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  73644-2200 Datasheet PDF File

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    73644-2109

Molex Electronics Ltd.
Part No. 73644-2109
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position E, 72 Circuits
File Size 163.64K  /  4 Page

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Rochester Electronics LLC
Part No. AM27C512-200DI
Description AM27C512 - 512K (64K x 8) CMOS EPROM
Tech specs 　 　

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HUA FENG CIRCUIT





    73644-1205

Molex Electronics Ltd.
Part No. 73644-1205
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position C, 144 Circuits
File Size 167.28K  /  4 Page

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Amphenol Communications Solutions
Part No. 10134040-22000LF
Description HPCE CTB VT HEADER 4LP With latch
Tech specs 　 　

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    73644-3210

Molex Electronics Ltd.
Part No. 73644-3210
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position F, 144 Circuits
File Size 164.13K  /  4 Page

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Amphenol Communications Solutions
Part No. 77311-822-00LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 00 Positions, 2.54 mm Pitch.
Tech specs 　 　

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    73644-1204

Molex Electronics Ltd.
Part No. 73644-1204
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position C, 144 Circuits
File Size 167.28K  /  4 Page

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Amphenol Communications Solutions
Part No. CE1220000110111
Description Cool Edge 0.80mm Hybrid Power and Signal Connectors, Storage and Server System, Through Hole/Surface mount, 2 power pins, 200 signal pins, Vertical
Tech specs 　 　

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    73644-1206

Molex Electronics Ltd.
Part No. 73644-1206
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position D, 144 Circuits
File Size 159.58K  /  4 Page

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Amphenol Communications Solutions
Part No. 20021122-00046D8LF
Description Minitek127® 1.27mm, Board To Board, Unshrouded header, Surface Mount, 46 contacts.
Tech specs 　 　

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    SDA-73644-1209

Molex Electronics Ltd.
Part No. SDA-73644-1209
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header
File Size 159.58K  /  4 Page

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Amphenol Communications Solutions
Part No. 20021122-00028D8LF
Description Minitek127® 1.27mm, Board To Board, Unshrouded header, Surface Mount, 28 contacts.
Tech specs 　 　

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    TE Connectivity, Ltd.
Rhombus Industries, Inc.
Bel Fuse, Inc.
Part No. MP3-Y22200/250/20LL40MM MP3-Y20.015/250/20LL40MM MP3-Y24700/250/20LL40MM
Description CAPACITOR, METALLIZED PAPER, 0.0022 uF, THROUGH HOLE MOUNT RADIAL LEADED
CAPACITOR, METALLIZED PAPER, 0.015 uF, THROUGH HOLE MOUNT RADIAL LEADED
CAPACITOR, METALLIZED PAPER, 0.0047 uF, THROUGH HOLE MOUNT RADIAL LEADED
File Size 358.77K  /  2 Page

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Amphenol Communications Solutions
Part No. 20021122-00050D8LF
Description Minitek127® 1.27mm, Board To Board, Unshrouded header, Surface Mount, 50 contacts.
Tech specs 　 　

Official Product Page

    IC42S32200/L-7TI IC42S32200/L-7TG IC42S32200/L-6BIG IC42S32200/L-8BI IC42S32200/L-6T IC42S32200/L-6TG IC42S32200/L-6TI I

Lattice Semiconductor, Corp.
Pletronics
Integrated Circuit Systems
Part No. IC42S32200/L-7TI IC42S32200/L-7TG IC42S32200/L-6BIG IC42S32200/L-8BI IC42S32200/L-6T IC42S32200/L-6TG IC42S32200/L-6TI IC42S32200/L-8TI IC42S32200/L-7B IC42S32200/L-6BG IC42S32200/L-7TIG IC42S32200/L-8TIG
Description 512K Words x 32 Bits x 4 Banks (64-MBIT) SYNCHRONOUS DYNAMIC RAM 12k字32位4银行4兆位）同步动态RAM
ER 6C 6#16 PIN PLUG
ER 3C 2#16 1#8 SKT PLUG
Circular Connector; No. of Contacts:3; Series:; Body Material:Aluminum Alloy; Connecting Termination:Solder; Connector Shell Size:16S; Circular Contact Gender:Pin; Circular Shell Style:Right Angle Plug; Insert Arrangement:16S-5 RoHS Compliant: No
Contact Gender:Socket; Circular Shell Style:Right Angle Plug; Insert Arrangement:18-13 RoHS Compliant: No
Contact Gender:Socket; Circular Shell Style:Right Angle Plug; Insert Arrangement:16-9 RoHS Compliant: No
File Size 907.63K  /  62 Page

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Amphenol Communications Solutions
Part No. 20021122-00022T1LF
Description Minitek127® 1.27mm, Board To Board, Unshrouded header, Surface Mount, 22 contacts.
Tech specs 　 　

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    Vishay Beyschlag
Vishay Intertechnology, Inc.
Part No. MKS01-SMD5.70.022/20/50VDCBP180 MKS01-SMD5.71000/20/50VDCBP330 MKS01-SMD5.74700/20/50VDCBP330 MKS01-SMD5.72200/20/50VDCBP330
Description CAPACITOR, METALLIZED FILM, POLYETHYLENE AND TEREPHTHALATE, 50 V, 0.022 uF, SURFACE MOUNT CHIP
CAPACITOR, METALLIZED FILM, POLYETHYLENE AND TEREPHTHALATE, 50 V, 0.001 uF, SURFACE MOUNT CHIP
CAPACITOR, METALLIZED FILM, POLYETHYLENE AND TEREPHTHALATE, 50 V, 0.0047 uF, SURFACE MOUNT CHIP
CAPACITOR, METALLIZED FILM, POLYETHYLENE AND TEREPHTHALATE, 50 V, 0.0022 uF, SURFACE MOUNT CHIP
File Size 485.52K  /  3 Page

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Amphenol Communications Solutions
Part No. 73932-2002LF
Description 5 Row Signal Header, Straight, Press-Fit, Wide body, 3 Mod, Selective Loading
Tech specs 　 　

Official Product Page

    IC42S32200/L-6B IC42S32200/L-6BG IC42S32200/L-6BI IC42S32200/L-6BIG IC42S32200/L-7B IC42S32200/L-7BG IC42S32200/L-7BI IC

Integrated Circuit Systems
ICSI
Part No. IC42S32200/L-6B IC42S32200/L-6BG IC42S32200/L-6BI IC42S32200/L-6BIG IC42S32200/L-7B IC42S32200/L-7BG IC42S32200/L-7BI IC42S32200/L-7BIG IC42S32200/L-8TG IC42S32200/L-8B IC42S32200/L-8BIG IC42S32200/L-8BG IC42S32200/L-6TIG IC42S32200L
Description 512K Words x 32 Bits x 4 Banks (64-MBIT) SYNCHRONOUS DYNAMIC RAM
DYNAMIC RAM, SDRAM
File Size 900.97K  /  62 Page

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Amphenol Communications Solutions
Part No. 20021122-00046T1LF
Description Minitek127® 1.27mm, Board To Board, Unshrouded header, Surface Mount, 46 contacts.
Tech specs 　 　

Official Product Page

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