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  0897-1602 Datasheet PDF File

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    0908971602 0897-1602

Molex Electronics Ltd.
Part No. 0908971602 0897-1602
Description 2.54mm (.100) Pitch QF-50, Right Angle, Dual Row with Eject Levers, Shrouded Header
MOLEX Connector

File Size 257.80K  /  3 Page

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Amphenol Communications Solutions

Part No. 10127716-02LF
Description Minitek® Pwr 3.0, Dual Row, Receptacle Housing, 2 Positions, Non GW Compatible Nylon66, Black Color.
Tech specs    

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HUA FENG CIRCUIT





    90897-2501

Molex Electronics Ltd.
Part No. 90897-2501
Description 2.54mm (.100) Pitch QF-50, Right Angle, Dual Row with Eject Levers, Shrouded Header, 50 Circuits

File Size 257.67K  /  3 Page

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Amphenol Communications Solutions

Part No. 61082-041602PLF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 40 Positions.
Tech specs    

Official Product Page

    DAICO[DAICO Industries, Inc.]
Part No. DA0897
Description GaAs 7 Section Attenuator

File Size 185.06K  /  1 Page

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Amphenol Communications Solutions

Part No. 51741-10001602AALF
Description PwrBlade®, Power Supply Connectors, 16S 2P Vertical Receptacle.
Tech specs    

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    2-208973-1

Tyco Electronics
Part No. 2-208973-1
Description ARINC 600 Connectors; PLUG ASSY,SZ 2,ARINC 600 ( AMP )

File Size 374.06K  /  1 Page

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Amphenol Communications Solutions

Part No. 61083-121602LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 120 Positions.
Tech specs    

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Part No. EA08973
Description From old datasheet system

File Size 184.33K  /  4 Page

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Amphenol Communications Solutions

Part No. 69916-024LF
Description BergStik® 2.54mm, Board to Board connector, Vertical 2 Row Board-to-Board Stacking Header 56 Positions, 2.54mm Pitch. 0.76um (30u\\.) GXT™ Mating plating.
Tech specs    

Official Product Page

   
Part No. EE08979
Description From old datasheet system

File Size 223.26K  /  4 Page

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Amphenol Communications Solutions

Part No. 61083-101602LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 100 Positions.
Tech specs    

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    AN10897

NXP Semiconductors
Part No. AN10897
Description A guide to designing for ESD and EMC

File Size 215.94K  /  30 Page

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Amphenol Communications Solutions

Part No. 69916-022LF
Description BergStik® 2.54mm, Board to Board connector, Vertical 2 Row Board-to-Board Stacking Header 52 Positions, 2.54mm Pitch. 0.76um (30u\\.) GXT™ Mating plating.
Tech specs    

Official Product Page

   
Part No. EA08974
Description From old datasheet system

File Size 185.65K  /  4 Page

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Amphenol Communications Solutions

Part No. 71602-720LF
Description Quickie® IDC Receptacle, Wire To Board, Double Row, 20 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    Littelfuse, Inc.
Part No. 089707.5 0897010
Description Low Profile MINIFuses Rated 58V 超薄迷你㈢保险丝额定58V

File Size 97.70K  /  1 Page

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Amphenol Communications Solutions

Part No. 67016-024LF
Description Quickie®, Wire To Board, Strain Relief, 24 Positions
Tech specs    

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    MABA-008979-CF0290

M/A-COM Technology Solutions, Inc.
Part No. MABA-008979-CF0290
Description RF 1:1 Transformer with Tap 50-1200 MHz

File Size 75.43K  /  3 Page

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Amphenol Communications Solutions

Part No. CE1602000110111
Description Cool Edge 0.80mm Hybrid Power and Signal Connectors, Storage and Server System, Through Hole/Surface mount, 6 power pins, 20 signal pins, Vertical
Tech specs    

Official Product Page

For 0897-1602 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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