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  1 copyright ? 2010, everlight anericas inc. all rights reserved. release date : ma y.24 , 2013 device no :1 www.everlight americas .com p - led ealp03sxbya0 - am feature ? lead - free ? rohs compliant. ? low profile. ? uniform color ? high flux output ? colorless clear resin. ? 7150 to 14250 m lm at 70 ma. ? qualification according to aec - q101. ? packaged in tubes for use with automatic insertion equipmen t. ? compliance with eu reach. ? compliance halogen free .(br <900 ppm ,cl <900 ppm , br+cl < 1500 ppm). applications ? automotive exterior lighting : turn light, tail light , rear - view mirror light, side light, license light switch, 3 rd braking light etc. ? subst itution of traditional light. ? electronic signs and signals. ? general applications. device selection guide chip emitted color resin color material algainp yellow water clear
datasheet p - led ealp03sxbya0 - am 2 copyright ? 2010, everlight americas inc. all rights reserved. release date : ma y.24 , 2013 device no :1 www.everlig ht americas .com table of content page product nomenclature 3 absolute maximum ratings (t a=25 ) 3 electro - optical characteristics (ta=25 ) 4 bin range of forward voltage (ta=25 ) 5 bin range of dominant wavelength (ta=25 ) 6 bin range of total flux (ta=25 ) 7 typical electro - optical characteristics curves 8 package dimension s 10 outer labe l explanation 11 antistatic packing materials tube and standard boxes 11 precautions 12 revision history 15
datasheet p - led ealp03sxbya0 - am 3 copyright ? 2010, everlight americas inc. all rights reserved. release date : ma y.24 , 2013 device no :1 www.everlig ht americas .com absolute maximum ratings (ta=25 parameter symbol rating unit reverse voltage v r 5 v continuous forward curren t i f 70 ma peak forward current (duty 1/10 @1khz) i fp 120 ma power dissipation p d 220 mw led junction temperature t j 1 15 operating temperature t opr - 40 ~ + 100 storage temperature t stg - 40 ~ +1 1 0 thermal resistance rth j - a 140 k/w esd (classifi cation acc. aec q101) esd hbm esd mm 2000 200 v soldering temperature(t=5 sec) t sol 260 5
datasheet p - led ealp03sxbya0 - am 4 copyright ? 2010, everlight americas inc. all rights reserved. release date : ma y.24 , 2013 device no :1 www.everlig ht americas .com electro - optical characteristics (ta=25 parameter symbol min. typ. max. unit condition total flux v 7150 ----- 1 4250 mlm i f = 70 ma peak wavelength p ----- 592 ----- nm i f = 70 ma dominant wavelength d 590 ----- 598 nm i f = 70 ma spectrum radiation bandwidth ? ----- 15 ----- nm i f = 70 ma viewing angle 2 1/2 ----- 105 ----- deg i f = 70 ma forward voltage v f 1.9 - ---- 2.9 v i f = 70 ma reverse current i r ----- ----- 10 a v r =5v note: 1. tolerance of total flux : 11% 2. tolerance of dominant wavelength: 1nm 3. tolerance of forward voltage: 0.1v
datasheet p - led ealp03sxbya0 - am 5 copyright ? 2010, everlight americas inc. all rights reserved. release date : ma y.24 , 2013 device no :1 www.everlig ht americas .com bin range of forward voltage bin min. max. unit condition 2 1.9 2.1 v i f = 70 ma 3 2.1 2.3 4 2.3 2.5 5 2.5 2.7 6 2.7 2.9 note: tolerance of forward voltage: 0.1v
datasheet p - led ealp03sxbya0 - am 6 copyright ? 2010, everlight americas inc. all rights reserved. release date : ma y.24 , 2013 device no :1 www.everlig ht americas .com bin range of dominant wavelength note: tolerance of dominant wavelength: 1nm bin min. max. unit condition 4 590 592 nm i f = 70 ma 5 592 594 6 594 596 7 596 598
datasheet p - led ealp03sxbya0 - am 7 copyright ? 2010, everlight americas inc. all rights reserved. release date : ma y.24 , 2013 device no :1 www.everlig ht americas .com bin ran ge of total flux bin min. max. unit condition t1 7150 9000 mlm i f = 70 ma t2 9000 11250 u1 11250 14250 note: tolerance of total flux: 11%
datasheet p - led ealp03sxbya0 - am 8 copyright ? 2010, everlight americas inc. all rights reserved. release date : ma y.24 , 2013 device no :1 www.everlig ht americas .com typical electro - optical characteristics curves typical c urve of s pectral d istribution relative intensity( ) wavelength (nm) note : v( )=standard eye response curve ; i f = 2 0ma diagram characteristics o f r adiation relative intensity view angle 0% 50% 100% 400 450 500 550 600 650 700
datasheet p - led ealp03sxbya0 - am 9 copyright ? 2010, everlight americas inc. all rights reserved. release date : ma y.24 , 2013 device no :1 www.everlig ht americas .com typical electro - optical characteristics curves typical curve of spectral distribution forward current vs. forward voltage (ta=25 ) dominant wavelength vs. forward current (ta=25 ) forward current (ma ) dominant wavelength (nm) forward voltage (v) forward current (ma) relative luminous intensity vs. forward current (ta=25 ) max. permissible forward current vs. ambient temperature relative luminous intensity forward current (ma) forward c urrent (ma) ambient temperature ( ) 0 10 20 30 40 50 60 70 80 90 100 1.7 1.9 2.1 2.3 2.5 2.7 590 591 592 593 594 595 596 597 0 10 20 30 40 50 60 70 80 90 100 0.0 0.3 0.6 0.9 1.2 1.5 0 10 20 30 40 50 60 70 80 90 100 0 20 40 60 80 100 120 140 0 10 20 30 40 50 60 70 80 maxmum dc current(ma) ambient temperature (c)
datasheet p - led ealp03sxbya0 - am 10 copyright ? 2010, everlight americas inc. all rights reserved. release date : ma y.24 , 2013 device no :1 www.everlig ht americas .com package dimension note : tolerances unless mentioned 0. 25 mm. unit = mm
datasheet p - led ealp03sxbya0 - am 11 copyright ? 2010, everlight americas inc. all rights reserved. release date : ma y.24 , 2013 device no :1 www.everlig ht americas .com antistatic packing materials tube tube label explanation ? qty: packing quantity ? lot no: lot numbe r ? cat: rank of (v f )(note*)(v) note: d /cie/color temperature note: tolerances unless mentioned 2 .0mm. unit = mm standard box outer label explanation ? cpn: customers product number ? p/n: product number ? qty: packing quantity ? cat: rank of (note* ) note: d /cie/color temperature ? luminous flux(intensity) ? hue /ref : reference ? lot no: lot number note: tolerances unless mentioned 3 .0mm. unit = mm label area
datasheet p - led ealp03sxbya0 - am 12 copyright ? 2010, everlight americas inc. all rights reserved. release date : ma y.24 , 2013 device no :1 www.everlig ht americas .com packing quantity packing material length width height (mm) tube quantity (pcs) led quantity (pcs ) tube 485 x 9.5 x 1 60 standard box 510 x 100 x 4 5 30 1800 large box 510 x 150 x 90 105 6300 note: 1. normal packing specification is use standard box, unless already defined initially. 2. vacuum packing with anti - static bag after packing in standar d box. 3. specifications are subject to change without prior notice. notes 1. lead forming ? during lead formation , the leads should be bent at a point at least 3mm from the base of the epoxy bulb. ? lead forming should be done before soldering. ? avoid stressing the led package during leads forming . the stress to the base may damage the leds characteristics or it may break the leds. ? cut the led leadframes at room temperature. cutting the leadframes at high temperatures may cause failure of the leds. ? when mounting the leds onto a pcb , the pcb holes must be aligned exactly with the lead position of the led. if the leds are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the leds. 2. storage ? the leds should be stored at 30c or less and 6 0%rh or less after being shipped from everlight americas and the storage life limits are 3 months. if the leds are stored for 3 months or more, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture a bsorbent material. ? please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur. 3. soldering ? careful attention should be paid during soldering. solder the led no lower than 1.6mm from the base of stopper is recommended.
datasheet p - led ealp03sxbya0 - am 13 copyright ? 2010, everlight americas inc. all rights reserved. release date : ma y.24 , 2013 device no :1 www.everlig ht americas .com ? avoiding applying any stress to the lead frame while the leds are at high temperature particularly when soldering. ? recommended soldering conditions: hand soldering dip soldering temp. at tip of iron 3 00 max. (30w max.) preheat temp. 100 max. (60 sec max.) soldering time 3 sec max. bath temp. 26 0 max. distance n o lower than 1.6mm from the base of stop per bath time. 5 sec max. distance n o lower than 1.6mm from the base of stop per ? dip and hand soldering should not be done mo re than one time . ? after soldering the leds, the epoxy bulb should be protected from mechanical shock or vibration until the leds return to room temperature. ? a rapid - rate process is not recommended for cooling the leds down from the peak temperature. ? althou gh the recommended soldering conditions are specified in the above table, dip or handsoldering at the lowest possible temperature is desirable for the leds. ? wave soldering parameter must be set and maintain according to recommended temperature and dwell ti me in the solder wave. 4. cleaning ? when necessary, cleaning should occur only with isopropyl alcohol at room temperature for a duration of no more than one minute . dry at room temperature before use. ? do not clean the leds by the ultrasonic. when it is absolu tely necessary, the influence of ultrasonic cleaning on the leds depends on factors such as ultrasonic power and the assembled condition. ultrasonic cleaning shall be pre - qualified to ensure this will not cause damage to the led 5. heat management ? heat manage ment of leds must be taken into consideration during the design stage of led application. the current should be de - rated appropriately by referring to the de - rating curve found in each product specification. ? the temperature surrounding the led in the appli cation should be controlled. please refer to the data sheet de - rating curve. 6. esd (electrostatic discharge) ? electrostatic discharge (esd) or surge current (eos) can damage leds. ? an esd wrist strap, esd shoe strap or antistatic gloves must be worn whenever h andling leds. ? all devices, equipment and machinery must be properly grounded. ? use ion blower to neutralize the static charge which might have built up on surface of the leds
datasheet p - led ealp03sxbya0 - am 14 copyright ? 2010, everlight americas inc. all rights reserved. release date : ma y.24 , 2013 device no :1 www.everlig ht americas .com plastic le ns as a result of friction between leds during storage and handing . 7. othe r ? above specification may be changed without notice. everlight americas will reserve authority on material change for above specification. ? when using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sheets. everlight americas assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets. ? these specification sh eets include materials protected under copyright of everlight americas corporation. please dont reproduce or cause anyone to reproduce them without everlight americas s consent.
datasheet p - led ealp03sxbya0 - am 15 copyright ? 2010, everlight americas inc. all rights reserved. release date : ma y.24 , 2013 device no :1 www.everlig ht americas .com revision history rev. modified date file modifi ed contents 2 2013/5/24 change the form of datasheet


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