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  wire-bond Datasheet PDF File

For wire-bond Found Datasheets File :: 3148    Search Time::1.235ms    
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    MPXM2202GST1 MPX220208 MPXV2202DP MPXV2202GC6TI MPXV2202GP MPXV2202GC6U MPXM2202DT1 MPXM2202AS

Freescale Semiconductor, Inc
Freescale Semiconductor...
Part No. MPXM2202GST1 MPX220208 MPXV2202DP MPXV2202GC6TI MPXV2202GP MPXV2202GC6U MPXM2202DT1 MPXM2202AS
OCR Text ...stics. Silicone Gel Die Coat Wire Bond Differential/Gauge Die P1 Stainless Steel Metal Cover Epoxy Case Silicone Gel Die Coat Wire Bond Absolute Die P1 Stainless Steel Metal Cover Epoxy Case Lead Frame Differential/G...
Description 200 kPa On-Chip Temperature Compensated Silicon Pressure Sensors

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    Raytheon
Part No. RMWP38001
OCR Text ...ding straps. all die attach and wire/ribbon bond equipment must be well grounded to prevent static discharges through the device. recommended wire bonding uses 3 mils wide and 0.5 mil thick gold ribbon with lengths as short ...
Description 37-40 GHz power amplifier MMIC

File Size 311.25K  /  6 Page

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    XC2V1000 XC2V1000-4BF957C XC2V1000-4BF957I XC2V1000-4BG575C XC2V1000-4BG575I XC2V1000-4BG728C XC2V1000-4BG728I XC2V1000-

XILINX[Xilinx, Inc]
Xilinx, Inc.
Kontron AG
XILINX INC
Part No. XC2V1000 XC2V1000-4BF957C XC2V1000-4BF957I XC2V1000-4BG575C XC2V1000-4BG575I XC2V1000-4BG728C XC2V1000-4BG728I XC2V1000-4CS144C XC2V1000-4CS144I XC2V1000-4FF1152C XC2V1000-4FF1152I XC2V1000-4FF1517C XC2V1000-4FF1517I XC2V1000-4FF896C XC2V1000-4FF896I XC2V1000-4FG256C XC2V1000-4FG256I XC2V1000-4FG456C XC2V1000-4FG456I XC2V1000-4FG676C XC2V1000-4FG676I XC2V1000-5BF957C XC2V1000-5BF957I XC2V1000-5BG575C XC2V1000-5BG575I XC2V1000-5BG728C XC2V1000-5BG728I XC2V1000-5CS144C XC2V1000-5CS144I XC2V1000-5FF1152C XC2V1000-5FF1152I XC2V1000-5FF1517C XC2V1000-5FF1517I XC2V1000-5FF896C XC2V1000-5FF896I XC2V1000-5FG256C XC2V1000-5FG256I XC2V1000-5FG456C XC2V1000-5FG456I XC2V1000-5FG676C XC2V1000-5FG676I XC2V1000-6BF957C XC2V1000-6BF957I XC2V1000-6BG575C XC2V1000-6BG575I XC2V1000-6BG728C XC2V1000-6BG728I XC2V1000-6CS144C XC2V1000-6CS144I XC2V1000-6FF1152C XC2V1000-6FF1152I XC2V1000-6FF1517C XC2V1000-6FF1517I XC2V1000-6FF896C XC2V1000-6FF896I XC2V1000-6FG256C XC2V1000-6FG256I XC2V1000-6FG456C XC2V1000-6FG456I XC2V1000-6FG676C XC2V1000-6FG676I XC2V1500 XC2V1500-4BF957C XC2V1500-4BF957I XC2V1500-4BG575C XC2V1500-4BG575I XC2V1500-4BG728C XC2V1500-4BG728I XC2V1500-4CS144C XC2V1500-4CS144I XC2V1500-4FF11
OCR Text ...can logic support Flip-Chip and wire-bond Ball Grid Array (BGA) packages in three standard fine pitches (0.80mm, 1.00mm, and 1.27mm) 100% factory tested - * * * * * * * * * * * * * (c) 2001 Xilinx, Inc. All ...
Description    Industry First Platform FPGA Solution
1.5VField-ProgrammableGateArrays
IC REG LDO 1A 8V SHTDN TO220FP-5
Virtex-II 1.5V Field-Programmable Gate Arrays 的Virtex - II 1.5V的现场可编程门阵
Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 1280 CLBS, 1000000 GATES, 650 MHz, PBGA575
Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 1920 CLBS, 1500000 GATES, 650 MHz, PBGA575
1.5V Field-Programmable Gate Arrays 1.5V的现场可编程门阵
Virtex-II 1.5V Field-Programmable Gate Arrays Virtex - II 1.5V的现场可编程门阵
Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 1920 CLBS, 1500000 GATES, 820 MHz, PBGA575
Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 2688 CLBS, 2000000 GATES, 650 MHz, PBGA896
Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 2688 CLBS, 2000000 GATES, 750 MHz, PBGA896
Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 384 CLBS, 250000 GATES, 650 MHz, PBGA256
MS3470L16-26BN FPGA, 5760 CLBS, 4000000 GATES, 820 MHz, PBGA1517
Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 384 CLBS, 250000 GATES, 650 MHz, PBGA144
Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 1280 CLBS, 1000000 GATES, 650 MHz, PBGA896
Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 2688 CLBS, 2000000 GATES, 750 MHz, PBGA957
Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 3584 CLBS, 3000000 GATES, 820 MHz, PBGA957
Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 11648 CLBS, 8000000 GATES, 750 MHz, PBGA1517
Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 768 CLBS, 500000 GATES, 750 MHz, PBGA456
Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 2688 CLBS, 2000000 GATES, 820 MHz, PBGA957
Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 3584 CLBS, 3000000 GATES, 820 MHz, PBGA1152
Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 1920 CLBS, 1500000 GATES, 820 MHz, PBGA896
Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 1280 CLBS, 1000000 GATES, 820 MHz, PBGA896
Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 128 CLBS, 80000 GATES, 750 MHz, PBGA144
Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 1920 CLBS, 1500000 GATES, 820 MHz, PBGA676
Field-Programmable Gate Arrays FPGA, 1280 CLBS, 1000000 GATES, 820 MHz, PBGA456
Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 3584 CLBS, 3000000 GATES, 750 MHz, PBGA676
Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 3584 CLBS, 3000000 GATES, 750 MHz, PBGA1152
Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 5760 CLBS, 4000000 GATES, 650 MHz, PBGA1517
Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 5760 CLBS, 4000000 GATES, 750 MHz, PBGA1152
Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 11648 CLBS, 8000000 GATES, 650 MHz, PBGA1517
Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 768 CLBS, 500000 GATES, 750 MHz, PBGA256
Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 384 CLBS, 250000 GATES, 750 MHz, PBGA256

File Size 113.58K  /  7 Page

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    HMC-ALH311

Hittite Microwave Corporation
Part No. HMC-ALH311
OCR Text ...sible in order to minimize bond wire length. Typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). 0.102mm (0.004") Thick GaAs MMIC Wire Bond 0.076mm (0.003") 1 LOW NOISE AMPLIFIERS - CHIP 1 - 149 RF Ground Plane ...
Description GaAs HEMT MMIC LOW NOISE DRIVER AMPLIFIER, 22.0 - 26.5 GHz

File Size 190.50K  /  6 Page

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    HMC-ALH310

Hittite Microwave Corporation
Part No. HMC-ALH310
OCR Text ...sible in order to minimize bond wire length. Typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). 0.102mm (0.004") Thick GaAs MMIC Wire Bond 0.076mm (0.003") 1 LOW NOISE AMPLIFIERS - CHIP 1 - 143 RF Ground Plane ...
Description GaAs HEMT LOW NOISE AMPLIFIER, 37 - 42 GHz

File Size 188.72K  /  6 Page

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    HMC-XTB110

Hittite Microwave Corporation
Part No. HMC-XTB110
OCR Text ...ermocompression and thermosonic wire bonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measure...BOND PAD METALLIZATION: GOLD. 5. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. 6. OVERALL DIE SIZ...
Description GaAs MMIC PASSIVE x3 FREQUENCY MULTIPLIER, 24 - 30 GHz INPUT

File Size 148.45K  /  4 Page

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    HMC650 HMC654 HMC655 HMC651 HMC652 HMC653

Hittite Microwave Corporation
Part No. HMC650 HMC654 HMC655 HMC651 HMC652 HMC653
OCR Text ...VES - CHIP 2-3 RF Data with Wire Bonds [1] Attenuation vs. Temperature HMC652, HMC653, HMC654, HMC655 0 HMC652 Attenuation vs. Te...BOND PAD IS .004" SQUARE. 3. TYPICAL BOND PAD SPACING IS .006" CENTER TO CENTER EXCEPT AS NOTED. 4. ...
Description WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz

File Size 342.63K  /  8 Page

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    EMP216

Excelics Semiconductor, Inc.
Part No. EMP216
OCR Text ...ie attachment is AuSn eutectic. Wire bonding should be thermocompression bonding with no ultrasonics. To obtain full performance, RF input and output bond wires should be as short as possible. Wire length should be 7 mils maximum, with at l...
Description 6 - 18 GHz 2 Watt Power Amplifier MMIC

File Size 208.16K  /  5 Page

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    CFI06B1H101M CFI06B1H102M CFI06B1H103M CFI06B1H104M CFI06B1H151M CFI06B1H152M CFI06B1H153M CFI06B1H220M CFI06B1H221M CFI

SAMWHA ELECTRIC
Part No. CFI06B1H101M CFI06B1H102M CFI06B1H103M CFI06B1H104M CFI06B1H151M CFI06B1H152M CFI06B1H153M CFI06B1H220M CFI06B1H221M CFI06B1H222M CFI06B1H223M CFI06B1H271M CFI06B1H330M CFI06B1H331M CFI06B1H332M CFI06B1H333M CFI06B1H470M CFI06B1H471M CFI06B1H472M CFI06B1H473M CFI06B1H680M CFI06B1H681M CFI06B1H682M
OCR Text ... Total Thickness, Tape and Lead wire Lead Diameter [ O.D : Out Diameter, L : Length, W : Width, I.D : Inner Diameter ] SAMWHA CAPACITO...Bond Ferrite Core Lead-Wire Marking Tape Paper Tape Material Uni Bond Orange Ni-Zn Material Sn 10...
Description LC Filter

File Size 364.33K  /  4 Page

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For wire-bond Found Datasheets File :: 3148    Search Time::1.235ms    
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