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  70567-0131 Datasheet PDF File

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    0705670131 70567-0131

Molex Electronics Ltd.
Part No. 0705670131 70567-0131
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 62 Circuits, Tin (Sn) Plating
MOLEX Connector
File Size 1,211.95K  /  7 Page

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Rochester Electronics LLC
Part No. MC10131P
Description MC10131 - D Flip-Flop, 10K Series, 2-Func, Positive Edge Triggered, 1-Bit, Complementary Output, ECL, PDIP16
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    A-70567-0279

Molex Electronics Ltd.
Part No. A-70567-0279
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
File Size 1,218.38K  /  7 Page

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Amphenol Communications Solutions
Part No. 10131931-313ULF
Description Minitek®, Board to Board, Receptacle, Surface Mount, Single row, 13 Positions, 2mm (0.079inch), horizontal.
Tech specs 　 　

Official Product Page

    70567-0018

Molex Electronics Ltd.
Part No. 70567-0018
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, Tin (Sn) Plating
File Size 1,218.45K  /  7 Page

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Amphenol Communications Solutions
Part No. 10131931-309ULF
Description Minitek®, Board to Board, Receptacle, Surface Mount, Single row, 9 Positions, 2mm (0.079inch), horizontal.
Tech specs 　 　

Official Product Page

    A-70567-0019

Molex Electronics Ltd.
Part No. A-70567-0019
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, Tin (Sn) Plating
File Size 1,218.42K  /  7 Page

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Amphenol Communications Solutions
Part No. 10131934-216ULF
Description Minitek®, Board to Board, Receptacle, Through Mount, Single row, 16 Positions, 2mm (0.079inch), Vertical.
Tech specs 　 　

Official Product Page

    A-70567-0020

Molex Electronics Ltd.
Part No. A-70567-0020
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 44 Circuits, Tin (Sn) Plating
File Size 1,218.41K  /  7 Page

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Amphenol Communications Solutions
Part No. 10131934-322ULF
Description Minitek®, Board to Board, Receptacle, Through Mount, Single row, 22 Positions, 2mm (0.079inch), Vertical.
Tech specs 　 　

Official Product Page

    A-70567-0021

Molex Electronics Ltd.
Part No. A-70567-0021
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, Tin (Sn) Plating
File Size 1,218.42K  /  7 Page

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Amphenol Communications Solutions
Part No. 10131934-104ULF
Description Minitek®, Board to Board, Receptacle, Through Mount, Single row, 4 Positions, 2mm (0.079inch), Vertical.
Tech specs 　 　

Official Product Page

    A-70567-0022

Molex Electronics Ltd.
Part No. A-70567-0022
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits, Tin (Sn) Plating
File Size 1,218.42K  /  7 Page

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Amphenol Communications Solutions
Part No. 10131932-248ULF
Description Minitek®, Board to Board, Receptacle, Through Mount, Double row, 48 Positions, 2mm (0.079inch), horizontal.
Tech specs 　 　

Official Product Page

    70567-0125

Molex Electronics Ltd.
Part No. 70567-0125
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 50 Circuits, Tin (Sn) Plating
File Size 1,211.75K  /  7 Page

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Amphenol Communications Solutions
Part No. 10131931-216ULF
Description Minitek®, Board to Board, Receptacle, Surface Mount, Single row, 16 Positions, 2mm (0.079inch), horizontal.
Tech specs 　 　

Official Product Page

    70567-0120

Molex Electronics Ltd.
Part No. 70567-0120
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 40 Circuits, Tin (Sn) Plating
File Size 1,211.71K  /  7 Page

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Amphenol Communications Solutions
Part No. 10131933-944ULF
Description Minitek®, Board to Board, Receptacle, Surface Mount, Double row, 44 Positions, 2mm (0.079inch), horizontal.
Tech specs 　 　

Official Product Page

    70567-0143 15-80-0185

Molex Electronics Ltd.
Part No. 70567-0143 15-80-0185
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
File Size 1,218.29K  /  7 Page

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Amphenol Communications Solutions
Part No. 10131932-230ULF
Description Minitek®, Board to Board, Receptacle, Through Mount, Double row, 30 Positions, 2mm (0.079inch), horizontal.
Tech specs 　 　

Official Product Page

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