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  70567-0168 Datasheet PDF File

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    0015800685 70567-0168 A-70567-0168 15-80-0685

Molex Electronics Ltd.
Part No. 0015800685 70567-0168 A-70567-0168 15-80-0685
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective P
MOLEX Connector

File Size 1,218.47K  /  7 Page

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Amphenol Communications Solutions

Part No. ME1016813401311
Description Mini Cool Edge 0.60mm,Storage and Server connector ,OCP 3.0,168 signal pins, SMT, OCP, Straddle mount, 1.93mmPCB, -0.3mm offset
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    70567-0125

Molex Electronics Ltd.
Part No. 70567-0125
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 50 Circuits, Tin (Sn) Plating

File Size 1,211.75K  /  7 Page

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Amphenol Communications Solutions

Part No. 86840-168HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 68 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 5.84 mm (0.23in) Tail.
Tech specs    

Official Product Page

    70567-0120

Molex Electronics Ltd.
Part No. 70567-0120
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 40 Circuits, Tin (Sn) Plating

File Size 1,211.71K  /  7 Page

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Amphenol Communications Solutions

Part No. ME10168434A0601
Description Mini Cool Edge 0.60mm, OCP 3.0, 168 signal pins, SMT, OCP, Straddle mount, 2.11mm PCB, 0.0mm offset
Tech specs    

Official Product Page

    A-70567-0279

Molex Electronics Ltd.
Part No. A-70567-0279
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.38K  /  7 Page

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Amphenol Communications Solutions

Part No. ME1016810201041
Description EDSFF, OCP 3.0, Mini Cool Edge 0.60mm, Gen 5, 168 signal pins, SMT, Right angle, Seating height 4.05mm.
Tech specs    

Official Product Page

    A-70567-0022

Molex Electronics Ltd.
Part No. A-70567-0022
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits, Tin (Sn) Plating

File Size 1,218.42K  /  7 Page

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Amphenol Communications Solutions

Part No. 51730-168LF
Description PwrBlade®, Power Supply Connectors, 1P 12S 1P Right Angle Header.
Tech specs    

Official Product Page

    A-70567-0021

Molex Electronics Ltd.
Part No. A-70567-0021
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, Tin (Sn) Plating

File Size 1,218.42K  /  7 Page

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Amphenol Communications Solutions

Part No. 68016-808HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 8 Positions, 2.54 mm (0.100) Pitch.
Tech specs    

Official Product Page

    A-70567-0020

Molex Electronics Ltd.
Part No. A-70567-0020
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 44 Circuits, Tin (Sn) Plating

File Size 1,218.41K  /  7 Page

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Amphenol Communications Solutions

Part No. 68690-168HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 68 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    A-70567-0019

Molex Electronics Ltd.
Part No. A-70567-0019
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, Tin (Sn) Plating

File Size 1,218.42K  /  7 Page

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Amphenol Communications Solutions

Part No. ME10168334B2A01
Description Mini Cool Edge 0.60mm, OCP 3.0, 168 signal pins, SMT, OCP, Straddle mount, 2.794mm PCB, 0.0mm offset
Tech specs    

Official Product Page

    70567-0018

Molex Electronics Ltd.
Part No. 70567-0018
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, Tin (Sn) Plating

File Size 1,218.45K  /  7 Page

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Amphenol Communications Solutions

Part No. ME1016843401C61
Description MiniCoolEdge0.6mm, S/M, 2.26mmHB0.633mmoffset,Gen5
Tech specs    

Official Product Page

    14-60-0168

Molex Electronics Ltd.
Part No. 14-60-0168
Description 2.54mm (.100") Pitch SL垄芒 Insulation Displacement Connector Assembly, Female, Single Row, Version D, Back Ribs, Wire Size 24, 3.81楼矛m (150楼矛") Tin/Lead (SnPb)

File Size 159.83K  /  3 Page

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Amphenol Communications Solutions

Part No. ME1016843401341
Description MiniCoolEdge0.6mm168S, straddelmount, 1.91mm PCB, 0.8mm offset
Tech specs    

Official Product Page

For 70567-0168 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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