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    MPX2200 MPX2200A MPX2200AP MPX2200AS MPX2200D MPX2200DP MPX2200GP MPX2200GS MPX2200GVP MPX2200GVS MPX2201DP MPX2201GP MP

Motorola Mobility Holdings, Inc.
Motorola, Inc.
MOTOROLA[Motorola Inc]
MOTOROLA[Motorola, Inc]
Part No. MPX2200 MPX2200A MPX2200AP MPX2200AS MPX2200D MPX2200DP MPX2200GP MPX2200GS MPX2200GVP MPX2200GVS MPX2201DP MPX2201GP MPX2201
OCR Text ...BOND LEAD FRAME Figure 4. Cross-Sectional Diagrams (Not to Scale) Figure 4 illustrates an absolute sensing die (right) and the differential or gauge die in the basic chip carrier (Case 344-15). A silicone gel isolates the die surfa...
Description 0 to 200 kPa (0 to 29 psi) 40 mV FULL SCALE SPAN (TYPICAL) 000千帕29 PSI)的全尺寸为40 mV跨度(典型)
0 to 200 kPa (0 to 29 psi) 40 mV FULL SCALE SPAN (TYPICAL) 000千帕9 PSI)的全尺寸为40 mV跨度(典型)
(MPX2200 / MPX2201) 0 to 200 kPa (0 to 29 psi) 40 mV FULL SCALE SPAN (TYPICAL)

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    MPX2700 MPX2700D MPX2700DP MPX2700GP MPX2700GS MPX2700GSX MPX2700GVP MPX2700GVS MPX2700GVSX

Motorola Mobility Holdings, Inc.
Motorola, Inc.
MOTOROLA[Motorola, Inc]
Part No. MPX2700 MPX2700D MPX2700DP MPX2700GP MPX2700GS MPX2700GSX MPX2700GVP MPX2700GVS MPX2700GVSX
OCR Text ...ssure Differential Figure 4. Cross-Section of Differential Pressure Sensor Die in Its Basic Package (Not to Scale) Figure 4 shows the cross section of the Motorola MPX pressure sensor die in the chip carrier package. A silicone gel is...
Description 0 to 700 kPa (0 to 100 psi) 40 mV FULL SCALE SPAN (TYPICAL) GAGE, PEIZORESISTIVE PRESSURE SENSOR, 0-101.52Psi, 0.5%, 0-40mV, ROUND, THROUGH HOLE MOUNT

File Size 187.83K  /  10 Page

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    MPX5050 MPX5050D MPX5050DP MPX5050GP MPX5050GS MPX5050GSX MPX5050GVP MPX5050GVS MPX5050GVSX

Motorola, Inc.
MOTOROLA[Motorola, Inc]
Part No. MPX5050 MPX5050D MPX5050DP MPX5050GP MPX5050GS MPX5050GSX MPX5050GVP MPX5050GVS MPX5050GVSX
OCR Text ...CESSOR DIE BOND Figure 3. Cross-Sectional Diagram (Not to Scale) Figure 4. Typical Decoupling Filter for Sensor to Microprocessor Interface 3 MPX5050 SERIES Transfer Function Nominal Transfer Value: Vout = VS (P x 0.018 + 0...
Description OPERATING OVERVIEW INTEGRATED PRESSURE SENSOR 0 to 50 kPa (0 to 7.25 psi) 0.2 to 4.7 Volts Output

File Size 186.91K  /  10 Page

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    MPX7100 MPX7100A MPX7100AP MPX7100AS MPX7100ASX MPX7100D MPX7100DP MPX7100GP MPX7100GS MPX7100GSX MPX7100GVP MPX7100GVS

Motorola, Inc.
MOTOROLA[Motorola, Inc]
Part No. MPX7100 MPX7100A MPX7100AP MPX7100AS MPX7100ASX MPX7100D MPX7100DP MPX7100GP MPX7100GS MPX7100GSX MPX7100GVP MPX7100GVS MPX7100GVSX
OCR Text ...BOND LEAD FRAME Figure 4. Cross-Sectional Diagrams (Not to Scale) Figure 4 illustrates the absolute sensing configuration (right) and the differential or gauge configuration in the basic chip carrier (Case 344-15). A silicone gel i...
Description 0 to 100 kPa (0 to 14.5 psi) 40 mV FULL SCALE SPAN (TYPICAL)

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    MPX53D MPX53DP MPXV53GC7U MPX53 MPX53GP MPXV53GC MPXV53GC6T1 MPXV53GC6U

Motorola, Inc.
MOTOROLA[Motorola, Inc]
Part No. MPX53D MPX53DP MPXV53GC7U MPX53 MPX53GP MPXV53GC MPXV53GC6T1 MPXV53GC6U
OCR Text ... DIE LEAD FRAME Figure 4. Cross-Sectional Diagram (not to scale) Figure 4 illustrates the differential or gauge configuration in the unibody chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the envi...
Description 50 KPA UNCOMPENSATED SILICON PRESSURE SENSORS
From old datasheet system

File Size 144.58K  /  8 Page

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    MPX50GP MPX50GVS MPX50GVSX MPX50 MPX50D MPX50DP MPX50GS MPX50GSX MPX50GVP

Motorola Mobility Holdings, Inc.
Motorola, Inc.
MOTOROLA[Motorola Inc]
MOTOROLA[Motorola, Inc]
Part No. MPX50GP MPX50GVS MPX50GVSX MPX50 MPX50D MPX50DP MPX50GS MPX50GSX MPX50GVP
OCR Text ...CASE LEAD FRAME Figure 4. Cross-Sectional Diagram (not to scale) Figure 4 illustrates the differential or gauge configuration in the basic chip carrier (Case 344-15). A silicone gel isolates the die surface and wire bonds from the env...
Description 0 to 50 kPa (0-7.25 psi) 60 mV FULL SCALE SPAN (TYPICAL) 00千帕-7.25 PSI)的60压全尺寸跨度(典型)
Uncompensated Silicon Pressure Sensors
16 MEGABIT 3.3 VOLT SERIAL CONFIGURATION - NOT RECOMMENDED for NEW DESIGN

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    MPX200 MPX200A MPX200AP MPX200AS

Motorola, Inc
Part No. MPX200 MPX200A MPX200AP MPX200AS
OCR Text ...BOND LEAD FRAME Figure 4. Cross-Sectional Diagrams (Not to Scale) Figure 4 illustrates the absolute sensing configuration (right) and the differential or gauge configuration in the basic chip carrier (Case 344-15). A silicone gel isol...
Description 0 to 200 kPa (0-29 psi) 60 mV FULL SCALE SPAN (TYPICAL)

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    Motorola
Part No. MPX4080D
OCR Text ...LEMENT DIE BOND Figure 3. Cross-Sectional Diagrams (Not to Scale) than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your app...
Description MPX4080D Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned,Temperature Compensated and Calibrated

File Size 74.67K  /  8 Page

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    MPX7200 MPX7200A MPX7200AP MPX7200AS MPX7200ASX MPX7200D MPX7200DP MPX7200GSX MPX7200GVP MPX7200GVS MPX7200GVSX

Motorola Mobility Holdings, Inc.
Motorola, Inc.
MOTOROLA[Motorola Inc]
MOTOROLA[Motorola, Inc]
Part No. MPX7200 MPX7200A MPX7200AP MPX7200AS MPX7200ASX MPX7200D MPX7200DP MPX7200GSX MPX7200GVP MPX7200GVS MPX7200GVSX
OCR Text ...BOND LEAD FRAME Figure 4. Cross-Sectional Diagrams (Not to Scale) Figure 4 illustrates the absolute sensing configuration (right) and the differential or gauge configuration in the basic chip carrier (Case 344-15). A silicone gel i...
Description 0 to 200 kPa (0 to 29 psi) 40 mV FULL SCALE SPAN (TYPICAL) 000千帕9 PSI)的全尺寸为40 mV跨度(典型)

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