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Cree, Inc.
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Part No. |
CXXXEZ400-SXX000
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OCR Text |
solder paste or preforms, or flux eutectic attach thin 100- m chip low forward voltage C 3.5 v typical at 150 ma single wire bond structure maximum dc forward current - 200 ma ? C ? ? ? ? ? ? applications general illumination automobile... |
Description |
CreeEZ400LED
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File Size |
234.51K /
5 Page |
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it Online |
Download Datasheet
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Cree, Inc.
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Part No. |
CXXXEZ700-SXX000 C470EZ700-SXX000
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OCR Text |
...ian radiation conductive epoxy, solder paste or preforms, or flux eutectic attach thin 100 m chip low forward voltage C 3.6 v typical at 350 ma single wire bond structure 1000 v esd threshold rating ? C C C ? ? ? ? ? ? applications gene... |
Description |
CreeEZ700LED
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File Size |
315.37K /
6 Page |
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it Online |
Download Datasheet
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TRIQUINT[TriQuint Semiconductor]
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Part No. |
TGA4819-SL
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OCR Text |
...e shown for soldermask opening. Solder should not be applied outside of this area. Dimensions: Inches Tolerances: Length & Width: 0.003" Height: 0.006" Adjacent Pad to Pad Spacing: 0.0002" Pad Size: 0.001" Package Backside Material: Materia... |
Description |
10.7Gb/s Linear Optical Modulator Driver
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File Size |
382.08K /
11 Page |
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it Online |
Download Datasheet
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Skyworks Solutions
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Part No. |
CLA4610-085LF
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OCR Text |
...cted to high temperature during solder assembly. the cla4610-085lf is rated to moisture sensitivity level 1 (msl1) at 260 ? c. it can be used for lead or lead-free soldering. for additional information, refer to the skyworks applicatio... |
Description |
Surface Mount Limiter Diode
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File Size |
549.11K /
8 Page |
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it Online |
Download Datasheet
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Price and Availability
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