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  71764-0026 Datasheet PDF File

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    71764-0026

Molex Electronics Ltd.
Part No. 71764-0026
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 26 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 26 Circuits, Tin (Sn) Plating

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Rochester Electronics LLC

Part No. DS0026H/883
Description DS0026 - Low Skew Clock Driver, CAN8 - Dual marked (7800802GA)
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    71764-0118

Molex Electronics Ltd.
Part No. 71764-0118
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

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Amphenol Communications Solutions

Part No. 20021621-00026D8LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 26 contacts
Tech specs    

Official Product Page

    71764-0104

Molex Electronics Ltd.
Part No. 71764-0104
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 4 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.22K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021323-00026D4LF
Description Minitek127®, Board to Board Receptacle, Double Row, Bottom entry, 26 positions, 1.27mm (0.500in) pitch.
Tech specs    

Official Product Page

    71764-0024

Molex Electronics Ltd.
Part No. 71764-0024
Description 2.54mm (.100) Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 24 Circuits
2.54mm (.100") Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 24 Circuits

File Size 120.83K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021311-00026T4LF
Description 1.27mm (0.05in.) pitch, Receptacle Top entry, 26 contacts
Tech specs    

Official Product Page

    71764-0022

Molex Electronics Ltd.
Part No. 71764-0022
Description 2.54mm (.100) Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature
2.54mm (.100") Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature

File Size 120.83K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021112-00026T8LF
Description Minitek127®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 26 Positions, 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

    71764-0106

Molex Electronics Ltd.
Part No. 71764-0106
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 6 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.09K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021521-00026T1LF
Description Minitek127®, Shrouded Board to Board Header, Surface Mount, 26 positions, 1.27mm (0.500in) pitch.
Tech specs    

Official Product Page

    71764-0108

Molex Electronics Ltd.
Part No. 71764-0108
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 8 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.01K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021612-00026T8LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 26 contacts
Tech specs    

Official Product Page

    71764-0114

Molex Electronics Ltd.
Part No. 71764-0114
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 14 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.23K  /  5 Page

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Amphenol Communications Solutions

Part No. 67000-026LF
Description Berg Duflex Housing, single row, 26 Position.
Tech specs    

Official Product Page

    71764-0116

Molex Electronics Ltd.
Part No. 71764-0116
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.10K  /  5 Page

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Amphenol Communications Solutions

Part No. 10026846-101
Description 528 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array
Tech specs    

Official Product Page

    71764-0220

Molex Electronics Ltd.
Part No. 71764-0220
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 120.87K  /  5 Page

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Amphenol Communications Solutions

Part No. 10130787-480026DLF
Description HPCE STD VT Receptacle 48P26S
Tech specs    

Official Product Page

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