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Samtec, Inc.
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Part No. |
EZ-2P2-GG EZ-2P2-GT
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OCR Text |
....015 (17,86) .703 (14,05) .553 (11,51) .453 sc?2p3?, ez?2p3?, ez?2p2? sc?1w1? ez?1w1? insertion depth= .125" to .157" (3,18mm to 3,99mm) ...56mm) lead dia accepted: .016" to .020" (0,41mm to 0,51mm) plating available = gg, gt, tt sc?1s1?, e... |
Description |
BERYLLIUM COPPER, GOLD (30) OVER NICKEL FINISH, PCB TERMINAL
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File Size |
560.85K /
2 Page |
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Download Datasheet
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Maxim Integrated Produc... MAXIM[Maxim Integrated Products] MAXIM - Dallas Semiconductor
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Part No. |
MAX2240EBL MAX2240
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OCR Text |
...with Bluetooth, HomeRF, and 802.11 standards, as well as other FSK modulation systems. The PA provides a nominal +20dBm (100mW) output power...56mm x 1.56mm area. The 3 x 3 array of solder bumps are spaced with a 0.5mm bump pitch.
Ordering ... |
Description |
2.5GHz, 20dBm Power Amplifier IC in UCSP Package
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File Size |
177.72K /
10 Page |
View
it Online |
Download Datasheet
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Maxim Integrated Products Inc
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Part No. |
MAX2240EBL
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OCR Text |
...with Bluetooth, HomeRF, and 802.11 standards, as well as other FSK modulation systems. The PA provides a nominal +20dBm (100mW) output power...56mm x 1.56mm area. The 3 x 3 array of solder bumps are spaced with a 0.5mm bump pitch.
Ordering ... |
Description |
Amplifier, Other - Datasheet Reference From old datasheet system
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File Size |
167.02K /
10 Page |
View
it Online |
Download Datasheet
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Maxim Integrated Products Inc
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Part No. |
MAX2240EPL
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OCR Text |
...with Bluetooth, HomeRF, and 802.11 standards, as well as other FSK modulation systems. The PA provides a nominal +20dBm (100mW) output power...56mm x 1.56mm area. The 3 x 3 array of solder bumps are spaced with a 0.5mm bump pitch.
Ordering ... |
Description |
Amplifier, Other - Datasheet Reference From old datasheet system
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File Size |
186.37K /
10 Page |
View
it Online |
Download Datasheet
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Price and Availability
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