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  DIP14-20130 Datasheet PDF File

For DIP14-20130 Found Datasheets File :: 53+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 |   

    ENGINEERED COMPONENTS CO
Part No. DIP14-1020 DIP14-20130 DIP14-50130
Description PASSIVE DELAY LINE, TRUE OUTPUT, DIP14

File Size 302.37K  /  4 Page

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Amphenol Communications Solutions

Part No. L17H1120130
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=15.88mm (0.625in), 9/9 (Pin/Socket), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Saga
Part No. DIP14
Description DIP-14

File Size 79.00K  /  1 Page

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Amphenol Communications Solutions

Part No. 54242-106201300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    201302B

Integrated Technology Future
Part No. 201302B
Description SAW Bandpass Filter

File Size 180.22K  /  5 Page

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Amphenol Communications Solutions

Part No. L17H2220130
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 9/9 (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
Tech specs    

Official Product Page

    ERICSSON[Ericsson]
Part No. PGT20130
Description 1510 nm DFB Laser for Supervisory Channel Applications

File Size 827.55K  /  4 Page

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Amphenol Communications Solutions

Part No. L17H2120130
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (.750in), 9/9 (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
Tech specs    

Official Product Page

    HU20130 HU20150

Microsemi Corporation
Part No. HU20130 HU20150
Description Ultrafast Recovery Modules

File Size 108.79K  /  2 Page

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Amphenol Communications Solutions

Part No. 68020-130HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    KSK-1A69-120130 KSK-1A69-120130DE

Meder Electronic
Part No. KSK-1A69-120130 KSK-1A69-120130DE
Description (deutsch) KSK Reed Switch
KSK Reed Switches

File Size 78.53K  /  1 Page

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Amphenol Communications Solutions

Part No. 54122-107201300LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    2SK201309

Toshiba Semiconductor
Part No. 2SK201309
Description Audio Frequency Power Amplifier Application

File Size 259.95K  /  4 Page

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Amphenol Communications Solutions

Part No. 54242-807201300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    2SK201306 2SK2013

Toshiba Semiconductor
Part No. 2SK201306 2SK2013
Description N CHANNEL MOS TYPE (AUDIO FREQUENCY POWER AMPLIFIER APPLICATION

File Size 403.18K  /  4 Page

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Amphenol Communications Solutions

Part No. 54111-807201300LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    2-2013022-1 1652263 2-2013022-2 2-2013022-3

Tyco Electronics
Part No. 2-2013022-1 1652263 2-2013022-2 2-2013022-3
Description DDR3 SODIMM SOCKET 0.6MM PITCH 204POS 4MM HEIGHT STANDARD TYPE

File Size 465.20K  /  6 Page

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Amphenol Communications Solutions

Part No. 54122-807201300LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    Microsemi
Part No. HU20150 HU20140 HU20130
Description Ultra Fast Rectifier (less than 100ns)

File Size 121.99K  /  2 Page

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For DIP14-20130 Found Datasheets File :: 53+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 |   

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