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Amphenol Communications Solutions |
| Part No. |
76745-104-28LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 28 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87835-3442
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 34 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating,
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating,
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| File Size |
106.14K /
3 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
54112-811042500LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 4 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10141042-403A000LF
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| Description |
PwrMAX® Power Connector, Right Angle, Receptacle, 2HP+18S+2HP
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
51939-1042LF
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| Description |
PwrBlade®, Power Supply Connectors, 11P 12S Right Angle Header.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77317-104-20LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 20 Positions ,2.54mm (0.100in) Pitch,
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
65781-042LF
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| Description |
Dubox® 2.54mm, Board to Board Connector, Vertical card connector, Double Row, 2.54mm (0.100in) pitch ,12 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87835-2442 0878352442
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 24 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
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| File Size |
106.14K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
65781-042
|
| Description |
Dubox® 2.54mm, Board to Board Connector, Vertical card connector, Double Row, 2.54mm (0.100in) pitch ,12 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0878352642 87835-2642
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 26 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
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| File Size |
106.14K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
74817-1042LF
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| Description |
Metral® High Speed 1000 Series, Backplane Connectors, Header, Vertical Signal, 5 Row, Press-Fit, 30 Position, Select Load, Standard
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54122-104200800LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0878350842 87835-0842
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 8 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating
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| File Size |
106.48K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54121-104281000LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 28 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Price and Availability
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