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  5510 Datasheet PDF File

For 5510 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    NE5510279A-T1 NE5510279A

NEC Corp.
NEC[NEC]
CEL[California Eastern Labs]
Part No. NE5510279A-T1 NE5510279A
Description 3.5V OPERATION SILICON RF POWER MOSFET FOR GSM1800 TRANSMISSION AMPLIFIERS
3.5 V OPERATION SILICON RF POWER MOSFET FOR GSM1800 TRANSMISSION AMPLIFIERS

File Size 38.62K  /  5 Page

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Amphenol Communications Solutions

Part No. 55101-S1102LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 2 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0855105018 85510-5018

Molex Electronics Ltd.
Part No. 0855105018 85510-5018
Description Modular Jack, Vertical, SMT, 6/4, Solder Tabs

File Size 113.66K  /  3 Page

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Amphenol Communications Solutions

Part No. 55101-G1125LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 25 Positions, 2.54 mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    0705510037 70551-0037

Molex Electronics Ltd.
Part No. 0705510037 70551-0037
Description 2.54mm (.100) Pitch SL Header, Single Row, Right Angle, .120 Pocket, Shroudedwith Beveled Plastic Peg, 3 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin

File Size 299.76K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-T1103LF
Description BergStik, Board to Board connector, 2.54mm (0.100in), Unshrouded Right Angled Header, Through Hole, Single Row, 3 Positions.
Tech specs    

Official Product Page

    0557551019 55755-1019

Molex Electronics Ltd.
Part No. 0557551019 55755-1019
Description 2.00mm (.079") Pitch Wire-to-Board Header, Vertical, Shrouded, Kinked PC Tail, withInner Positive Lock, 10 Circuits, Lead-free
2.00mm (.079) Pitch Wire-to-Board Header, Vertical, Shrouded, Kinked PC Tail, withInner Positive Lock, 10 Circuits, Lead-free

File Size 165.66K  /  5 Page

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Amphenol Communications Solutions

Part No. 55101-S3620LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 20 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    0705510013 70551-0013

Molex Electronics Ltd.
Part No. 0705510013 70551-0013
Description 2.54mm (.100) Pitch SL Header, Single Row, Right Angle, .120 Pocket, Shroudedwith Beveled Plastic Peg, 14 Circuits, Tin (Sn) Plating

File Size 299.52K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-G1715LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 15 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    HD155101BF

HITACHI[Hitachi Semiconductor]
Part No. HD155101BF
Description RF Single-chip Linear IC for GSM and EGSM Systems

File Size 542.53K  /  50 Page

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Amphenol Communications Solutions

Part No. 55102-G1103LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 6 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    0705510042 70551-0042

Molex Electronics Ltd.
Part No. 0705510042 70551-0042
Description 2.54mm (.100) Pitch SL Header, Single Row, Right Angle, .120 Pocket, Shrouded, with Beveled Plastic Peg

File Size 299.75K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-S1122LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 22 Positions, 2.54 mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    0705510040 70551-0040

Molex Electronics Ltd.
Part No. 0705510040 70551-0040
Description 2.54mm (.100) Pitch SL Header, Single Row, Right Angle, .120 Pocket, Shroudedwith Beveled Plastic Peg, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin

File Size 299.67K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-T11-02
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 2 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    0855105025 85510-5025

Molex Electronics Ltd.
Part No. 0855105025 85510-5025
Description Modular Jack, Vertical, SMT, 4/4, Solder Tabs

File Size 113.65K  /  3 Page

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Amphenol Communications Solutions

Part No. 55101-G1111LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 11 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    0855105017

Molex Electronics Ltd.
Part No. 0855105017
Description Modular Jack, Vertical, SMT, 4/4, Solder Tabs

File Size 113.65K  /  3 Page

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Amphenol Communications Solutions

Part No. 55101-G1702LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 2 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

For 5510 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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Part: 5512G
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