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FILTRONIC[Filtronic Compound Semiconductors]
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| Part No. |
FMS2016
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| OCR Text |
...mended that 25.4m diameter gold wire is used. Thermosonic ball bonding is preferred. A nominal stage temperature of 150C and a bonding force...bond force should not be raised above 60g. Thermosonic wedge bonding and thermocompression wedge bon... |
| Description |
SP4T GaAs Multi-Band GSM Antenna Switch
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| File Size |
143.76K /
4 Page |
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it Online |
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MAXIM[Maxim Integrated Products]
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| Part No. |
DS1249W
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| OCR Text |
...e: Lead Finsh: Die Attach: Bond Wire / Size: Flammability: Moisture Sensitivity (JEDEC J-STD20A) Date Code Range:
PACKAGE TESTS
DESCRIPTION SOLDERABILITY DATE CD CONDITION 0104 MIL-STD-883-2003 MIL-STD-883-2016 JESD22-B102 JESD22-B100 JES... |
| Description |
module device DS1249W RELIABILITY REPORT
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| File Size |
15.82K /
6 Page |
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it Online |
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Iterra
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| Part No. |
IT20420
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| OCR Text |
...ic of Application Circuit
Bond Wire Ls
Note: The Input does not have a DC blocking capacitor. It is terminated with a 50 Ohm resistor to ground on chip and it is isolated from any DC bias.
10,000pF
Drain Supply (VD) (Connect to both... |
| Description |
20 to 42 GHz general-purpose amplifier
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| File Size |
331.68K /
14 Page |
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it Online |
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MINI-SYSTEMS INC
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| Part No. |
MSAT-21G-10.5DB
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| OCR Text |
... 99.6% alumina 25k ? min. gold; wire or ribbon bondable, or solderable. 25k ? min. gold; wire or ribbon bondable, or solderable. 25k ? min. gold; wire or ribbon bondable, or solderable. 25k ? min. gold; wire or ribbon bondable, or solderabl... |
| Description |
0 MHz - 20000 MHz RF/MICROWAVE VARIABLE ATTENUATOR
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| File Size |
37.96K /
1 Page |
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it Online |
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gigoptix
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| Part No. |
IT2005
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| OCR Text |
...Sheet4U.com >3 (1 mil long bond wire mm) is necessary to provide drain bias. 2. Bypass capacitor must be large enough to isolate bias supply (> = 10 F)
iT2005
VDD (option 1)
100 uF
VGG2
RF output and VDD (option 2) thru bias te... |
| Description |
Power Amplifier
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| File Size |
286.95K /
7 Page |
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it Online |
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Xilinx
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| Part No. |
4FG676I
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| OCR Text |
...can logic support Flip-Chip and wire-bond Ball Grid Array (BGA) packages in three standard fine pitches (0.80mm, 1.00mm, and 1.27mm) 100% factory tested -
SelectRAMTM Memory Hierarchy - 3 Mb www.DataSheet4U.com of True Dual-PortTM RAM in... |
| Description |
Search --To XC2V1000-4FG676I
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| File Size |
148.56K /
7 Page |
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it Online |
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MOTOROLA INC
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| Part No. |
MPX2101GP
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| OCR Text |
...2 max silicone gel die coat wire bond lead frame differential/gauge die stainless steel metal cover epoxy case differential/gauge element die bond silicone gel die coat wire bond lead frame absolute die stainless steel metal cover e... |
| Description |
GAGE, PEIZORESISTIVE PRESSURE SENSOR, 0-14.5Psi, ROUND, THROUGH HOLE MOUNT
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| File Size |
193.89K /
8 Page |
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it Online |
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MOTOROLA INC
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| Part No. |
MPX2100A
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| OCR Text |
...2 max silicone gel die coat wire bond lead frame differential/gauge die stainless steel metal cover epoxy case differential/gauge element die bond silicone gel die coat wire bond lead frame absolute die stainless steel metal cover e... |
| Description |
ABSOLUTE, PEIZORESISTIVE PRESSURE SENSOR, 0-14.5Psi, 1%, 0-40mV, ROUND, THROUGH HOLE MOUNT
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| File Size |
61.52K /
4 Page |
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it Online |
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Price and Availability
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