revision#1 ic ??? ? ?? ? ? ?? ? 1. ?? ?? ------------------------------------------page 2 2. ?? ?? ? ?? -----------------------------page 3 3. ?? ?? ?? ----------------------------------page 4~6 5.reflow profile (lead-free)---------------------------page 7 TF12-series hirose korea ffc to board connector 1 TF12s-4s-0.5sh ?? page no. ? ? ? 4~6 0.5 pitch , 1mm ?? 4 pin ? ?? 2 TF12s-6s-0.5sh 6 0.5 pitch , 1mm ?? 4~6 3 TF12-9s-0.5sh 9 0.5 pitch , 1mm ?? 4~64~6 6 TF12s-10s-0.5sh 10 0.5 pitch , 1mm ?? 4~6 5 TF12f-10s-0.5sh 10 0.5 pitch , 1mm ?? 4~6 9 TF12s-20s-0.5sh 20 0.5 pitch , 1mm ?? 4~6 8 TF12s-15s-0.5sh 15 0.5 pitch , 1mm ?? 4~6 4 TF12h-9s-0.6sh 9 0.5 pitch , 2mm ?? 4~6 7 TF12s-13s-0.5sh 13 0.5 pitch , 1mm ?? hirose korea page1 2013/ february
revision#1 ic ??? TF12 - series ? ?? ? ? ?? ? 1. low profile ???? ???? ???? ???? ?? ?? ?? ?? fpc ??? ??? ??? ??? / miss align ?? ?? ?? ?? 1) ??? fpc?? ??? slider? ??? hook? ??? ???? ??? fpc??? ?? ?? 2) ??? ?? ??? fpc??? ?? ?? contact miss align?? 2. back-flip ??? ??? ??? ??? ?? ?? ?? ?? ??? ??? ??? ??? ??? ??? ??? ??? / ?? ?? ?? ?? ??? ??? ??? ??? ?? ?? ?? ?? 1) back-flip?? ???? front-flip?? ?? ??? fpc?? ??? ??? ??? ?? 2) back-flip??? fpc ?? ????? slider open??? ?? ????? ???? ?? ???? ????. 3. low profile ???? ???? ???? ???? ??? ??? ??? ??? fpc ?? ?? ?? ?? ??? ??? ??? ??? 1) fpc??? ?(?? ??)? min. 0.32? 0.12t , 0.2t fpc ??? 60% ?? ?? 5. ??? ??? ??? ??? ??? ??? ??? ??? ? ?? ? / ? ?? ? pattern ?? ?? ?? ?? ?? ?? ?? ?? balance ? ?? ? pcb ?? ?? ?? ?? ?? ?? ?? ?? ?? ?? ?? ?? 6. ??? ??? ??? ??? ni barrier ???? ???? ???? ???? low profile ????? ????? ????? ????? flux ?? ?? ?? ?? ?? ?? ?? ?? 1) contact? ? lead?(solder?) au??, ??? ni barrier?? ???? ??? flux??? ?? ?? ???? ?? 7. case ?? ?? ?? ?? , slider ??? ??? ??? ??? ??? ??? ??? ??? ?? ?? ?? ?? ???? ???? ???? ???? pick-up error ?? ?? ?? ?? ? ? ? ? ? ? ? ? note pc led blu interconnecting. compact devices for interconnecting the main circuite board with the hhp, lcd, pda, hdd or other device. 0.5mm pitch back-flip type, 1 ? ?? ? ? ?? ? ( ? ?? ? ) ???? ???? ???? ???? ffc to board connector 4. ?? ?? ?? ?? ??? ??? ??? ??? slider ? ?? ? ????? ????? ????? ????? slider ?? ?? ?? ?? ?? ?? ?? ?? ?? ?? ?? ?? hirose korea page2 2013/ february
revision#1 ic ??? ?? ?? ?? ?? ?? ?? ?? ?? ??? ??? ??? ??? ?? ?? ?? ?? ??? ??? ??? ??? reflow?? ?? 250? ?????? lead-free soldering? ????? ??? ???. rohs?? ? ?? ?? ?? ??? ??? ???. TF12f-10s-0.5sh? TF12s-10s-0.5sh?? ??? ??? ??? color? ??? ??. (case : black , slider : brown) TF12h-9s-0.5sh? ?? ?? ???? ??? color? ??? ??. (case : black , slider : black) part number ? ?? ? ?? ?? ?? ?? tf 12 # ## # - ** ** ** ** s - 500m min measureed at 100v dc neither shot or insulation beakdown measured at 1ma(or 1,000 ? ) 150v ac for 1 minute 100m max conditions rating current 0.5a voltage 50v operating temperature range 55 85 10 50 storage temperature range specification 1.insulation resistance2.withstand voltage 3.contact resistance item measure at 0.20.03mm ffc remarks remarks remarks remarks ver.:130gf min/hor.:130gf mintemperature : 402 relative humidity : 90 95% duration : 72hr 20 time insertions and extractions. contact ? contact ?? serieal name serieal no. 6.moisture resistance finish finish finish finish material material material material contact resistance : 100m maxinsulation resistance : 50m min 4.fpc retention force 5.mechanical operation contact resistance : 100m max ? ? f type : fpc t=0.12 contact metal fitting - 0.5 12 lcp phosphor bronze sh phosphor bronze ul94v-0 tf contact type sh(smt horizontal mount type) 0.5mm contact pitch lcp black gold plating over ni sn plating over ni 4,6,9,10,13,20 contacts s : socket ul94v-0 ni barrier natural(beige) h blank , s : fpc t=0.2 blank 7.resistance to soldering heat reflow : profile :260 max 30s, 217 and over. 90~120s. no deformation ofcomponents affecting performance. case slider part part part part hirose korea page3 2013/ february
revision#1 ic ??? TF12-series TF12h-9s-0.5sh TF12h-9s-0.5sh TF12h-9s-0.5sh TF12h-9s-0.5sh TF12-9s-0.5sh TF12-9s-0.5sh TF12-9s-0.5sh TF12-9s-0.5sh hirose korea page4 2013/ february
revision#1 ic ??? TF12h-9s-0.5sh TF12h-9s-0.5sh TF12h-9s-0.5sh TF12h-9s-0.5sh TF12-9s-0.5sh TF12-9s-0.5sh TF12-9s-0.5sh TF12-9s-0.5sh hirose korea page5 2013/ february
revision#1 ic ??? packing dimension hirose korea page6 2013/ february
revision#1 ic ??? reflow profile using leadfree solder paste 300250 200 150 100 50 0 50 100 150 200 250 300 recommended application conditions reflow system: ir reflowsolder: cream type sn / 3 ag / 0.5 cu flux content 11%wt metal mask thickness: 0.15mmpreheating time: 150 ~190 , 9030seconds a'=150 ~170 , b'=170 ~190 soldering time: 250 max 220 min, 30~60 seconds temperature( ) time (seconds) 250 max 220 preheating time soldering time a' b' hirose korea page7 2013/ february
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