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  70247-1051 Datasheet PDF File

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    70247-1051 0702471051

Molex Electronics Ltd.
Part No. 70247-1051 0702471051
Description 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded10 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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Amphenol Communications Solutions

Part No. 10119110-516002LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angle Header, Through Hole, Double row , 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    FC056-6100739 FC056-6/100739 FC056-6/105126

ebm-papst
Part No. FC056-6100739 FC056-6/100739 FC056-6/105126
Description AXIAL

File Size 263.06K  /  1 Page

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Amphenol Communications Solutions

Part No. 93690-105-14LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Press Fit, Double Row, 14 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    MOLEX INC
Part No. 70247-4600
Description 46 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER

File Size 44.63K  /  1 Page

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Amphenol Communications Solutions

Part No. 84809-101051LF
Description Metral® High Speed 2000 Series, Backplane Connectors, Header, Vertical Signal, 5 Row, Press-Fit, 30 Position, Select Load, Extended
Tech specs    

Official Product Page

    70247-2651

Molex Electronics Ltd.
Part No. 70247-2651
Description 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded26 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded26 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 161.68K  /  4 Page

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Amphenol Communications Solutions

Part No. 10119110-510003LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angle Header, Through Hole, Double row , 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Molex, Inc.
Part No. 70247-2015
Description CGrid HdrShrd RA /VdO/Stdf .38AuLF 20Ckt 19 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER

File Size 68.35K  /  1 Page

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Amphenol Communications Solutions

Part No. 54242-105101000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Molex, Inc.
Part No. 70247-4062
Description CGrid Hdr Shrd RA/VdO/Stdf .38AuLF 40Ckt 39 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER

File Size 71.05K  /  1 Page

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Amphenol Communications Solutions

Part No. 10127819-1051GLF
Description Minitek® Pwr 4.2, Dual Row, Right Angle Through Hole Header, 100u\\ Matte Tin plating, Natural Color, 10 Positions, Nylon66 ,GW Compatible, Tray Packing.
Tech specs    

Official Product Page

    70247-2652

Molex Electronics Ltd.
Part No. 70247-2652
Description 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded26 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 161.68K  /  4 Page

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Amphenol Communications Solutions

Part No. 65801-051LF
Description Clincher™ Flex Connectors, Receptacle Assembly, Single Row, 22 Positions, 2.54mm (.100in) Pitch.
Tech specs    

Official Product Page

    70247-2654

Molex Electronics Ltd.
Part No. 70247-2654
Description 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded26 Circuits, 0.127渭m (5渭") Gold (Au) Plating, Tin(Sn) PC TailPlating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded26 Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC TailPlating

File Size 161.66K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-105100850LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 10 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    70247-0869

Molex Electronics Ltd.
Part No. 70247-0869
Description 2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded8 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, without

File Size 119.85K  /  3 Page

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Amphenol Communications Solutions

Part No. 92791-051
Description Mechanism, 5mm s/o, without Eject, with EMI Clip
Tech specs    

Official Product Page

    70247-6452

Molex Electronics Ltd.
Part No. 70247-6452
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded64 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 161.68K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-105160900LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

For 70247-1051 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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