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  280708-2 Datasheet PDF File

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    182206-2 280708-1 280708-2

Tyco Electronics
Part No. 182206-2 280708-1 280708-2
Description AMPMODU II REC, CONTACT, HIGH PRESSURE, C.O.S.I.
File Size 89.23K  /  1 Page

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Amphenol Communications Solutions
Part No. 54112-807081400LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    DB Unlimited.
Part No. SM280708-1
Description Released from Engineering
File Size 938.17K  /  1 Page

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Amphenol Communications Solutions
Part No. 54242-807081250LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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