CM600HG-130H pdf Datasheet P1 Part Num --- IC-ON-LINE


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CM600HG-130H Datasheet PDF File

For CM600HG-130H Found Datasheets File :: 86+ Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 |

					Mitsubishi Electric Semiconductor
Part No.	CM600HG-130H
Description	HIGH POWER SWITCHING USE INSULATED TYPE
File Size	103.84K / 8 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	87185-130HLF
Description	BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Powerex Power Semiconductor...
Part No.	CM600HG-130H
Description	Single IGBTMOD HVIGBT Module 600 Amperes/6500 Volts
File Size	314.08K / 5 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	78207-130HLF
Description	PV Shrouded Header, Wire to Board connector, 2 Wall Shrouded Header - Through Hole - Double row - 30 Positions 2.54mm - Right Angle.
Tech specs				Official Product Page

					Mitsubishi Electric Semiconductor
Part No.	CM600HG-90H
Description	HVIGBT MODULES HIGH POWER SWITCHING USE INSULATED TYPE
File Size	94.67K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68771-130HLF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs				Official Product Page

					SEMPO ELECTRONIC Limited
Part No.	SMTT-130H-12 SMTT-130H-14 SMTT-130H-16 SMTT-130H-18 SMTT-130H-08 SMTT-130H SMTT-130H-20 SMTT-130H-22 SMTT-130H-24
Description	THYRISTOR-THYRISTOR MODULE
File Size	41.82K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68602-130HLF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs				Official Product Page

					SEMPO ELECTRONIC Limited
Part No.	SMDT-130H-12 SMDT-130H-14 SMDT-130H-16 SMDT-130H-18 SMDT-130H-08 SMDT-130H SMDT-130H-20 SMDT-130H-22 SMDT-130H-24
Description	Diode-Thyristor Module
File Size	41.53K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68031-130HLF
Description	BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail.
Tech specs				Official Product Page

					SEMPO ELECTRONIC Limited
Part No.	SMDD-130H-12 SMDD-130H-14 SMDD-130H-16 SMDD-130H-18 SMDD-130H-08 SMDD-130H SMDD-130H-20 SMDD-130H-22 SMDD-130H-24
Description	DIODE-DIODE MODULE
File Size	40.68K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68459-130HLF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Double Row, 30 Positions, 2.54mm (0.100in)Pitch.
Tech specs				Official Product Page

					E-SWITCH
Part No.	KO130H-A126
Description	KEYLOCK SWITCHES
File Size	36.23K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68764-130HLF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Single Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Mitsubishi Electric Semiconductor
Part No.	CM200HG-130H
Description	HVIGBT MODULES HIGH POWER SWITCHING USE INSULATED TYPE
File Size	97.85K / 8 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	93944-130HLF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Powerex Power Semiconductor...
Part No.	CM200HG-130H
Description	Single IGBTMOD HVIGBT Module 200 Amperes/6500 Volts
File Size	216.58K / 5 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68458-130HLF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Single Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					SICK AG
Part No.	WSE4S-3F3130H
Description	Through-beam photoelectric sensor
File Size	922.96K / 5 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68033-130HLF
Description	BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
Tech specs				Official Product Page

For CM600HG-130H Found Datasheets File :: 86+ Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 |

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