cu-leadframe pdf Datasheet P1 Full Text Search --- IC-ON-LINE


	Part Number	Hot Search : PT26B3 1102G VTX5783E RFZ34 FSP431 BR10H CM338 CCN1002
	Product Description
	Full Text Search

cu-leadframe Datasheet PDF File

For cu-leadframe Found Datasheets File :: 1213 Search Time::1.391ms
Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

				FAIRCHILD[Fairchild Semiconductor]
Part No.	FAN8741MTFNBSP FAN8741GNBSP FAN8741NBSP FAN8741 FAN8742MTFX FAN8741G FAN8741GX FAN8741MTF FAN8741MTFX FAN8742G FAN8742GX FAN8742MTF
OCR Text	.../ STD(JESD 51-2) Power plane(Cu) PCB(glass-epoxy) GND plane(Cu) soldering Pd=1.6 W Pd=3.2 W 56-TSSOP-EP, Case 3 soldering GND plane(Cu) VIA hole Power plane(Cu) Pd=4.1 W 56-SSOP-HS, Case 1 56-SSOP-HS, Case 2 Po...
Description	From old datasheet system Spindle Motor and 6-CH Driver
File Size	539.81K / 23 Page	View it Online	Download Datasheet

				Amkor Technology
Part No.	TSON8-FL
OCR Text	...p capability ? interconnect: cu clips technology for better electrical and thermal performance. also available on al strap + wire opt...leadframe: bare copper ? die attach: solder paste* ? interconnect: 2 option, C dual cu c...
Description	Bare copper leadframe with no plating
File Size	729.20K / 2 Page	View it Online	Download Datasheet

				Amkor Technology
Part No.	MQFPPOWERQUAD2
OCR Text	...k/TNR Die Attach Adhesive Cu Leadframe Die Cu Heat Slug Polyimide Nickel Plated Black Oxide Black Oxide Test Services * Program generation/conversion * Product engineering * Wafer sort * Contact Amkor Test Services for ...
Description	Exceptional thermal and electrical performance by design include the following
File Size	90.38K / 2 Page	View it Online	Download Datasheet

				Sanken electric
Part No.	LC5523F LC5500 LC5511D LC5521D LC5525F LC5523D
OCR Text	...rol number leadframe material cu pin treatment: solder plating weight approximately 0.51g unit mm pb-free. device composition compliant with the rohs directive. 6 sanken electric co., ltd. lc5500-an, rev.1.2 b a lc 5.6 ...
Description	LC5500 Series Single-Stage Power Factor Corrected Off-Line Switching Regulators Hybrid IC
File Size	650.31K / 40 Page	View it Online	Download Datasheet

				Littelfuse
Part No.	SPHV12-01KTG-C SPHV24-01KTG-C
OCR Text	...30 tl p vo lt ag e (v ) tl p cu rre nt (a ) sphv12-c transmission line pulsing(tlp) plot 0 2 4 6 8 10 12 14 16 18 20 05 10 15 20 25 30 3...leadframe b2 10000 sphv15-01ktg-c b5 sphv24-01ktg-c b4 sphv36-01ktg-c b6 part numbering system part...
Description	200W Discrete Bidirectional TVS Diode
File Size	989.49K / 6 Page	View it Online	Download Datasheet

				Amkor Technology
Part No.	SO8-FL
OCR Text	...p capability ? interconnect: cu clips technology for better electrical and thermal performance. also available on al strap + wire opt...leadframe: bare copper ? die attach: solder paste* ? interconnect: 2 option, C dual cu c...
Description	Interconnect - Cu clips technology for better electrical and thermal
File Size	733.46K / 2 Page	View it Online	Download Datasheet

				SGS Thomson Microelectronics
Part No.	AN1294
OCR Text	... consisting of the copper slug (cu/kfc) and the package leads is known as the leadframe (cu/cuprofor). the leadframes for a number of individual devices are manufactured in a single continuous strip to simplify handling and processing. afte...
Description	POWERSO-10RF: THE FIRST TRUE RF POWER SMD PACKAGE
File Size	177.82K / 12 Page	View it Online	Download Datasheet

				STMicroelectronics
Part No.	AN1294
OCR Text	... consisting of the copper slug (cu/kfc) and the package leads is known as the leadframe (cu/cuprofor). the leadframes for a number of individual devices are manufactured in a single continuous strip to simplify handling and processing. ...
Description	During the last years
File Size	1,006.33K / 20 Page	View it Online	Download Datasheet

				Sanken electric
Part No.	SARS05
OCR Text	...resin 2. chip: si 3. leadframe: cu with solder plating 4. interior leadframe: cu weight: approximately 0.072 g package outline package marking material composition and internal structure cathode index band as05 ymdd 1 2 4 3 3 4.5 0.2 ...
Description	High Efficiency Snubber Diode
File Size	172.82K / 7 Page	View it Online	Download Datasheet

				Amkor Technology
Part No.	POWERSOP
OCR Text	...nd rohs standards. features ? cu wire interconnect for low cost ? standard jedec package outlines ? multi-die production capability ? t...leadframe roughening for improved msl capability services and support amkor has a broad base of reso...
Description	Power Small Outline Package,PowerSOP
File Size	305.99K / 2 Page	View it Online	Download Datasheet

For cu-leadframe Found Datasheets File :: 1213 Search Time::1.391ms
Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |