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STATSCHIP[STATS ChipPAC, Ltd.]
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Part No. |
FBGA-SD
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OCR Text |
...11, 8x14, 10x12, 10x14, 0.8 max 13x13, 15x15, 16x16, 17x17 1.2 max 1.0 max 4x4 ~ 16x16 40-280
0.5 - 0.8
0.5 - 0.8
Substrate Wire bonds Solder balls 2 die
5 die
(3 functional die + 2 spacer die)* (4 functional die + 1 spacer die... |
Description |
Fine Pitch Ball Grid Array - Stacked Die
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File Size |
555.83K /
2 Page |
View
it Online |
Download Datasheet |
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STATSCHIP[STATS ChipPAC, Ltd.]
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Part No. |
FLGA-SD
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OCR Text |
...(mm) Typ. Pkg. Thickness 4x4 to 13x13 8 to 200 0.5 to 0.8 TFLGA-SD: 1.2mm VFLGA-SD: 1.0mm max. WFLGA-SD: 0.8mm max.
Corporate Office 10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823 Global O... |
Description |
Fine Pitch Land Grid Array - Stacked Die
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File Size |
533.77K /
2 Page |
View
it Online |
Download Datasheet |
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STATSCHIP[STATS ChipPAC, Ltd.]
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Part No. |
FLGA
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OCR Text |
...(mm) Typ. Pkg. Thickness 4x4 to 13x13 8 to 200 0.50 to 0.80 TFLGA: 1.20mm VFLGA: 1.00mm max. WFLGA: 0.80mm max.
Corporate Office Global Offices
10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720... |
Description |
Fine Pitch Land Grid Array
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File Size |
511.62K /
2 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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