1. 2. 3. material content data sheet sales product name ipp023n04n g issued 29. august 2013 ma# MA000787446 package pg-to220-3-123 weight* 2026.81 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 4.425 0.22 0.22 2183 2183 leadframe non noble metal iron 7439-89-6 1.407 0.07 694 inorganic material phosphorus 7723-14-0 0.422 0.02 208 non noble metal copper 7440-50-8 1404.801 69.30 69.39 693110 694012 wire non noble metal aluminium 7429-90-5 6.397 0.32 0.32 3156 3156 encapsulation organic material carbon black 1333-86-4 2.335 0.12 1152 plastics epoxy resin - 67.711 3.34 33408 inorganic material silicondioxide 60676-86-0 513.671 25.34 28.80 253438 287998 leadfinish non noble metal tin 7440-31-5 21.462 1.06 1.06 10589 10589 plating non noble metal nickel 7440-02-0 1.764 0.09 0.09 870 870 solder non noble metal antimony 7440-36-0 0.242 0.01 119 noble metal silver 7440-22-4 0.604 0.03 298 non noble metal tin 7440-31-5 1.571 0.08 0.12 775 1192 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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