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  87697-2002 Datasheet PDF File

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    87697-2002

Molex Electronics Ltd.
Part No. 87697-2002
Description 6.35mm (.250) Pitch, Power, 2.54mm (.100) Pitch, Signal, EXTreme PowerPlus Pa-S Receptacle

File Size 196.81K  /  4 Page

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Rochester Electronics LLC

Part No. AM7200-25JC
Description AM7200 - FIFO, 256X9, 25ns, Asynchronous, CMOS, PQCC32
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87697-2001

Molex Electronics Ltd.
Part No. 87697-2001
Description 6.35mm (.250) Pitch, Power, 2.54mm (.100) Pitch, Signal, EXTreme PowerPlus Pa-S Receptacle

File Size 196.72K  /  4 Page

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    Grayhill, Inc.
Part No. 2001/2002SERIES 2002-6112-02 2002-4066-02N 2002-4065-02N 2001-4173-00N 2001-4178-00N 2001-6112-02 2001-4173-02N 2001-4182-02N
Description QPL (Dummy Load) Terminations 七匹狼(假负载)终止
RF/MICROWAVE TERMINATION

File Size 56.98K  /  1 Page

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    Sanyo Electric
Part No. LC876980B LC876972B
Description (LC876980B/72B/64B) 8-Bit Single Chip Microcontroller

File Size 857.54K  /  27 Page

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    87663 87606 87607 87664 87665 87667 87631 87700 87710 87697 87696 87695

Molex Electronics Ltd.
Part No. 87663 87606 87607 87664 87665 87667 87631 87700 87710 87697 87696 87695
Description PowerPlusTM (SSI) Expandable Power & Signal Connectors

File Size 3,582.08K  /  6 Page

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    CGM-06-2002

Teledyne Technologies Incorporated
Part No. CGM-06-2002
Description Module Amplifier 2 GHz - 6 GHz

File Size 906.04K  /  2 Page

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    TELEDYNE[Teledyne Technologies Incorporated]
Part No. TMT-4-2002
Description Temperature Compensated Low Noise Amplifier 2 GHz - 4 GHz

File Size 888.15K  /  2 Page

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    BBS-2002

BOSER Technology Co., Ltd
Part No. BBS-2002
Description 1U High, Small Box Bare Bone System

File Size 413.59K  /  16 Page

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    TELEDYNE[Teledyne Technologies Incorporated]
Part No. TMA-18-2002
Description Amplifier 2 GHz - 18 GHz

File Size 886.85K  /  2 Page

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    CGM-08-2002

Teledyne Technologies Incorporated
Part No. CGM-08-2002
Description Module Amplifier 2 GHz - 8 GHz

File Size 906.05K  /  2 Page

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