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product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive rays . 1 / 24 tsz02201 - 0q1q0aj00400 - 1 - 2 ? 2 0 17 rohm co., ltd. all rights reserved. 21.aug.2017 rev.002 tsz22111 ? 14 ? 001 www.rohm.com nano energy tm ultra low iq buck converter f or low power applications b d70522gul general description t he BD70522GUL is a b uck c onverter featuring 180na quiescent current and supports output current up to 500ma. the constant on - time (cot) c ontrol with ulp (ultra low power) mode provides superior transient response and extends battery life by providing excellent light l oad efficiency below 10 a load range . the output voltage can be s elect ed from 9 pre - set voltages by vsel pins. when t he input voltag e gets close to the out p ut voltage , the ic enters 100%on mode where t he switching operation stops . features ? nano energ y tm ? 1 80na (typ) quiescent current ? up to 90% efficiency a t 10a output current ? up to 500ma output current ? 9 selectable output voltages (1.2v, 1.5v, 1.8v, 2.0v, 2.5v, 2.8v, 3.0v, 3.2v, 3.3 v) ? power good output ? 100%on m ode for low i nput v oltage ? discharge function on vout applications ? smoke detector ? t hermostat ? portable devices ? wearable devices ? l ow - iq a pplications without standby sw i t cher ? energy harvesting key specification s ? i nput voltage range: 2.5 v to 5.5v ? o utput voltage range: 1. 2 v to 3.3 v ? maximum outp ut current: 500ma ? operating quiescent current: 180na (typ) ? s tandby current: 50n a ( typ ) ? operating t emperature r ange : - 40 c to +85 c package w(typ) x d(typ) x h(max) vcsp50l1c 1.76 mm x 1.56 mm x 0. 57 mm typical application circuit figure 1. typical application circuit nano energy tm i s a trademark of rohm co., ltd. datashee t vin en vsel1 vsel2 lx vout pgnd vin vout cin l1 pg vpg cout 10 f 22 f 2.2 h 1.2v-3.3v 2.5v-5.5v ven vsel1 vsel2 r pullup agnd
2 / 24 tsz02201 - 0q1q0aj00400 - 1 - 2 ? 20 17 rohm co., ltd. all rights reserved. 21.aug.2017 rev.002 www.rohm.com tsz22111 ? 15 ? 001 b d70522gul contents general description ................................ ................................ ................................ ................................ ................................ ........ 1 features ................................ ................................ ................................ ................................ ................................ .......................... 1 applications ................................ ................................ ................................ ................................ ................................ .................... 1 key specifications ................................ ................................ ................................ ................................ ................................ .......... 1 package ................................ ................................ ................................ ................................ ................................ .......................... 1 typical application circuit ................................ ................................ ................................ ................................ ............................... 1 contents ................................ ................................ ................................ ................................ ................................ ......................... 2 pin configuration ................................ ................................ ................................ ................................ ................................ ............ 3 pin descriptions ................................ ................................ ................................ ................................ ................................ .............. 3 block diagram ................................ ................................ ................................ ................................ ................................ ................ 3 absolute maximum ratings ................................ ................................ ................................ ................................ ............................ 4 thermal resistance ................................ ................................ ................................ ................................ ................................ ........ 4 recommended operating conditions ................................ ................................ ................................ ................................ ............. 4 electrical characteristics ................................ ................................ ................................ ................................ ................................ . 4 electrical characteristics - continued ................................ ................................ ................................ ................................ .............. 5 detailed descriptions ................................ ................................ ................................ ................................ ................................ ...... 6 typical performance curves ................................ ................................ ................................ ................................ ........................... 8 figure 7 - 10 . efficiency vs o utput current ................................ ................................ ................................ ................................ ... 8 figure 11 - 14 . output voltage vs output current ................................ ................................ ................................ ......................... 9 figure 15 - 18 . switching frequency vs output current ................................ ................................ ................................ ............. 10 figure 19 - 22 . output ripple voltage vs output current ................................ ................................ ................................ ............ 11 figure 23 - 26 . load transient response ................................ ................................ ................................ ................................ ... 12 figure 27 - 30 . line transient response ................................ ................................ ................................ ................................ .... 13 figure 31 - 34 . line transient response ................................ ................................ ................................ ................................ .... 14 figure 35 - 36 . start u p ................................ ................................ ................................ ................................ ................................ . 15 figure 37 - 38 . shut d own ................................ ................................ ................................ ................................ ............................ 15 figure 39 - 42 . input voltage ramp up/down ................................ ................................ ................................ ............................. 16 timing chart ................................ ................................ ................................ ................................ ................................ ................. 17 application examples ................................ ................................ ................................ ................................ ................................ ... 18 i/o equivalence circuits ................................ ................................ ................................ ................................ ................................ 19 operational notes ................................ ................................ ................................ ................................ ................................ ......... 20 ordering information ................................ ................................ ................................ ................................ ................................ ..... 22 marking diagram ................................ ................................ ................................ ................................ ................................ .......... 22 physical dimension and packing information ................................ ................................ ................................ ............................... 23 revision history ................................ ................................ ................................ ................................ ................................ ............ 24
3 / 24 tsz02201 - 0q1q0aj00400 - 1 - 2 ? 20 17 rohm co., ltd. all rights reserved. 21.aug.2017 rev.002 www.rohm.com tsz22111 ? 15 ? 001 b d70522gul pin con f iguration figure 2. pin configuration pin descriptio n s pin no. pin n ame descr iption a1 pgnd power ground pin a2 lx switching p in. connect an inductor to this pin. a3 vin power s upply i nput p in. connect an input capacitor close to this pin. b1 vout feedback pin for internal feedback divider network and regulation loop. t his pin is also used for vout discharge while en pin is set to low. b2 agnd analog ground pin b3 en enable pin . this pin must be terminated. high : enable low : shutdown do not pull up en terminal higher than vin voltage . c1 pg power g ood o pen d r ain output p in. pg remains low while the vout pin voltage is lower than the threshold voltage. if not used, this pin can be left open. do not pull up pg terminal to a voltage which is higher than vin voltage . c2 vsel2 output voltage sel ection pins . these pin s ha ve three state s : high = vin ( conn e ct these pins to v in directly without pull up resistor s ) low = gnd ( connect these pins to gnd directly without pull down resistor s ) open = no connection (pcb:c<50pf, r>1mohm) the setting of these pins cannot be changed while the ic is operati n g . c3 vsel1 block diagra m figure 3. block diagram t o p v i e w a b c 1 2 3 p g v s e l 1 v o u t l x e n v i n p g n d v s e l 2 a g n d u l t r a l o w p o w e r r e f e r e n c e v f b m a i n r e f u l p r e f u v l o e n c o n t r o l l o g i c l i m i t l o w s i d e c u r r e n t l i m i t c o m p z e r o c r o s s c o m p c u r r e n t l i m i t c o m p l i m i t h i g h s i d e s o f t s t a r t v t h _ u v l o v i n u v l o c o m p v t h _ p g v 1 0 0 t h _ r e f v i n v o u t d i s c h a r g e u v l o e n v o u t v i n l x p g n d m a i n c o m p u l p c o m p i n t e r n a l f e e d b a c k n e t w o r k p g c o m p 1 0 0 % o n m o d e c o m p e n v s e l 1 v s e l 2 p g a g n d
4 / 24 tsz02201 - 0q1q0aj00400 - 1 - 2 ? 20 17 rohm co., ltd. all rights reserved. 21.aug.2017 rev.002 www.rohm.com tsz22111 ? 15 ? 001 b d70522gul absolute maximum rating s (t a = 25c) parameter symbol rating unit supply voltage v in - 0.3 to + 6 v lx voltage v lx - 0.3 to v in +0.3v v en voltage v en - 0.3 to v in +0.3v v pg voltage v pg - 0.3 to v in +0.3v v vsel1, 2 voltage v sel - 0.3 to v in +0.3v v pg sink current i pg 10 ma power dissi pation p d 0. 59 2 ( note 1 ) w m aximum j unction t emperature tjmax 150 c storage temperature range tstg - 55 to + 150 c caution 1 : operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit betwe en pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. caution 2 : should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in de terioration of the properties of the chip. in case of exceeding this absolute maximum rating, design a pcb boards with power dissipation taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. ( note 1) the d erating is 4 . 74 mw / c while the device is operating above ta 25 c (mount ed on 4 - layer 50 . 0 m m x 58 . 0 mm x 1.6mm fr - 4 board) thermal resistance parameter symbol thermal resistance (typ) unit vcsp50l1c junction to ambient j a 168.8 c /w layer number of measurement board material board size 4 layers fr - 4 50.0 mm x 58 . 0 mm x 1.6mmt recommended operating condit ion s parameter symbol min typ max unit supply voltage ( note 2) v in 2.5 3.6 5.5 v output current i out - - 500 m a inductance ( note 3) l - 2.2 - h output capacitance ( note 4) c out 10 22 100 f operating temperature t opr - 40 + 25 + 85 c (note 2) in itial startup voltage is over 2.6v (max) ( note 3) t he effective inductance should be kept in the specified range from 1.5 h to 3.5 h, including the variety of tolerance, temperature, current derating. ( note 4) t he effective capacitance should be kept this specified range including variety of tolerance, temperature, bias voltage derating. electrical characteristic s ( unless otherwise specified v in = 3.6 v t a =25 c ) parameter symbol min typ max unit conditions circuit current shutdown current i st - 50 10 00 na operating quiescent cur r ent i q - 180 1000 na n o switching, v en = v in v sel =v in include vsel, en pin current under voltage lockout uvlo detect ion th reshold v uvlo 2. 3 0 2.4 0 2. 5 0 v v in falling uvlo release threshold v uvlorls 2.4 0 2.5 0 2. 6 0 v v in rising
5 / 24 tsz02201 - 0q1q0aj00400 - 1 - 2 ? 20 17 rohm co., ltd. all rights reserved. 21.aug.2017 rev.002 www.rohm.com tsz22111 ? 15 ? 001 b d70522gul electrical characteristics - continued ( unless otherwise specified v in = 3.6 v t a =25 c ) parameter symbol min typ max unit conditions control en high level v enh 1.1 - - v en low level v enl - - 0.3 v en input current i en - 0 1 a vsel high level v selh v in - 0.3 - v in +0.3 v vsel low level v sell - 0.3 - +0.3 v vsel input current i vsel - 0 1 a power swit ch hi gh - side fet on - resistance r onh - 0.30 0.45 i lx =50m a lo w - side fet on - resistance r onl - 0.15 0.23 i lx = - 50ma hi gh - side fet switch current limit 1 i limit h1 1225 1750 2275 m a peak current of i nductor lo w - side fet switch current limit i limitl 680 970 12 60 ma bottom current of i nductor hi gh - side fet switch current limit 2 i limit h2 680 970 1260 ma 100%on mode v out discharge fet on - resistance r d i sch 50 100 200 i out = - 10ma power good output power good detection t hreshold v pgth - 95 - % v out rising power good hysteresis v pghys - - 5 - % pg low level output v ol t a ge v olpg - 0.3 - 0.3 v i pg = - 1ma pg output off leak current i offpg - 0 1 a 100% on mode transition 100% on mod e detection threshold v 100 th m 100 200 300 mv v in falling, v in = v out + v 100thm 100% on mode release threshold v 100thp 150 250 350 mv v in rising, v in = v out + v 100thp output output voltage range v out rg 1. 2 - 3.3 v refer to table 1 output voltage accuracy 1 v o acc1 - 2. 0 0.0 2. 0 % i out =10ma output voltage accuracy 2 v oacc 2 - 2. 5 0.0 2 . 5 % i out =100ma start u p delay time t s delay 2.5 5.0 10.0 ms soft - start time t ss 1.5 3.0 6.0 ms table 1. output vol t a ge setting s ( note 5 ) v se t vse l1 vsel2 1.2v gnd open 1.5 v open gnd 1.8 v gnd gnd 2.0 v v in gnd 2.5 v open v in 2.8 v v in open 3.0 v open open 3. 2 v gnd v in 3.3v v in v in ( note 5 ) t he o utput voltage is only determined by the state s of vsel1 and vsel2 during the start up delay . in order to reduce the current consumption, the output voltage cannot be change d by changing the s ta t e s of vsel1 and vsel2 a fter the startup delay .
6 / 24 tsz02201 - 0q1q0aj00400 - 1 - 2 ? 20 17 rohm co., ltd. all rights reserved. 21.aug.2017 rev.002 www.rohm.com tsz22111 ? 15 ? 001 b d70522gul d etailed d escription s 1. co nstant on - time (cot) control the cot control topology supports ccm (continuous current mode) for medium and high load conditions and dcm (discontinuous current mode) for light load conditions . the on - t ime is set in proportion to the output voltage (v out ) , and in inverse proportion to power supply voltage (v in ) . therefore, when in ccm , even if v in or v out settings change s , the ic always operates in a constant frequency 1 mhz (t yp) approximately . if the load current decreases, the ic enters dcm seamlessly to maintain high efficiency down to v ery light loads , and the switching frequency varies approximate ly linearly with the load current. 2. 100% on mode when v in gets close to v out , the ic stop s switching and start s 100% duty cycle operation. it connects the out put to the input via the inductor and the internal high side mosfet switch, when v in falls below the 100% on m ode e nter t hreshold ( v 100thm ) . and w hen v in increases and exceeds the 100% on m ode r elease t hreshold ( v 100thp ) , the ic starts to switch again. figure 4 . 100% on mode transition 3. ultra low power (ulp) mode 2 comparators are used in this ic for monitoring v out. one is main comparator (main comp) and the other is ulp comparator (ulp comp) . the t ransition from n ormal mode to ulp mode is judged pulse by pulse. while t he main comp or the ulp comp detect s the decrea se in v out , the lx node switches for one p ulse , then become s high impedance. if t h e high impedance state last s over 8 s , the ic transit s from normal mode to u lp mode. in ulp mode, the main comp and the p ower g ood c omparator ( pg comp ) are disabled to reduc e the current consumption . and wh en t he ulp comp detects the decrea se in v out , the main comp and the pg comp are enabled , and the ic transit s from ulp mode to normal mode . fig ure 5 . transition between normal mode and ulp mode n o r m a l m o d e u l p m o d e n o r m a l m o d e u l p m o d e n o r m a l m o d e 8 u s 8 u s 8 u s m a i n c o m p : o n p g c o m p : o n m a i n c o m p : o f f p g c o m p : o f f m a i n c o m p : o n p g c o m p : o n m a i n c o m p : o f f p g c o m p : o f f m a i n c o m p : o n p g c o m p : o n v 1 0 0 t h p v 1 0 0 t h m v p g t h v u v l o r l s v u v l o v p g h y s 2 0 0 m v ( t y p ) 2 5 0 m v ( t y p ) 1 0 0 % m o d e 1 0 0 % m o d e s o f t s t a r t 2 . 5 v ( t y p ) 2 . 4 v ( t y p ) 9 5 % ( t y p ) 5 % ( t y p ) l o w l o w h i g h v i n v o u t p g t t : s o f t s t a r t e n d : v i n v 1 0 0 t h p v i n v 1 0 0 t h m
7 / 24 tsz02201 - 0q1q0aj00400 - 1 - 2 ? 20 17 rohm co., ltd. all rights reserved. 21.aug.2017 rev.002 www.rohm.com tsz22111 ? 15 ? 001 b d70522gul 4. on - time extension the o n - t ime is extended automatically to get the best transient response in the case of high duty cycle operation. if the main comp o utput does not return to high leve l with in constant on - time, the on - time is extended until the main comp output returns to high , and t he m aximum o n - t ime is limited to 16 s . figure 6. on - time extension 5. discharge for vout vout pin has a mosfet for discharge which connect s vout pin to gn d when the ic is in standby state. (en=low or uvlo state or tsd state ) 6. power good (pg) output pg pin is an open - d rain output. the pg comp is active when en pin is set to high and v in is above the threshold v uvlorls . pg pin remains low wh en the v out is l ower than the pg d etection threshold (v pgth ) or during the s oft - s tart time . pg pin go es to high impedance when v out exceeds v pgth . a nd it is pulled to low level once v out falls below the pg release threshold (v pgth - v pghys ) . 7. under voltage lock out (uvlo) uvlo function prevent s the malfunction of the internal circuit when v in is too low . if v in falls lower than 2. 4 v (typ) , the ic turn s off . in order to prevent from the misdetection of uvlo , it is necessary to set v in higher than 2. 5 v (typ) . 8. over current limit (oc l ) BD70522GUL employs a bottom inductor current limit function which is achieved by us ing the low side mosfet . t urning on the high side mosfet is prohibited while the inductor current is higher than the low side ocl ( i limitl ) . this function keeps the inductor peak current lower than the sum of i limitl and the inductor ripple current . however, t he low side ocl function does not work if the vout pin is directly shorted to gnd. thus, a high side ocl is implemented for such case . t he high side mosfet turn s off when the inductor current exceeds the high side ocl ( i limith1 ) . furthermore, the peak current is limited to i limith1 0.67 under the on - time extension state. the inductor current is also limited to i limith2 under 100% on mode , and t he high side mos fet is used to sense the current in this case. 9. thermal shutdown (tsd) BD70522GUL stop s the switching operation when the device temperature exceeds the tsd detection threshold 130 c ( t yp) for protecting the ic from overheat . a f ter the device temperature f alls below the tsd rele ase threshold 115 c ( t yp) , the ic starts the s of t - s tart operation and recovers to the normal operation . f b + r a m p c o m p e n s a t o r v r e f m a i n c o m p o u t p u t l x o n - t i m e e x t e n s i o n w i t h d e l a y s h o t i l c o n s t a n t o n - t i m e
8 / 24 tsz02201 - 0q1q0aj00400 - 1 - 2 ? 20 17 rohm co., ltd. all rights reserved. 21.aug.2017 rev.002 www.rohm.com tsz22111 ? 15 ? 001 b d70522gul t ypical performance curve s ( unless otherwise specified t a =25 c ) figure 7 . effi ci ency vs output current (v out =1.2v) figure 8 . efficiency vs output curren t (v out =1.8v) figure 9 . efficiency vs output current (v out =2.5v) f igure 10 . efficiency vs output current (v out =3.3v) 45.0 50.0 55.0 60.0 65.0 70.0 75.0 80.0 85.0 90.0 95.0 0.001 0.01 0.1 1 10 100 1000 e fficiency: [% ] output current: i out [ma] vin=2.6v vin=3.6v vin=4.2v vin=5.0v vin=5.5v 50.0 55.0 60.0 65.0 70.0 75.0 80.0 85.0 90.0 95.0 100.0 0.001 0.01 0.1 1 10 100 1000 e fficiency: [% ] output current: i out [ma] vin=2.8v vin=3.6v vin=4.2v vin=5.0v vin=5.5v 50.0 55.0 60.0 65.0 70.0 75.0 80.0 85.0 90.0 95.0 100.0 0.001 0.01 0.1 1 10 100 1000 e fficiency: [% ] output current: i out [ma] vin=3.6v vin=4.2v vin=5.0v vin=5.5v 45.0 50.0 55.0 60.0 65.0 70.0 75.0 80.0 85.0 90.0 95.0 0.001 0.01 0.1 1 10 100 1000 e fficiency: [% ] output current: i out [ma] vin=2.6v vin=3.6v vin=4.2v vin=5.0v vin=5.5v
9 / 24 tsz02201 - 0q1q0aj00400 - 1 - 2 ? 20 17 rohm co., ltd. all rights reserved. 21.aug.2017 rev.002 www.rohm.com tsz22111 ? 15 ? 001 b d70522gul t ypical performance curve s - continued ( unless otherwise specified t a =25 c ) figure 11 . output voltage vs output current ( load regulation , v out =1.2v ) figure 12 . output voltage vs output current ( load regulation, v out =1.8v ) figure 1 3 . output voltage vs output current ( load regulation, v out = 2 . 5 v ) figure 1 4 . output voltage vs output current ( load regulation, v out =3.3v ) 3.201 3.234 3.267 3.300 3.333 3.366 3.399 0.001 0.01 0.1 1 10 100 1000 output voltage: v out [v] output current: i out [ma] vin=3.6v vin=4.2v vin=5.0v vin=5.5v 1.164 1.176 1.188 1.200 1.212 1.224 1.236 0.001 0.01 0.1 1 10 100 1000 output voltage: v out [v] output current: i out [ma] vin=2.6v vin=3.6v vin=4.2v vin=5.0v vin=5.5v 1.746 1.764 1.782 1.800 1.818 1.836 1.854 0.001 0.01 0.1 1 10 100 1000 output voltag e: v out [v] output current: i out [ma] vin=2.6v vin=3.6v vin=4.2v vin=5.0v vin=5.5v 2.425 2.450 2.475 2.500 2.525 2.550 2.575 0.001 0.01 0.1 1 10 100 1000 output voltage: v out [v] output current: i out [ma] vin=2.8v vin=3.6v vin=4.2v vin=5.0v vin=5.5v
10 / 24 tsz02201 - 0q1q0aj00400 - 1 - 2 ? 20 17 rohm co., ltd. all rights reserved. 21.aug.2017 rev.002 www.rohm.com tsz22111 ? 15 ? 001 b d70522gul t ypical performance curves - continued ( unless otherwise specified t a =25 c ) figure 1 5 . switching frequency vs output current (v out =1.2v) figure 1 6 . switching frequency vs output current (v out =1.8v) figure 1 7 . switching frequency vs output current (v out =2.5v ) figure 1 8 . switching frequency vs output current (v out =3.3v) 0 100 200 300 400 500 600 700 800 900 1000 1100 1200 0 100 200 300 400 500 switching frequency: f sw [khz] output current: i out [ma] vin=2.6v vin=3.6v vin=5.5v 0 100 200 300 400 500 600 700 800 900 1000 1100 1200 0 100 200 300 400 500 switching frequency: f sw [khz] output current: i out [ma] vin=2.6v vin=3.6v vin=5.5v 0 100 200 300 400 500 600 700 800 900 1000 1100 1200 0 100 200 300 400 500 switching frequency : f osw [khz] output current: i out [ma] vin=2.8v vin=3.6v vin=5.5v 0 100 200 300 400 500 600 700 800 900 1000 1100 1200 0 100 200 300 400 500 switching frequency : f sw [khz] output current: i out [ma] vin=3.6v vin=5.5v
11 / 24 tsz02201 - 0q1q0aj00400 - 1 - 2 ? 20 17 rohm co., ltd. all rights reserved. 21.aug.2017 rev.002 www.rohm.com tsz22111 ? 15 ? 001 b d70522gul t ypical performance curves - continued ( unless otherwise specified t a =25 c ) figure 1 9 . output ripple voltage vs output current ( peak to peak output ri pple voltage , v o ut =1.2v ) figure 20 . output ripple voltage vs output current ( p eak to peak output ripple voltage, v o ut =1.8v) figure 21 . output ripple voltage vs output current (peak to peak output ripple voltage, v o ut =2.5v) figure 22 . output ripple voltage vs output current (peak to peak output ripple voltage, v o ut =3.3 v) 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 45.0 50.0 0 100 200 300 400 500 output r ipple voltage: v r ip [mvpp] output current: i out [ma] vin=2.6v vin=3.6v vin=5.5v 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 45.0 50.0 0 100 200 300 400 500 output ripple voltage: v rip [m vpp] output current: i out [ma] vin=2.6v vin=3.6v vin=5.5v 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 45.0 50.0 0 100 200 300 400 500 output ripple voltage: v rip [m vpp] output current: i out [ma] vin=2.8v vin=3.6v vin=5.5v 0 5 10 15 20 25 30 35 40 45 50 0 100 200 300 400 500 output ripple voltage: v rip [m vpp] output current: i out [ma] vin=3.6v vin=5.5v
12 / 24 tsz02201 - 0q1q0aj00400 - 1 - 2 ? 20 17 rohm co., ltd. all rights reserved. 21.aug.2017 rev.002 www.rohm.com tsz22111 ? 15 ? 001 b d70522gul t ypical performance curves - continued ( unless otherwise specified t a =25 c ) figure 2 3 . load transient response ( v in =3.6v, v out = 1.2v, i out =1ua o 500ma, t r = t f =1 s ) figure 2 4 . load transient response ( v in =3.6v, v out =1.8v, i out =1ua o 500ma, t r =t f =1 s ) figure 2 5 . load transient response ( v in =3.6v, v out =2.5v, i out =1ua o 500ma, t r =t f =1 s ) figure 2 6 . load transient response ( v in =3.6v, v out =3.3v, i out =1ua o 500ma, t r =t f =1 s ) droop=174.9mv overshoot=85.6mv v out i out droop=260.2mv overshoot=88.1mv v out i out droop=113.9mv overshoot=65.1mv v out i out droop=137.5mv overshoot=66.9mv v out i out
13 / 24 tsz02201 - 0q1q0aj00400 - 1 - 2 ? 20 17 rohm co., ltd. all rights reserved. 21.aug.2017 rev.002 www.rohm.com tsz22111 ? 15 ? 001 b d70522gul t ypical performance curves - continued ( unless otherwise specifi ed t a =25 c ) figure 2 7 . line transient response ( v in =2.6v o 5.5v , t r =t f =48 s , v out =1.2v, i out =1ma ) figure 2 8 . line transient response ( v in =2.6v o 5.5v , t r =t f =48 s , v out =1.2v, i out = 500 ma ) figure 2 9 . line transient response ( v in =2.6v o 5.5v , t r =t f =48 s , v out =1.8v, i out =1ma ) figure 30 . line transient response ( v in =2.6v o 5.5v , t r =t f =48 s , v out =1.8v, i out =500ma ) droop=30.4mv overshoot=29.6mv v out v in droop=18.8mv overshoot=20.0mv v out v in droop=32.8mv overshoot=30.4mv v out v in droop=22.0mv overshoot=22.8mv v out v in
14 / 24 tsz02201 - 0q1q0aj00400 - 1 - 2 ? 20 17 rohm co., ltd. all rights reserved. 21.aug.2017 rev.002 www.rohm.com tsz22111 ? 15 ? 001 b d70522gul t ypical performance curves - continued ( unless otherwise specified t a =25 c ) figure 31 . line transient response ( v in =2.8v o 5. 5v , t r =t f =45 s , v out =2.5v, i out =1ma ) figure 32 . line transient response ( v in =2.8v o 5.5v , t r =t f =45 s , v out =2.5v, i out =500ma ) figure 3 3 . line transient response ( v in =3.7v o 5.5v , t r =t f =30 s , v out =3.3v, i out =1ma ) figure 3 4 . line transient r esponse ( v in =3.7v o 5.5v , t r =t f =30 s , v out =3.3v, i out =500ma ) v out v in droop=20.0mv overshoot=28.0mv droop=54.0mv overshoot=48.4mv v out v in v out v in droop=24.4mv overshoot=30.4mv droop=50.8mv overshoot=48.4mv v out v in
15 / 24 tsz02201 - 0q1q0aj00400 - 1 - 2 ? 20 17 rohm co., ltd. all rights reserved. 21.aug.2017 rev.002 www.rohm.com tsz22111 ? 15 ? 001 b d70522gul t ypical performance curves - continued ( unless otherwise specified t a =25 c ) figure 3 5 . start u p ( v in =3.6v, v out =2.5v, i out = 0ma , en=0 v in ) figure 3 6 . start u p ( v in =3.6v, v out =2.5v, i ou t = 50 0ma , en=0 v in ) figure 3 7 . shut d own ( v in =3.6v, v out =2.5v, i out =0ma , en=v in 0 ) figure 3 8 . shut d own ( v in =3.6v, v out =2.5v, i out =500ma , en=v in 0 ) t sdelay =4.50ms t ss =2.54ms v en v lx v pg v out t sdelay =4.51ms t ss =2.57ms v en v lx v pg v out v out t sd =134.2us ( 50%en 20%v out ) v en v out t sd =2.45ms (50%en 20%v out ) v en
16 / 24 tsz02201 - 0q1q0aj00400 - 1 - 2 ? 20 17 rohm co., ltd. all rights reserved. 21.aug.2017 rev.002 www.rohm.com tsz22111 ? 15 ? 001 b d70522gul t ypical performance curves - continued ( unless otherwise specified t a =25 c ) figure 3 9 . input voltage ramp up/d own ( v in =0v o 5. 0 v , v out = 1 . 2 v , i out = 50 0ma , pg=vout ) figure 40 . input voltage ramp up/down ( v in =0v o 5. 0 v, v out = 1 . 8 v , i out =500ma , pg=vout ) figure 41 . input voltage ramp up/down ( v in =0v o 5. 0 v, v out =2.5v, i out =500ma , pg=vout ) figure 42 . input voltage ramp up/down ( v in =0v o 5.0v, v out =3.3v , i out =500ma , pg=vout ) v in v lx v pg v out v in v lx v pg v out v in v lx v pg v out 100%on mode operation v in v lx v pg v out 100%on mode operation
17 / 24 tsz02201 - 0q1q0aj00400 - 1 - 2 ? 20 17 rohm co., ltd. all rights reserved. 21.aug.2017 rev.002 www.rohm.com tsz22111 ? 15 ? 001 b d70522gul timing chart after bd 70522gul is enabled, the internal reference voltage is boot ed up . w hen the startup delay time t sdelay has expi red, the switching is start ed by the s oft - s tart operation , and the output voltage is ramp ed up to the set voltage (v outset ) which is determined by the states of vsel1 and vsel2 during the startup delay in normal operation . figure 4 3 . timing chart v e n v o u t t s d e l a y v o u t s e t v l x t s s
18 / 24 tsz02201 - 0q1q0aj00400 - 1 - 2 ? 20 17 rohm co., ltd. all rights reserved. 21.aug.2017 rev.002 www.rohm.com tsz22111 ? 15 ? 001 b d70522gul application example s figure 4 4 . application example (v out =1.2v) figure 4 5 . application example (v out =1.8v) figure 4 6 . application example (v out = 2 . 5 v) figure 4 7 . application example (v out =3.3v) v i n e n v s e l 1 v s e l 2 l x v o u t p g n d v i n v o u t c i n l 1 p g c o u t 1 0 f 2 2 f 2 . 2 h v e n r p u l l u p 1 . 2 m v p g a g n d v i n e n v s e l 1 v s e l 2 l x v o u t v i n v o u t c i n l 1 p g c o u t 1 0 f 2 2 f 2 . 2 h v e n r p u l l u p 1 . 8 m v p g p g n d a g n d v p g v i n e n v s e l 1 v s e l 2 l x v o u t v i n v o u t c i n l 1 p g c o u t 1 0 f 2 2 f 2 . 2 h v e n r p u l l u p 2 . 4 m p g n d a g n d v p g v i n e n v s e l 1 v s e l 2 l x v o u t v i n v o u t c i n l 1 p g c o u t 1 0 f 2 2 f 2 . 2 h v e n r p u l l u p 3 . 3 m p g n d a g n d
19 / 24 tsz02201 - 0q1q0aj00400 - 1 - 2 ? 20 17 rohm co., ltd. all rights reserved. 21.aug.2017 rev.002 www.rohm.com tsz22111 ? 15 ? 001 b d70522gul i/o e quivalen ce c ircuit s c 2 : v s e l 2 , c 3 : v s e l 1 a 1 : p g n d , a 2 : l x , a 3 : v i n , b 2 : a g n d b 1 : v o u t b 3 : e n c 1 : p g v i n l x p g n d a g n d v o u t e n v i n v i n p g v i n v s e l 2 , v s e l 1 v i n
20 / 24 tsz02201 - 0q1q0aj00400 - 1 - 2 ? 20 17 rohm co., ltd. all rights reserved. 21.aug.2017 rev.002 www.rohm.com tsz22111 ? 15 ? 001 b d70522gul operational notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can damage the ic. take pr ecautions against reverse polarity when connecting the power supply , such as mounting an external diode between the power supply and the ic ? s power supply pin s. 2. power s upply l ines design the pcb layout pattern to provide low impedance supp ly lines. furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. g round w iring p attern when using both small - signal and large - current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the a pplication board to avoid fluctuations in the small - signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. recommended o perating c onditions the function and operation of the ic are guaranteed within the range specified by the recommended operating conditions. the c harac teristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow in stantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. ope ration u nder s trong e lectromagnetic f ield operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction . 8. testing on a pplication b oards when testing the ic on an application board, connecting a capacitor directly to a l ow - impedance output pin may vxemhfwwkh,&wrvwuhvv$ozd\vglvfkdujhfdsdflwruvfrpsohwho\diwhuhdfksurfhvvruvwhs7kh,&?vsrzhuvxsso\ should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 9. inter - pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the p cb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground , power supply and output pin . inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid envi ronment) and unintentional solder bridge deposited in between pins during assembly to name a few. 10. unused input pin s input pin s of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitanc e. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless o therwise specified, unused input pin s should be connected to the power supply or ground line.
21 / 24 tsz02201 - 0q1q0aj00400 - 1 - 2 ? 20 17 rohm co., ltd. all rights reserved. 21.aug.2017 rev.002 www.rohm.com tsz22111 ? 15 ? 001 b d70522gul 11. regard ing the i nput p in of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p - n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p - n junction operates as a parasitic diode. when gnd > pin b, the p - n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damag e. therefore , conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. fig ure xx. example of monolithic ic structure 12. ceramic capacitor when using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 13. area of safe operation (aso) operate the ic such that the output voltage, output c urrent, and the maximum junction temperature rating are all within the area of safe operation (aso). 14. thermal shutdown circuit(tsd) this ic has a built - in thermal shutdown circuit that prevents heat damage to the ic. normal operation should always be withi qwkh,&?v maximum junction temperature rating . if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the ts d circuit that will turn off power output pins. when the tj falls below the tsd thre shold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 15. over c urrent p rotection c ircuit (ocp) this ic incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transitioning of the protection circuit. 16. d isturbance l ight in a device where a portion of silicon is exposed to l ight such as in a wl - csp and chip products , ic characteristics may be affected due to photoelectric effect. for this reason, it is recommended to come up with countermeasures that will prevent the chip from being exposed to light. n n p + p n n p + p s u b s t r a t e g n d n p + n n p + n p p s u b s t r a t e g n d g n d p a r a s i t i c e l e m e n t s p i n a p i n a p i n b p i n b b c e p a r a s i t i c e l e m e n t s g n d p a r a s i t i c e l e m e n t s c b e t r a n s i s t o r ( n p n ) r e s i s t o r n r e g i o n c l o s e - b y p a r a s i t i c e l e m e n t s
22 / 24 tsz02201 - 0q1q0aj00400 - 1 - 2 ? 20 17 rohm co., ltd. all rights reserved. 21.aug.2017 rev.002 www.rohm.com tsz22111 ? 15 ? 001 b d70522gul ordering information b d 7 0 5 2 2 g u l - e 2 part number package gul : vcsp50l1c packaging and forming specification e2 : embossed tape an d reel marking diagram part number marking lot number 1pin mark v csp50l1c (top view) 0 5 2 2
23 / 24 tsz02201 - 0q1q0aj00400 - 1 - 2 ? 20 17 rohm co., ltd. all rights reserved. 21.aug.2017 rev.002 www.rohm.com tsz22111 ? 15 ? 001 b d70522gul physical dimension and packing information package name vcsp50l1c < tape and reel information > tape embossed carrier tape quantity 3,000 pcs /reel direction of feed e2 the direction is the pin 1 of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand reel direction of feed 1pin 1234 1234 1234 1234 1234 1234
24 / 24 tsz02201 - 0q1q0aj00400 - 1 - 2 ? 20 17 rohm co., ltd. all rights reserved. 21.aug.2017 rev.002 www.rohm.com tsz22111 ? 15 ? 001 b d70522gul revision history date r evision changes 10 . aug .201 7 001 new release 2 1 . aug .201 7 00 2 corrected the limit s of 3 i limitl and 3 i limit h2 in electrical characteristics . improve d the description of ocl. improved figure 5 , marking diagram .
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipment (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. (n ote1) m edical equipment c lassification of the s pecific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7 . de -rate power dissipation depending on ambient temperature. when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount products , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin considerin g variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in t his document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in t his document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive product, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condition (e .g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excess ive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaution for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information an d data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party reg arding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatso ever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pr od ucts, you are requested to caref ully read this document and fully understand its contents. rohm shall n o t be in an y way responsible or liable for fai lure, malfunction or accid ent arising from the use of an y rohms products against warning, caution or note contained in this document. 2. all information contained in this docum en t is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohms products, please confirm the la t est information with a rohm sales representative. 3. the information contained in this doc u ment is provid ed on an as is basis and rohm d oes not warrant that all information contained in this document is accurate an d /or error-free. rohm shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur a cy or errors of or concerning such information.
datasheet part number BD70522GUL package vcsp50l1c unit quantity 3000 minimum package quantity 3000 packing type taping constitution materials list inquiry rohs yes BD70522GUL - web page distribution inventory

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