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  33609 Datasheet PDF File

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    TE Connectivity Ltd
Part No. 6-1633609-8
Description    SHOULD BE CONTACTED FOR THE LATEST REVISION.
File Size 4,576.47K  /  4 Page

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Amphenol Communications Solutions
Part No. 54242-103360960LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

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HUA FENG CIRCUIT





   
Part No. 533641-45 533641-60 533609-60
Description Dual/Triple Ultra-Low-Voltage SOT23 µP Supervisory Circuits
DAEMPFUNGSLIED BECA DM40
DAEMPFUNGSLIED BECA DM100
File Size 253.18K  /  3 Page

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    51336-0910 0513360910

Molex Electronics Ltd.
Part No. 51336-0910 0513360910
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 9Circuits
1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 9Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 9Circuits
File Size 99.07K  /  2 Page

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