|
|
 |
Amphenol Communications Solutions |
Part No. |
68000-122HLF
|
Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 22 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
10129206-0012201LF
|
Description |
DDR4 DIMM, Ultra Low Profile, Storage and Server Connector, Vertical , Through Hole, 288 Position , 0.85mm (0.033in) Pitch
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
68001-228HLF
|
Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 28 Positions, 2.54 mm (0.100in) Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
10129206-0012213LF
|
Description |
DDR4 DIMM, Ultra Low Profile, Storage and Server Connector, Vertical , Through Hole, 288 Position , 0.85mm (0.033in) Pitch
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
68001-227HLF
|
Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 27 Positions, 2.54 mm (0.100in) Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
861400122YO2LF
|
Description |
Board to Board connector, Unshrouded Header, Through Hole, Double Row, 12 Position, Vertical.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |

Molex Electronics Ltd.
|
Part No. |
0780012200 78001-2200
|
Description |
0.60mm (.024) Pitch miniDIMM Socket, Surface Mount, Reverse Right Angle, with Off-White Latches, 2.5V Voltage Key, 200 Circuits, Lead-free 0.60mm (.024") Pitch miniDIMM Socket, Surface Mount, Reverse Right Angle, with Off-White Latches, 2.5V Voltage Key, 200 Circuits, Lead-free
|
File Size |
400.66K /
6 Page |
View
it Online |
Download Datasheet
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
68001-229HLF
|
Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 29 Positions, 2.54 mm (0.100in) Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
68001-220HLF
|
Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 20 Positions, 2.54 mm (0.100in) Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |

Molex Electronics Ltd.
|
Part No. |
75900-1222 0759001222
|
Description |
3.50mm (.138) Pitch, MX150?/a> Dual Row Header, Breakaway, Right Angle, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall 3.50mm (.138) Pitch, MX150 Dual Row Header, Breakaway, Right Angle, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall
|
File Size |
126.06K /
3 Page |
View
it Online |
Download Datasheet
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
68001-224HLF
|
Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 24 Positions, 2.54 mm (0.100in) Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
68001-222HLF
|
Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 22 Positions, 2.54 mm (0.100in) Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|

Bom2Buy.com

Price and Availability
|