| |
|
 |
成都视普公司
|
| Part No. |
SP2338
|
| OCR Text |
...leep Wake up 0~ 3 SP2337/8xx 25mS 0X66 25mS 11 3 0X00 3 0X00 ... ... 3 0X00 ... ... 3 0X00 ... ... 3 0X00 ADRO0 ADRO1 00 01 10 0 1 2 3 UART 3 ADRO0 ADRO1
10
8 SP23... |
| Description |
成都视普公司的单片机芯片
|
| File Size |
360.21K /
10 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
ATMEL[ATMEL Corporation]
|
| Part No. |
AT49LH00B4 AT49LH00B4-33TC AT49LH00B4-33JC
|
| OCR Text |
...
- Can Be Used as FWH for Intel 8xx, E7xxx, and E8xxx Series Chipsets - Can Be Used as LPC Flash for Non-Intel Chipsets Top Boot with Bottom Partitioned Memory Array for Efficient Vital Data Storage - 64-Kbyte Top Boot Sector, Six 64-Kbyte ... |
| Description |
4-Megabit Top Boot, Bottom Partioned Firmware Hub and Low-Pin Count Flash Memory.
4-megabit Top Boot, Bottom Partitioned Firmware Hub and Low-Pin Count Flash Memory
|
| File Size |
265.78K /
36 Page |
View
it Online |
Download Datasheet |
| |
|
|
Data Device
|
| Part No. |
BU61743G3-290 BU6174X
|
| OCR Text |
...re -1XX, -4XX -2XX, -5XX -3XX, -8xx Operating Junction Temperature Storage Temperature Lead Temperature (soldering, 10 sec.) Thermal Resistance Enhanced Mini-ACE Ceramic Flat pack / Gull Wing package Junction-to-Case, Hottest Die (JC) -ACE ... |
| Description |
Enhanced Miniature Advanced Communications Engine
|
| File Size |
478.53K /
63 Page |
View
it Online |
Download Datasheet |
|
Price and Availability
|
