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Molex Electronics Ltd.
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| Part No. |
90130-3324
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| Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 24 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 24 Circuits, Black 0.76楼矛m (30楼矛) Gold (Au) Selective Plating
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| File Size |
168.61K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
68690-130HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
78290-130HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L17H2990130
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| Description |
Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 26/26 (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
90130-3326
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| Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 26 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 26 Circuits, Black 0.76楼矛m (30楼矛) Gold (Au) Selective Plating
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| File Size |
168.42K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
92090-130LF
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| Description |
Minitek® 2.00mm, Board to Board, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, Top Entry, 30 Positions, 2.00mm (0.079in) Pitch..
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10065490-130TRLF
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| Description |
Minitek® 2.00mm, Board To Board, Receptacle, Vertical, Surface Mount, Double Row, 30 Positions, 2.00mm (0.079in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
69190-130HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
73324-303LF
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| Description |
Dubox® 2.54mm, Wire to Board Connector, Shrouded Vertical Header, Press Fit, Single row, Top Entry, 3 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
G832MB110203324HR
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| Description |
Pitch 0.8mm, Height 5.7 mm, 20 Positions, Dual Row, BTB Vertical Plug SMT, 8u\\. Gold Black
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10136647-033241LF
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| Description |
Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, LCP, 15u\\ Gold (Tin on Tails) plating, Black Color, 3 Positions, Non GW Compatible, with Posts, Tray packing.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
65863-324LF
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| Description |
Quickie Header, Wire to Board Connector, Double Row, 34 Positions, 2.54 mm (0.1 in.), Vertical, Eject Latch Header 15u\\/0.38um min. Au/GXT Plating.
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Official Product Page
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Price and Availability
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