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  90143-0024 Datasheet PDF File

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    90143-0024

Molex Electronics Ltd.
Part No. 90143-0024
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 24 Circuits
File Size 250.36K  /  2 Page

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Texas Instruments
Part No. LMH0024MAE/NOPB
Description LMH0024 3.3V SMPTE 259M / 344M Adaptive Cable Equalizer 16-SOIC -40 to 85
Tech specs 　 　

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HUA FENG CIRCUIT





    90143-0014

Molex Electronics Ltd.
Part No. 90143-0014
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 14 Circuits
File Size 250.10K  /  2 Page

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Texas Instruments
Part No. LMH0024MAX/NOPB
Description LMH0024 3.3V SMPTE 259M / 344M Adaptive Cable Equalizer 16-SOIC -40 to 85
Tech specs 　 　

Official Product Page

    90143-0008

Molex Electronics Ltd.
Part No. 90143-0008
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 8 Circuits
File Size 250.10K  /  2 Page

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Texas Instruments
Part No. LMH0024MA/NOPB
Description LMH0024 3.3V SMPTE 259M / 344M Adaptive Cable Equalizer 16-SOIC -40 to 85
Tech specs 　 　

Get Free Sample

Official Product Page

    90143-0020

Molex Electronics Ltd.
Part No. 90143-0020
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 20 Circuits
File Size 250.10K  /  2 Page

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Texas Instruments
Part No. TIC10024QDCPRQ1
Description Automotive 24-input multiple-switch detection with SPI 38-HTSSOP -40 to 125
Tech specs 　 　

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    90143-0022

Molex Electronics Ltd.
Part No. 90143-0022
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 22 Circuits
File Size 250.36K  /  2 Page

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Amphenol Communications Solutions
Part No. 87901-438HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

Official Product Page

    90143-0064

Molex Electronics Ltd.
Part No. 90143-0064
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 64 Circuits
File Size 250.24K  /  2 Page

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Amphenol Communications Solutions
Part No. 87901-430
Description BERGSTIK II .100CC DR-STRAIGHT
Tech specs 　 　

Official Product Page

    90143-0012

Molex Electronics Ltd.
Part No. 90143-0012
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 12 Circuits
File Size 250.10K  /  2 Page

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Amphenol Communications Solutions
Part No. 87901-432HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

Official Product Page

    90143-0060

Molex Electronics Ltd.
Part No. 90143-0060
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 60 Circuits
File Size 250.24K  /  2 Page

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Amphenol Communications Solutions
Part No. 87901-434HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

Official Product Page

    90143-0010

Molex Electronics Ltd.
Part No. 90143-0010
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 10 Circuits
File Size 250.10K  /  2 Page

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Amphenol Communications Solutions
Part No. 87901-436HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 36 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

Official Product Page

    90143-0056

Molex Electronics Ltd.
Part No. 90143-0056
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 56 Circuits
File Size 250.36K  /  2 Page

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Amphenol Communications Solutions
Part No. GSD090143HR
Description Sd Card Connector, Push-push Type, 9 Position.
Tech specs 　 　

Official Product Page

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