surface mount zener diode bzt52c2v0s-bzt52c39s features z planar die construction. z general purpose, medium current. z ideally suited for automat ed assembly processes. applications z zener diode. z ultra-small surface mount package. sod-323 ordering information type no. marking package code bzt52c2v4s-bzt52c39s see table 2 sod-323 maximum rating @ ta=25 unless otherwise specified characteristic symbol value unit forward voltage @ i f =10ma v f 0.9 v power dissipation p d 200 mw thermal resistance, junction to ambient air r ja 625 /w junction temperature t j 150 storage temperature range t stg -65-150 notes: 1. valid provided that device term inals are kept at am bient temperature. 2. short duration test pulse used in minimize self-heating effect. 3. f = 1khz. pb lead-free diode semiconductor korea www.diode.kr
surface mount zener diode bzt52c2v0s-bzt52c39s electrical characteristics @ ta=25 unless otherwise specified zener voltage range maximum zener impedance maximum reverse current v z @i zt i zt z zt @i zt z zk @i zk i zk i r @v r temperature coefficient of zener voltage @ i ztc mv/ type number marking code nom(v) min(v) max(v) ma ? ma a v min max bzt52c2v0s wy 2.0 1.91 2. 09 5 100 600 1.0 150 1.0 -3.5 0 bzt52c2v4s wx 2.4 2.2 2. 60 5 100 600 1.0 50 1.0 -3.5 0 bzt52c2v7s w1 2.7 2.5 2. 9 5 100 600 1.0 20 1.0 -3.5 0 bzt52c3v0s w2 3.0 2.8 3. 2 5 95 600 1.0 10 1.0 -3.5 0 bzt52c3v3s w3 3.3 3.1 3. 5 5 95 600 1.0 5 1.0 -3.5 0 BZT52C3V6S w4 3.6 3.4 3. 8 5 90 600 1.0 5 1.0 -3.5 0 bzt52c3v9s w5 3.9 3.7 4. 1 5 90 600 1.0 3 1.0 -3.5 0 bzt52c4v3s w6 4.3 4.0 4. 6 5 90 600 1.0 3 1.0 -3.5 0 bzt52c4v7s w7 4.7 4.4 5.0 5 80 500 1.0 3 2.0 -3.5 0.2 bzt52c5v1s w8 5.1 4.8 5.4 5 60 480 1.0 2 2.0 -2.7 1.2 bzt52c5v6s w9 5.6 5.2 6.0 5 40 400 1.0 1 2.0 -2.0 2.5 bzt52c6v2s wa 6.2 5.8 6. 6 5 10 150 1.0 3 4.0 0.4 3.7 bzt52c6v8s wb 6.8 6.4 7. 2 5 15 80 1.0 2 4.0 1.2 4.5 bzt52c7v5s wc 7.5 7.0 7. 9 5 15 80 1.0 1 5.0 2.5 5.3 bzt52c8v2s wd 8.2 7.7 8.7 5 15 80 1.0 0.7 5.0 3.2 6.2 bzt52c9v1s we 9.1 8.5 9.6 5 15 100 1.0 0.5 6.0 3.8 7.0 bzt52c10s wf 10 9.4 10.6 5 20 150 1.0 0.2 7.0 4.5 8.0 bzt52c11s wg 11 10.4 11.6 5 20 150 1.0 0.1 8.0 5.4 9.0 bzt52c12s wh 12 11.4 12.7 5 25 150 1.0 0.1 8.0 6.0 10.0 bzt52c13s wi 13 12.4 14.1 5 30 170 1.0 0.1 8.0 7.0 11.0 bzt52c15s wj 15 13.8 15.6 5 30 200 1.0 0.1 10.5 9.2 13.0 bzt52c16s wk 16 15.3 17.1 5 40 200 1.0 0.1 11.2 10.4 14.0 bzt52c18s wl 18 16.8 19.1 5 45 225 1.0 0.1 12.6 12.4 16.0 bzt52c20s wm 20 18.8 21.2 5 55 225 1.0 0.1 14.0 14.4 18.0 bzt52c22s wn 22 20.8 23.3 5 55 250 1.0 0.1 15.4 16.4 20.0 bzt52c24s wo 24 22.8 25.6 5 70 250 1.0 0.1 16.8 18.4 22.0 bzt52c27s wp 27 25.1 28.9 2 80 300 0.5 0.1 18.9 21.4 25.3 bzt52c30s wq 30 28.0 32.0 2 80 300 0.5 0.1 21.0 24.4 29.4 bzt52c33s wr 33 31.0 35.0 2 80 325 0.5 0.1 23.1 27.4 33.4 bzt52c36s ws 36 34.0 38.0 2 90 350 0.5 0.1 25.2 30.4 37.4 bzt52c39s wt 39 37.0 41.0 2 130 350 0.5 0.1 27.3 33.4 41.2 notes: 1. valid provided that device term inals are kept at am bient temperature. 2. tested with pulses, period=5ms, pulse width = 300 s. 3. f = 1khz. www.diode.kr diode semiconductor korea
surface mount zener diode bzt52c2v0s-bzt52c39s typical characteristics @ ta=25 unless otherwise specified www.diode.kr diode semiconductor korea
surface mount zener diode bzt52c2v0s-bzt52c39s package outline plastic surface mounted package sod-323 soldering footprint unit : mm package information device package shipping bzt52c2v0s-bzt52c39s sod-323 3000/tape&reel sod-323 dim min max a 1.275 1.325 b 1.675 1.725 c 0.9 typical d 0.25 0.35 e 0.27 0.37 h 0.02 0.1 j 0.1 typical k 2.6 2.7 all dimensions in mm e k h d c b a j www.diode.kr diode semiconductor korea
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