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Amphenol Communications Solutions |
Part No. |
54112-110181800LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 18 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54121-408081800LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54242-809141800LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54122-114101800LF
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Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 10 position, 2.54mm (0.100in) pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10120818-001C-TRLF
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Description |
SAS 3.0 Connectors, Storage and Server Connector, Receptacle, Vertical, Surface Mount, 29 Positions, 12Gb/s.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10120818-002CLF
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Description |
SAS 3.0 Connectors, Storage & Server System, Receptacle, Vertical, Surface Mount, 29 Positions, 12Gb/s.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10129383-918002ALF
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Description |
EconoStik™, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10127718-001PLF
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Description |
Minitek® Pwr 3.0, Receptacle Terminal, 80u\\ Tin Overall (Contact area coated with lubricant, pre plating).
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Tech specs |
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Official Product Page
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NXP Semiconductors N.V.
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Part No. |
PCF8598C-2P/02112
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Description |
1024 x 8-bit CMOS EEPROM with I2C-bus interface; Package: SOT97-1 (DIP8); Container: Tube 1K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8
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File Size |
110.03K /
20 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54121-408071800LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 7 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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TE Connectivity, Ltd. Electronic Theatre Controls, Inc. Coto Technology
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Part No. |
8021 8002-12-001 8002-05-101 8002-05-011 8002-05-001 8002-12-101 8002-05-111 8002-12-011 8002-12-111 8021-05-011 8021-05-111 8041-05-111 8021-12-111 8021-12-001 8061-12-001 8061-05-011 8041-12-111 8061-05-111 8021-12-101 8021-12-011 8021-05-001 8021-05-101 2229046 8061-05-101 8061-05-001 8041-05-001 8041-12-011
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Description |
Temp Sensor, Low Voltage, -40C to 125C, 8-SOIC 150mil, TUBE Temp Sensor & Brushless DC Fan Controller / Over Temp Alert, -40C to 125C, 8-MSOP, TUBE Prog Solid-State Temp Sensor, -40C to 125C, 5-TO-220, TUBE 1.5A Dual MOSFET Drvr, -40C to 85C, 8-SOIC 150mil, T/R 1.5A DUAL MOSFET DRIVER, 0C to 70C, 8-MSOP, T/R 1.5A Dual MOSFET Drvr, -40C to 125C, 8-DFN, TUBE 1.5A Dual High-Speed Power MOSFET Drivers, -40C to 125C, 8-SOIC 150mil, TUBE Prog Solid-State Temp Sensor, 0C to 70C, 8-PDIP, TUBE Temp Sensor & Brushless DC Fan Controller / Over Temp Alert, -40C to 125C, 8-MSOP, TUBE 1.5A DUAL MOSFET DRIVER, -40C to 85C, 8-MSOP, T/R Temp Sensor, Low Voltage, 0C to 70C, 8-PDIP, TUBE 1.5A Dual MOSFET Drvr, -40C to 85C, 8-DFN, T/R DIP Reed Relays
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File Size |
52.75K /
2 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
10088418-001LF
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Description |
HPCE VT Receptacle 56P12S
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Tech specs |
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Official Product Page
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Bom2Buy.com

Price and Availability
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