01K  /  2 Page

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Amphenol Communications Solutions
Part No. 54121-112041300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    EPC-1300-1.0-4

EPIGAP optoelectronic GmbH
Part No. EPC-1300-1.0-4
Description Photodiode-Chip
File Size 122.52K  /  2 Page

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Amphenol Communications Solutions
Part No. 54121-112071300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 7 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    EPC-1300-1.0-3

EPIGAP optoelectronic GmbH
Part No. EPC-1300-1.0-3
Description Photodiode-Chip
File Size 121.29K  /  2 Page

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Amphenol Communications Solutions
Part No. 54242-106301300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    EPC-1300-1.0-2

EPIGAP optoelectronic GmbH
Part No. EPC-1300-1.0-2
Description Photodiode-Chip
File Size 122.56K  /  2 Page

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Amphenol Communications Solutions
Part No. 69913-002
Description 1x4 PCB Header, Low Profile Right Angle, 3.81mm (0.15inch) Solder tail, Off White
Tech specs 　 　

Official Product Page

    EPC-1300-1.0-1 EPC-1.00-1.0-1

EPIGAP optoelectronic GmbH
Part No. EPC-1300-1.0-1 EPC-1.00-1.0-1
Description Photodiode-Chip
File Size 119.99K  /  2 Page

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Amphenol Communications Solutions
Part No. 67013-005LF
Description Berg Duflex Housing, single row, 5 Position.
Tech specs 　 　

Official Product Page

    EPC-1300-1.0-0 EPC-13.0-1.0-0

EPIGAP optoelectronic GmbH
Part No. EPC-1300-1.0-0 EPC-13.0-1.0-0
Description Photodiode-Chip
File Size 120.43K  /  2 Page

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Amphenol Communications Solutions
Part No. 67013-007LF
Description Berg Duflex Housing, single row, 7 Position.
Tech specs 　 　

Official Product Page

For EPC-1300-022-4 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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