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  90130-1132 Datasheet PDF File

For 90130-1132 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    0901301132 90130-1132

Molex Electronics Ltd.
Part No. 0901301132 90130-1132
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 32 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.90K  /  7 Page

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Amphenol Communications Solutions

Part No. 68690-130HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    90130-3308

Molex Electronics Ltd.
Part No. 90130-3308
Description
File Size 168.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 92090-130LF
Description Minitek® 2.00mm, Board to Board, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, Top Entry, 30 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    90130-3324

Molex Electronics Ltd.
Part No. 90130-3324
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 24 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 24 Circuits, Black 0.76楼矛m (30楼矛) Gold (Au) Selective Plating

File Size 168.61K  /  4 Page

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Amphenol Communications Solutions

Part No. 10065490-130TRLF
Description Minitek® 2.00mm, Board To Board, Receptacle, Vertical, Surface Mount, Double Row, 30 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    90130-3108

Molex Electronics Ltd.
Part No. 90130-3108
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 8 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 168.35K  /  4 Page

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Amphenol Communications Solutions

Part No. 78290-130HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

    90130-3210

Molex Electronics Ltd.
Part No. 90130-3210
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 10 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating

File Size 168.44K  /  4 Page

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Amphenol Communications Solutions

Part No. L17H2990130
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 26/26 (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
Tech specs    

Official Product Page

    90130-3106

Molex Electronics Ltd.
Part No. 90130-3106
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 6 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 168.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 69190-130HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90130-3216

Molex Electronics Ltd.
Part No. 90130-3216
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 16 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating

File Size 168.45K  /  4 Page

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Texas Instruments

Part No. MSP430F1132IDW
Description 16-bit Ultra-Low-Power Microcontroller, 8kB Flash, 256B RAM, 10 bit ADC 20-SOIC -40 to 85
Tech specs    

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Official Product Page

    90130-3326

Molex Electronics Ltd.
Part No. 90130-3326
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 26 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 26 Circuits, Black 0.76楼矛m (30楼矛) Gold (Au) Selective Plating

File Size 168.42K  /  4 Page

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Texas Instruments

Part No. TLV7111323DDSER
Description Dual, 200mA, Low-IQ, Low-Dropout Regulator for Portable Devices 6-WSON -40 to 125
Tech specs    

Get Free Sample

Official Product Page

    90130-3214

Molex Electronics Ltd.
Part No. 90130-3214
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 14 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating

File Size 168.45K  /  4 Page

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Texas Instruments

Part No. MSP430F1132IDWR
Description 16-bit Ultra-Low-Power Microcontroller, 8kB Flash, 256B RAM, 10 bit ADC 20-SOIC -40 to 85
Tech specs    

Official Product Page

    90130-3306

Molex Electronics Ltd.
Part No. 90130-3306
Description
File Size 168.45K  /  4 Page

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Texas Instruments

Part No. TLV7111323DDSET
Description Dual, 200mA, Low-IQ, Low-Dropout Regulator for Portable Devices 6-WSON -40 to 125
Tech specs    

Official Product Page

For 90130-1132 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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