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    MPX2100 MPX2100A MPX2100DP MPX2100GVP MPX2100AS MPX2100GS MPX2100GVS MPX2100ASX MPX2100GSX MPX2100GVSX MPX2100D MPX2100G

Motorola Mobility Holdings, Inc.
Motorola, Inc.
MOTOROLA[Motorola Inc]
MOTOROLA[Motorola, Inc]
Part No. MPX2100 MPX2100A MPX2100DP MPX2100GVP MPX2100AS MPX2100GS MPX2100GVS MPX2100ASX MPX2100GSX MPX2100GVSX MPX2100D MPX2100GP MPX2100AP MPX2101GSX MPX2101GP MPX2101AP MPX2101GVP MPX2101 MPX2101A MPX2101DP
OCR Text ...BOND LEAD FRAME Figure 4. Cross-Sectional Diagrams (Not to Scale) Figure 4 illustrates the absolute sensing configuration (right) and the differential or gauge configuration in the basic chip carrier (Case 344-15). A silicone gel i...
Description 0 to 100 kPa (0 to 14.5 psi) 40 mV FULL SCALE SPAN (TYPICAL) 000千帕4.5 PSI)的全尺寸为40 mV跨度(典型)
(MPX2100 / MPX2101) 0 to 100 kPa (0 to 14.5 psi) 40 mV FULL SCALE SPAN (TYPICAL)
Sensor

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    MPX200GVSX MPX200ASX MPX200D MPX200DP MPX200GP MPX200GS MPX200GSX MPX200GVP MPX200 MPX200AP

Motorola Mobility Holdings, Inc.
Motorola, Inc.
MOTOROLA[Motorola, Inc]
http://
Part No. MPX200GVSX MPX200ASX MPX200D MPX200DP MPX200GP MPX200GS MPX200GSX MPX200GVP MPX200 MPX200AP
OCR Text ...BOND LEAD FRAME Figure 4. Cross-Sectional Diagrams (Not to Scale) Figure 4 illustrates the absolute sensing configuration (right) and the differential or gauge configuration in the basic chip carrier (Case 344-15). A silicone gel isol...
Description 0 to 200 kPa (0-29 psi) 60 mV FULL SCALE SPAN (TYPICAL) 000千帕-29 PSI)的60压全尺寸跨度(典型)
0 to 200 kPa (0-29 psi) 60 mV FULL SCALE SPAN (TYPICAL) GAGE, PEIZORESISTIVE PRESSURE SENSOR, 0-29Psi, 0.25%, 20-80mV, THROUGH HOLE MOUNT

File Size 177.38K  /  8 Page

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    Motorola
Part No. MPX2201 MPX2200AP
OCR Text ...BOND LEAD FRAME Figure 4. Cross-Sectional Diagrams (Not to Scale) Figure 4 illustrates an absolute sensing die (right) and the differential or gauge die in the basic chip carrier (Case 344-15). A silicone gel isolates the die surfa...
Description 200 kPa on-Chip Temperature Compensated & Calibrated Pressure Sensors
From old datasheet system

File Size 158.03K  /  8 Page

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    MPX700GVSX MPX700 MPX700A MPX700AP MPX700AS MPX700ASX MPX700D MPX700DP MPX700GP MPX700GS MPX700GSX MPX700GVP

Motorola, Inc.
MOTOROLA[Motorola, Inc]
Part No. MPX700GVSX MPX700 MPX700A MPX700AP MPX700AS MPX700ASX MPX700D MPX700DP MPX700GP MPX700GS MPX700GSX MPX700GVP
OCR Text ...BOND LEAD FRAME Figure 4. Cross-Sectional Diagrams (not to scale) Figure 4 illustrates the differential or gauge configuration in the basic chip carrier (Case 344-15). A silicone gel isolates the die surface and wire bonds from the...
Description 0 to 700 kPa (0-100 psi) 60 mV FULL SCALE SPAN (TYPICAL)

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    MPX7050GVS MPX7050GVSX MPX7050DP MPX7050 MPX7050D MPX7050GP MPX7050GS MPX7050GSX MPX7050GVP

Motorola Mobility Holdings, Inc.
Motorola, Inc.
MOTOROLA[Motorola Inc]
MOTOROLA[Motorola, Inc]
Part No. MPX7050GVS MPX7050GVSX MPX7050DP MPX7050 MPX7050D MPX7050GP MPX7050GS MPX7050GSX MPX7050GVP
OCR Text ...P2 RTV DIE BOND Figure 4. Cross-Sectional Diagram (not to scale) 3 MPX7050 SERIES PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the V...
Description 0 to 50 kPa (0 to 7.25 psi) 40 mV FULL SCALE SPAN (TYPICAL) 050 kPa.25 PSI)的全尺寸为40 mV跨度(典型)
0 to 50 kPa (0 to 7.25 psi) 40 mV FULL SCALE SPAN (TYPICAL) 00 kPa.25 PSI)的全尺寸为40 mV跨度(典型)

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    MPX10GP MPX10GVP MPX10 MPX10D MPX10DP MPX10GS MPX10GSX

Motorola Mobility Holdings, Inc.
Motorola, Inc.
MOTOROLA[Motorola, Inc]
MOTOROLA[Motorola Inc]
Part No. MPX10GP MPX10GVP MPX10 MPX10D MPX10DP MPX10GS MPX10GSX
OCR Text ...CASE LEAD FRAME Figure 4. Cross-Sectional Diagram (not to scale) Figure 4 illustrates the differential or gauge configuration in the basic chip carrier (Case 344-15). A silicone gel isolates the die surface and wire bonds from the env...
Description 0 to 10 kPa (0-1.45 psi) 35 mV FULL SCALE SPAN (TYPICAL) 00千帕-1.45 PSI)的35压全尺寸跨度(典型)
0 to 10 kPa (0-1.45 psi) 35 mV FULL SCALE SPAN (TYPICAL) GAGE, PEIZORESISTIVE PRESSURE SENSOR, 0-1.45Psi, 1%, 20-80mV, THROUGH HOLE MOUNT

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    http://
MOTOROLA[Motorola Inc]
MOTOROLA[Motorola, Inc]
Part No. MPX4105 MPX4105A
OCR Text ...OR RTV DIE BOND Figure 2. Cross-Sectional Diagram (Not to Scale) Figure 3. Typical Decoupling Filter for Sensor to Microprocessor Interface Figure 3 shows a typical decoupling circuit for interfacing the integrated MAP sensor to th...
Description OPERATING OVERVIEW INTEGRATED PRESSURE SENSOR 15 to 105 kPa (2.18 to 15.2 psi) 0.31 to 4.90 Volts Output

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    Motorola Semiconductor Products Inc
Part No. MPX53GP
OCR Text ... DIE LEAD FRAME Figure 4. Cross-Sectional Diagram (not to scale) Figure 4 illustrates the differential or gauge configuration in the unibody chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the envi...
Description Signal Conditioner, Other - Datasheet Reference
From old datasheet system

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    AD[Analog Devices]
Part No. AD22157
OCR Text ...ally orientated in each of four cross quadrature positions in order to relieve The Hall sensors generate a number of error components in addition to the desired spatial differential signal: Uncompensated magnetic bias field due to mismat...
Description Wheel Speed Sensor For ABS Systems

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    MOTOROLA INC
MOTOROLA[Motorola, Inc]
Part No. MPX100GSX MPX100 MPX100A MPX100AP MPX100AS MPX100ASX MPX100D MPX100DP MPX100GP MPX100GS
OCR Text ...BOND LEAD FRAME Figure 4. Cross-Sectional Diagrams (Not to Scale) Figure 4 illustrates the absolute sensing configuration (right) and the differential or gauge configuration in the basic chip carrier (Case 344-15). A silicone gel h...
Description 100kPa Uncompensated Silicon Pressure Sensors

File Size 152.55K  /  8 Page

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