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  90143-0112 Datasheet PDF File

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    0901430112 90143-0112

Molex Electronics Ltd.
Part No. 0901430112 90143-0112
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 4 Polarizing Buttons, 12 Circuits
2.54mm (.100) Pitch C-Grid III垄芒 Modular Crimp Housing, Dual Row, 4 Polarizing Buttons, 12 Circuits
File Size 250.46K  /  2 Page

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Rochester Electronics LLC
Part No. BLA1011-2
Description Avionics LDMOS transistor
Tech specs 　 　

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HUA FENG CIRCUIT





    90143-0014

Molex Electronics Ltd.
Part No. 90143-0014
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 14 Circuits
File Size 250.10K  /  2 Page

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Amphenol Communications Solutions
Part No. 87901-434HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

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    90143-0026

Molex Electronics Ltd.
Part No. 90143-0026
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 26 Circuits
File Size 250.36K  /  2 Page

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Amphenol Communications Solutions
Part No. 87901-438HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

Official Product Page

    90143-0020

Molex Electronics Ltd.
Part No. 90143-0020
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 20 Circuits
File Size 250.10K  /  2 Page

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Amphenol Communications Solutions
Part No. 87901-436HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 36 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

Official Product Page

    90143-0022

Molex Electronics Ltd.
Part No. 90143-0022
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 22 Circuits
File Size 250.36K  /  2 Page

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Amphenol Communications Solutions
Part No. GSD090143HR
Description Sd Card Connector, Push-push Type, 9 Position.
Tech specs 　 　

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    90143-0012

Molex Electronics Ltd.
Part No. 90143-0012
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 12 Circuits
File Size 250.10K  /  2 Page

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Amphenol Communications Solutions
Part No. 87901-430
Description BERGSTIK II .100CC DR-STRAIGHT
Tech specs 　 　

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    90143-0024

Molex Electronics Ltd.
Part No. 90143-0024
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 24 Circuits
File Size 250.36K  /  2 Page

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Amphenol Communications Solutions
Part No. 87901-432HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

Official Product Page

    90143-0064

Molex Electronics Ltd.
Part No. 90143-0064
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 64 Circuits
File Size 250.24K  /  2 Page

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Amphenol Communications Solutions
Part No. G832MC011201122HR
Description 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 3.7 mm, 120 Positions, Dual Row, BTB Vertical Receptacle SMT, 15u\\ Gold Black.
Tech specs 　 　

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    90143-0060

Molex Electronics Ltd.
Part No. 90143-0060
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 60 Circuits
File Size 250.24K  /  2 Page

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Amphenol Communications Solutions
Part No. 10112690-F01-12ULF
Description Minitek® 2.00mm, Board to Board, Unshrouded Right Angle Header, Surface Mount, Double Row, 24 Position, 2.00mm (0.079in) Pitch.
Tech specs 　 　

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    90143-0008

Molex Electronics Ltd.
Part No. 90143-0008
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 8 Circuits
File Size 250.10K  /  2 Page

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Amphenol Communications Solutions
Part No. 10112690-T01-12ULF
Description Header, Surface Mount, Double row, 24, 2mm (0.079in), Right Angle
Tech specs 　 　

Official Product Page

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