ret y rt - low power loss, high efficiency - ideal for automated placement - guardring for overvoltage protection - high surge current capability - halogen-free according to iec 61249-2-21 definition molding compound, ul flammability classification rating 94v-0 base p/n with suffix "g" on packing code - halogen-free terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test sy m bol u nit v rrm v v rms v v dc v i f(av) a dv/dt v/ s r jc r ja t j o c t stg o c document number: ds_d1309043 version: f13 storage temperature range - 55 to +175 maximum reverse current @ rated vr t j =25 t j =125 i r 0.2 note 1: pulse test with pw=300 s, 1% duty cycle 50 operating junction temperature range v 0.90 maximum instantaneous forward voltage (note 1) i f =12.5a, t j =25 i f =12.5a, t j =125 i f =25a, t j =25 i f =25a, t j =125 v f 0.75 - 55 to +175 ma 1.5 o c/w typical thermal resistance maximum average forward rectified current 25 15 voltage rate of change (rated v r ) 10000 0.700.60 m ax i m u m rat i n gs an d elect ri cal ch aract eri st i cs (t a =25 unless otherwise noted) param et er peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm 150 a m brs2 5 h 4 5 ct 4531 45 m ech an i cal dat a to-263ab (d 2 pak) case: to-263ab (d 2 pak) maximum dc blocking voltage maximum repetitive peak reverse voltage maximum rms voltage polarity: as marked weight: 1.4 g (approximately) MBRS25H45CT dual common cathode schottk y rectifier feat u res - moisture sensitivity level: level 1, per j-std-020 - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec taiwan semiconductor downloaded from: http:///
part n o. part n o. MBRS25H45CTMBRS25H45CT (ta=25 unless otherwise noted) document number: ds_d1309043 version: f13 green compound descri pt i on 50 / tube 800 / 13" paper reel pack i n g ex am ple preferred p/n pack i n g code green com pou n d code c0 d 2 pak rat i n gs an d ch aract eri st i cs cu rv es MBRS25H45CT rn rn MBRS25H45CT rng rn g MBRS25H45CT MBRS25H45CT taiwan semiconductor orderi n g i n form at i on pack i n g code green com pou n d code pack age rn suffix "g" d 2 pak 0 5 10 15 20 25 30 0 2 55 07 51 0 01 2 51 5 01 7 5 average forward c urrent (a) case temperature ( ) fig.1 maximum forward current derating curve resistive or inductive load 0 25 50 75 100 125 150 11 01 0 0 peak forward surge current(a) number of cycles at 60 hz fig. 2 maximum non-repetitive forward surge current per leg 8.3ms single half sine wave jedec method 0.0001 0.001 0.01 0.1 1 10 100 0 2 04 06 08 01 0 01 2 01 4 0 instantaneous reverse current (ma) percent of vr (%) fig. 4 typical reverse characteristics per leg tj=25 tj=125 1 10 100 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 instantaneous forward current (a) forward voltage (v) fig. 3 typical forward characteristics per leg tj=125 tj=25 downloaded from: http:///
min max min max a - 10.5 - 0.413 b 14.60 15.88 0.575 0.625 c 2.41 2.67 0.095 0.105 d 0.68 0.94 0.027 0.037 e 2.29 2.79 0.090 0.110 f 4.44 4.70 0.175 0.185 g 1.14 1.40 0.045 0.055 h 1.14 1.40 0.045 0.055 i 8.25 9.25 0.325 0.364 j 0.36 0.53 0.014 0.021 k 2.03 2.79 0.080 0.110 p/n = specific device code g = green compound yww = date code f = factory code document number: ds_d1309043 version: f13 f9 . 5 g2 . 5 m ark i n g di agram c1 . 1 d3 . 5 e 16.9 su ggest ed pad lay ou t symbol unit (mm) a 10.8 b8 . 3 unit (inch) 0.425 MBRS25H45CT taiwan semiconductor pack age ou t li n e di m en si on s dim. unit (mm) unit (inch) 0.3270.043 0.138 0.665 0.374 0.098 0.1 1 10 100 0.01 0.1 1 10 100 transient thermal impedance ( / w) t-pulse duration(s) fig. 5 typical transient thermal impedance per leg downloaded from: http:///
ret y rt assumes no responsibility or liability for any errors inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1309043 version: f13 MBRS25H45CT taiwan semiconductor n ot ic e specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf, downloaded from: http:///
|
