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  73644-2200 Datasheet PDF File

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    MOLEX INC
Part No. 0736442200
Description 72 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, PRESS FIT
File Size 26.96K  /  2 Page

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Rochester Electronics LLC
Part No. AM27C512-200DI
Description AM27C512 - 512K (64K x 8) CMOS EPROM
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    73644-2200 0736442200

Molex Electronics Ltd.
Part No. 73644-2200 0736442200
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position A, 72 Circuits
File Size 164.18K  /  4 Page

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Rochester Electronics LLC
Part No. 27C512-200DM/B
Description 27C512 - 512K (64K x 8) CMOS EPROM
Tech specs 　 　

Official Product Page

    SEMIKRON
Part No. SKBB250C3200/2200
Description Miniature Bridge Rectifiers 2.7 A, 800 V, SILICON, BRIDGE RECTIFIER DIODE
File Size 74.94K  /  4 Page

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Rochester Electronics LLC
Part No. AM27C512-200JI
Description AM27C512 - 512Kb (64K x 8-Bit) CMOS OTP EPROM
Tech specs 　 　

Official Product Page

    Semikron
Part No. SKBB250C3200/2200
Description BRIDGE RECTIFIER
File Size 68.38K  /  4 Page

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Rochester Electronics LLC
Part No. AM27C512-200DC
Description AM27C512 - 512K (64K x 8) CMOS EPROM
Tech specs 　 　

Official Product Page

    73644-2110

Molex Electronics Ltd.
Part No. 73644-2110
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position F, 72 Circuits
File Size 174.00K  /  4 Page

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Amphenol Communications Solutions
Part No. 77313-822-00LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 02 Positions
Tech specs 　 　

Official Product Page

    73644-2016

Molex Electronics Ltd.
Part No. 73644-2016
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B
File Size 164.19K  /  4 Page

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Amphenol Communications Solutions
Part No. 20021122-00026T4LF
Description Minitek127® 1.27mm, Board To Board, Unshrouded header, Surface Mount, 26 contacts.
Tech specs 　 　

Official Product Page

    73644-1202

Molex Electronics Ltd.
Part No. 73644-1202
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B
File Size 167.27K  /  4 Page

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Amphenol Communications Solutions
Part No. 54112-111262200LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Row, 26 Positions
Tech specs 　 　

Official Product Page

    73644-2105

Molex Electronics Ltd.
Part No. 73644-2105
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A
File Size 163.64K  /  4 Page

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Amphenol Communications Solutions
Part No. 20021122-00048T1LF
Description Minitek127® 1.27mm, Board To Board, Unshrouded header, Surface Mount, 48 contacts.
Tech specs 　 　

Official Product Page

    73644-1207

Molex Electronics Ltd.
Part No. 73644-1207
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A
File Size 167.28K  /  4 Page

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Amphenol Communications Solutions
Part No. 73942-2002LF
Description 5 Row Signal Receptacle,150 Position, Right Angle, Press-Fit
Tech specs 　 　

Official Product Page

    73644-2018

Molex Electronics Ltd.
Part No. 73644-2018
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location N/A, Polarizing Key Position N/A, 72 Circuits
File Size 174.00K  /  4 Page

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Amphenol Communications Solutions
Part No. 20021122-00008D1LF
Description Minitek127® 1.27mm, Board To Board, Unshrouded header, Surface Mount, 8 contacts.
Tech specs 　 　

Official Product Page

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