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product structure : silicon integrated circuit this product has no designed protection against radioactive rays . 1/25 tsz02201-0818abz00050-1-2 ? 2014 rohm co., ltd. all rights reserved. 25.jul.2016 rev.001 tsz22111 ? 15 ? 001 www.rohm.com gate driver providing galvanic isolation series isolation voltage 3750vrms 1ch gate driver providing galvanic isolation BM60015FV-LB general description this is the product guarantees long time support in industrial market. the bm60016fv-c is a gate driver with an isolation voltage of 3750vrms, i/o delay time of 75ns, and minimum input pulse width of 60ns. it incorporates the under-voltage lockout (uvlo) function and miller clamp function. features long time support product for industrial applications. providing galvanic isolation active miller clamping under-voltage lockout function reinforced insulation according vde 0884- 10(pending) recognized ul1577: 3750vrms / 1min (pending) applications industrial equipment igbt gate driver mosfet gate driver key specifications isolation voltage: 3750vrms maximum gate drive voltage: 24v i/o delay time: 75ns(max) minimum input pulse width: 60ns package w(typ) x d(typ) x h(max) ssop-b10w 3.5mm x10.2mm x 1.9mm typical application circuits figure 1. application circuits (igbt gate driver) figure 2 . application c ircuits (mosfet gate driver ) gnd1 vcc1 ina inb gnd1 gnd2 vcc2 out mc gnd2 pulse generator uvlo1 s r q pre- driver + - uvlo2 c vcc1 c vcc2 1pin 2v gnd1 vcc1 ina inb gnd1 gnd2 vcc2 out mc gnd2 pulse generator uvlo1 s r q pre- driver + - uvlo2 c vcc1 c vcc2 1pin 2v datashee t
datasheet 2/25 tsz02201-0818abz00050-1-2 ? 2014 rohm co., ltd. all rights reserved. 25.jul.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60015FV-LB contents general description .................................................. ................................................... ................................................... .............. 1
datasheet 3/25 tsz02201-0818abz00050-1-2 ? 2014 rohm co., ltd. all rights reserved. 25.jul.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60015FV-LB recommended range of external constants pin name symbol recommended value unit min. typ. max. vcc1 c vcc1 0.1 1.0 - f vcc2 c vcc2 0.01 - - f pin configurations pin descriptions pin no. pin name function 1 gnd2 output-side ground pin 2 mc miller clamp pin 3 out output pin 4 vcc2 output-side power supply pin 5 gnd2 output-side ground pin 6 gnd1 input-side ground pin 7 vcc1 input-side power supply pin 8 ina control input pin a 9 inb control input pin b 10 gnd1 input-side ground pin gnd2 gnd1 5 6 vcc2 ina 4 7 out 3 8 mc inb 2 9 gnd2 gnd1 1 10 vcc1 (top view)
datasheet 4/25 tsz02201-0818abz00050-1-2 ? 2014 rohm co., ltd. all rights reserved. 25.jul.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60015FV-LB description of pins and cautions on layout of board 1) vcc1 (input-side power supply pin) the vcc1 pin is a power supply pin on the input sid e. to suppress voltage fluctuations due to the curr ent to drive internal transformers, connect a bypass capacitor between th e vcc1 and the gnd1 pins. 2) gnd1 (input-side ground pin) the gnd1 pin is a ground pin on the input side. 3) vcc2 (output-side power supply pin) the vcc2 pin is a power supply pin on the output si de. to reduce voltage fluctuations due to out pin o utput current, connect a bypass capacitor between the vcc2 and the gnd2 pins. 4) gnd2 (output-side ground pin) the gnd2 pin is a ground pin on the output side. 5) ina, inb (control input terminal) the ina and inb pins are used to determine output l ogic. inb ina out h l l h h l l l l l h h 6) out (output pin) the out pin is used to drive the gate of a power de vice. 7) mc (miller clamp pin) the mc pin is for preventing the increase in gate v oltage due to the miller current of the power devic e connected to the out pin. if the miller clamp function is not used, short-circuit the mc pin to the gnd2 pin.
datasheet 5/25 tsz02201-0818abz00050-1-2 ? 2014 rohm co., ltd. all rights reserved. 25.jul.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60015FV-LB description of functions and examples of constant setting 1) miller clamp function when ina=l and out pin voltage < v mcon (typ 2v), the internal mosfet of the mc pin is turn ed on. ina mc internal mosfet of the mc pin l less than v mcon on h x off vcc2 out + - mc s gnd2 predriver predriver predriver figure 3. block diagram of miller clamp function. v mcon gate r q ina gate out t poffa t pona h l h l h l mc v mcon l hi-z figure 4. timing chart of miller clamp function
datasheet 6/25 tsz02201-0818abz00050-1-2 ? 2014 rohm co., ltd. all rights reserved. 25.jul.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60015FV-LB 2) under-voltage lockout (uvlo) function the bm60016fv-c incorporates the under-voltage lock out (uvlo) function both on the low and the high vo ltage sides. when the power supply voltage drops to the uvlo on voltage (low voltage side typ 3.4v, high voltage si de voltage typ 8.5v), the out pin will output the ?l? signal. in a ddition, to prevent malfunctions due to noises, a m ask time of t uvlo1msk (typ 2.5s) and t uvlo2msk (typ 2.9s) are set on both the low and the high v oltage sides. a fter the uvlo is released, the input signal will ta ke effect from the time after the input signal swit ches. figure 5. input-side uvlo function operation timing c hart ina out vcc1 h l h l figure 6. output-side uvlo function operation timing chart ina out vcc2 h l h l v uvlo1h v uvlo2h v uvlo2l hi-z v uvlo1l inb h l inb h l
datasheet 7/25 tsz02201-0818abz00050-1-2 ? 2014 rohm co., ltd. all rights reserved. 25.jul.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60015FV-LB 3 >' i/o condition table ? : vcc1 or vcc2 > uvlo, x:don't care 4) power supply startup / shutoff sequenc no. status input output v c c 1 v c c 2 i n b i n a o u t m c 1 vcc1uvlo uvlo x x x l l 2 vcc2uvlo x uvlo x x l l 3 inb active ? ? h x l l 4 normal operation l input ? ? l l l l 5 normal operation h input ? ? l h h hi-z ina out vcc2 h l h l v uvlo1h v uvlo2h hi-z vcc1 l hi-z mc v uvlo1h v uvlo1l v uvlo1l v uvlo2l v uvlo2l v uvlo2h figure 7. power supply startup / shutoff sequence : since the vcc2 to gnd2 pin voltage is low and the ou tput mos does not turn on, the output pins become hi-z. inb h l
datasheet 8/25 tsz02201-0818abz00050-1-2 ? 2014 rohm co., ltd. all rights reserved. 25.jul.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60015FV-LB absolute maximum ratings (note 1) relative to gnd1. (note 2) relative to gnd2. (note 3) should not exceed tj=150c caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a shor t circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection mea sures, such as adding a fuse, in case the ic is ope rated over the absolute maximum ratings. thermal resistance (note 4) parameter symbol thermal resistance (typ) unit 1s (note 6) 2s2p ( note 7) ssop-b10w input-side junction to ambient (note 5) (note 5) (note 4) based on jesd51-2a(still-air) (note 5) the thermal characterization parameter to report th e difference between junction temperature and the t emperature at the top center of the outside surface of the component package. (note 6) using a pcb board based on jesd51-3. (note 7) using a pcb board based on jesd51-7. layer number of measurement board material board size single fr-4 114.3mm x 76.2mm x 1.57mmt top copper pattern thickness footprints and traces 70 (note 1) v output-side supply voltage v cc2 -0.3 >| +30.0 (note 2) v ina pin input voltage v ina -0.3 >| +vcc1+0.3 or +7.0 (note 1) v inb pin input voltage v inb -0.3 >| +vcc1+0.3 or +7.0 (note 1) v out pin output current (peak 10s) i outpeak 5.0 (note 3) a operating temperature range topr -40 >| +105 c storage temperature range tstg -55 >| +150 c junction temperature range tjmax +150 c
datasheet 9/25 tsz02201-0818abz00050-1-2 ? 2014 rohm co., ltd. all rights reserved. 25.jul.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60015FV-LB recommended operating ratings (ta= -40c to +105c) parameter symbol min. max. units input-side supply voltage v cc1 (note 8) 4.5 5.5 v output-side supply voltage v cc2 (note 9) 10 24 v (note 8) relative to gnd1. (note 9) relative to gnd2. insulation related characteristics reinforced insulation requirements according to vde0884-10(pending) parameter symbol characteristic units insulation classification per en 60664-1, table 1 for rated main voltage< 150vrms for rated main voltage< 300vrms for rated main voltage< 450vrms for rated main voltage< 600vrms rated impulse voltage i - iv i - iv i - iii i - iii - climatic classification 40/125/21 - pollution decree(en 60664-1) 2 - minimum external clearance clr 8.1 mm minimum external creepage cpg 8.1 mm minimum internal gap (internal clearance) 0.012 mm minimum comparative tracking index cti >175 - minimum repetitive insulation voltage v iorm 891 v pk input to output] test voltage, method b viorm * 1.875= vpr, productive test, tm = 1sec, partial discharge < 5pc v pr 1671 highest allowable overvoltage v iotm 6000 maximum withstanding insulation voltage, 1min v iso 3750 vrms insulation resistance at t s , vio = 500v r io >10 9 ?
datasheet 10/25 tsz02201-0818abz00050-1-2 ? 2014 rohm co., ltd. all rights reserved. 25.jul.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60015FV-LB electrical characteristics >& unless otherwise specified t a =-40c to 105c, v cc1 =4.5v to 5.5v, v cc2 =10v to 24v >' parameter symbol min. typ. max. unit conditions general input side circuit current 1 i cc11 0.06 0.14 0.22 ma input side circuit current 2 i cc12 0.10 0.20 0.30 ma ina =10khz, duty=50% input side circuit current 3 i cc13 0.15 0.30 0.45 ma ina =20khz, duty=50% output side circuit current 1 i cc21 0.28 0.46 0.64 ma out=l output side circuit current 2 i cc22 0.24 0.42 0.60 ma out=h logic block logic high level input voltage v inh 2.0 - v cc1 v ina, inb logic low level input voltage v inl 0 - 0.8 v ina, inb logic pull-down resistance r ind 25 50 100 k ? ? ? ? vcc2 uvlo off voltage v uvlo2h 9.0 9.5 10.0 v vcc2 uvlo on voltage v uvlo2l 8.0 8.5 9.0 v vcc2 uvlo mask time t uvlo2msk 1.00 2.9 5.00 s ina out t rise t fall t pona t poffa 50% 50% 90% 50% 50% 90% 10% 10% figure 8. in-out timing chart
datasheet 11/25 tsz02201-0818abz00050-1-2 ? 2014 rohm co., ltd. all rights reserved. 25.jul.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60015FV-LB typical performance curves figure 9. input side circuit current 1 figure 10. input side circuit current 1 figure 11. input side circuit current 2 (at ina=10khz, duty=50%) figure 12. input side circuit current 2 (at ina=10khz, duty=50%) 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20 0.22 -40 -20 0 20 40 60 80 100 icc11 [ma] ta [c] 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20 0.22 4.50 4.75 5.00 5.25 5.50 icc11 [ma] vcc1 [v] ta=-40 c ta=25 c ta=105 c vcc1=5.0v vcc1=4.5v vcc1=5.5v 0.10 0.14 0.18 0.22 0.26 0.30 -40 -20 0 20 40 60 80 100 icc12 [ma] ta [c] 0.10 0.12 0.14 0.16 0.18 0.20 0.22 0.24 0.26 0.28 0.30 4.50 4.75 5.00 5.25 5.50 icc12 [ma] vcc1 [v] ta=-40 c ta=25 c ta=105 c vcc1=5.0v vcc1=4.5v vcc1=5.5v
datasheet 12/25 tsz02201-0818abz00050-1-2 ? 2014 rohm co., ltd. all rights reserved. 25.jul.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60015FV-LB typical performance curves ? continued figure 13. input side circuit current 3 (ina=20khz, duty=50%) figure 14. input side circuit current 3 (ina=20khz, duty=50%) figure 15. output side circuit current 1 (at out=l) figure 16. output side circuit current 1 >& at out=l >' 0.28 0.32 0.36 0.40 0.44 0.48 0.52 0.56 0.60 0.64 -40 -20 0 20 40 60 80 100 icc21 [ma] ta [c] 0.28 0.32 0.36 0.40 0.44 0.48 0.52 0.56 0.60 0.64 10 12 14 16 18 20 22 24 icc21 [ma] vcc2 [v] 0.15 0.20 0.25 0.30 0.35 0.40 0.45 -40 -20 0 20 40 60 80 100 icc13 [ma] ta [c] 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 4.50 4.75 5.00 5.25 5.50 icc13 [ma] vcc1 [v] ta=-40 c ta=25 c ta=105 c vcc1=5.0v vcc1=4.5v vcc1=5.5v ta=-40c ta=25c ta=105c vcc2=15v vcc2=10v vcc2=24v
datasheet 13/25 tsz02201-0818abz00050-1-2 ? 2014 rohm co., ltd. all rights reserved. 25.jul.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60015FV-LB typical performance curves - continued figure 17. output side circuit current 2 >&dw out=h >' figure 18. output side circuit current 2 >&dw out=h >' figure 19. logic (ina/inb) high/low level voltage figure 20. out vs logic (ina) input voltage >& vcc1=5v, vcc2=15v, ta=25c >' 0.0 0.5 1.0 1.5 2.0 2.5 3.0 4.50 4.75 5.00 5.25 5.50 vinh / vinl [v] vcc1 [v] 0 4 8 12 16 20 24 0 1 2 3 4 5 out [v] ina [v] vcc1=5v ta=-40 c ta=25 c ta=105 c ta=-40 c ta=25 c ta=105 c h level l level 0.24 0.30 0.36 0.42 0.48 0.54 0.60 -40 -20 0 20 40 60 80 100 icc22 [ma] ta [c] 0.24 0.30 0.36 0.42 0.48 0.54 0.60 10 12 14 16 18 20 22 24 icc22 [ma] vcc1 [v] ta=-40 c ta=25 c ta=105 c vcc2=15v vcc2=10v vcc2=24v
datasheet 14/25 tsz02201-0818abz00050-1-2 ? 2014 rohm co., ltd. all rights reserved. 25.jul.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60015FV-LB typical performance curves - continued figure 21. logic pull-down resistance figure 22. logic (ina) input minimum pulse width figure 23. out on resistance (source) figure 24. out on resistance (sink) 0.4 0.8 1.2 1.6 2.0 -40 -20 0 20 40 60 80 100 ronh [ ? ? ?
datasheet 15/25 tsz02201-0818abz00050-1-2 ? 2014 rohm co., ltd. all rights reserved. 25.jul.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60015FV-LB typical performance curves - continued figure 25. turn on time >& ina=pwm, inb=l >' figure 26. turn off time >& ina=pwm, inb=l >' figure 27. turn on time (ina=h, inb=pwm >' figure 28. turn off time (ina=h, inb=pwm >' 35 40 45 50 55 60 65 70 75 -40 -20 0 20 40 60 80 100 tpona [ns] ta [c] 35 40 45 50 55 60 65 70 75 -40 -20 0 20 40 60 80 100 tpoffa [ns] ta [c] vcc2=10v vcc2=15v vcc2=24v vcc2=10v vcc2=15v vcc2=24v 35 40 45 50 55 60 65 70 75 -40 -20 0 20 40 60 80 100 poffb [ns] ta [c] 35 40 45 50 55 60 65 70 75 -40 -20 0 20 40 60 80 100 tponb [ns] ta [c] vcc2=10v vcc2=15v vcc2=24v vcc2=10v vcc2=15v vcc2=24v
datasheet 16/25 tsz02201-0818abz00050-1-2 ? 2014 rohm co., ltd. all rights reserved. 25.jul.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60015FV-LB typical performance curves - continued figure 29. mc on resistance figure 30. mc on threshold figure 31. input side uvlo on/off voltage figure 32. input side uvlo mask time 3.25 3.30 3.35 3.40 3.45 3.50 3.55 3.60 3.65 -40 -20 0 20 40 60 80 100 vuvlo1h/l [v] ta [c] 0.4 0.6 0.8 1.0 -40 -20 0 20 40 60 80 100 ronmc [ ?
datasheet 17/25 tsz02201-0818abz00050-1-2 ? 2014 rohm co., ltd. all rights reserved. 25.jul.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60015FV-LB typical performance curves - continued figure 33. output side uvlo on/off voltage figure 34. output side uvlo mask time 8.0 8.5 9.0 9.5 10.0 -40 -20 0 20 40 60 80 100 vuvlo2h/l [v] ta [c] vuvlo2h vuvlo2l 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 -40 -20 0 20 40 60 80 100 tuvlo2msk [s] ta [c]
datasheet 18/25 tsz02201-0818abz00050-1-2 ? 2014 rohm co., ltd. all rights reserved. 25.jul.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60015FV-LB selection of components externally connected figure 35. for driving igbt figure 36. for driving igbt with buffer circuits figure 37. for driving igbt with negative power suppl y recommended rohm 2sar542pfra recommended rohm 2scr542pfr recommended rohm mcr03ezp figure 38. for driving igbt with buffer circuits & neg ative power supply recommended rohm mcr03ezp recommended rohm yfzvfhtr5.1b gnd1 inb u ina u vcc1 uvlo1 pulse generator uvlo2 s q r + - gnd2 out u gnd2 mc u 1pin vcc2 pre- driver gnd1 u gnd1 inb u ina u vcc1 uvlo1 pulse generator uvlo2 s q r + - gnd2 out u gnd2 mc u 1pin vcc2 pre- driver gnd1 u gnd1 inb u ina u vcc1 uvlo1 pulse generator uvlo2 s q r + - gnd2 out u gnd2 mc u 1pin vcc2 pre- driver gnd1 u gnd1 inb u ina u vcc1 uvlo1 pulse generator uvlo2 s q r + - gnd2 out u gnd2 mc u 1pin vcc2 pre- driver gnd1 u recommended rohm ltr18ezp /ltr50uzp recommended rohm ltr18ezp /ltr50uzp recommended rohm ltr18ezp /ltr50uzp recommended rohm ltr18ezp /ltr50uzp recommended rohm yfzvfhtr5.1b recommended rohm 2sar542pfra recommended rohm 2scr542pfra recommended rohm ltr18ezp /ltr50uzp recommended rohm ltr18ezp /ltr50uzp
datasheet 19/25 tsz02201-0818abz00050-1-2 ? 2014 rohm co., ltd. all rights reserved. 25.jul.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60015FV-LB figure 39. for driving mosfet figure 40. for driving mosfet with buffer circuits figure 41. for driving mosfet with negative power sup ply recommended rohm 2sar542pfra recommended rohm 2scr542pfra recommended rohm mcr03ezp figure 42. for driving mosfet with buffer circuits & n egative power supply recommended rohm mcr03ezp recommended rohm yfzvfhtr5.1b gnd1 inb u ina u vcc1 uvlo1 pulse generator uvlo2 s q r + - gnd2 out u gnd2 mc u 1pin vcc2 pre- driver gnd1 u gnd1 inb u ina u vcc1 uvlo1 pulse generator uvlo2 s q r + - gnd2 out u gnd2 mc u 1pin vcc2 pre- driver gnd1 u gnd1 inb u ina u vcc1 uvlo1 pulse generator uvlo2 s q r + - gnd2 out u gnd2 mc u 1pin vcc2 pre- driver gnd1 u gnd1 inb u ina u vcc1 uvlo1 pulse generator uvlo2 s q r + - gnd2 out u gnd2 mc u 1pin vcc2 pre- driver gnd1 u recommended rohm ltr18ezp /ltr50uzp recommended rohm ltr18ezp /ltr50uzp recommended rohm ltr18ezp /ltr50uzp recommended rohm ltr18ezp /ltr50uzp recommended rohm yfzvfhtr5.1b recommended rohm 2sar542pfra recommended rohm 2scr542pfra recommended rohm ltr18ezp /ltr50uzp recommended rohm ltr18ezp /ltr50uzp
datasheet 20/25 tsz02201-0818abz00050-1-2 ? 2014 rohm co., ltd. all rights reserved. 25.jul.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60015FV-LB i/o equivalent circuits pin no name i/o equivalence circuits function 1 out output pin 2 mc miller clamp pin 3 ina control input pin a inb control input pin b vcc2 out gnd2 gnd2 vcc2 mc vcc1 ina inb gnd1 1.0k ?
datasheet 21/25 tsz02201-0818abz00050-1-2 ? 2014 rohm co., ltd. all rights reserved. 25.jul.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60015FV-LB operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse po larity when connecting the power supply, such as mounting an ex ternal diode between the power supply and the ic?s power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impeda nce supply lines. separate the ground and supply li nes of the digital and analog blocks to prevent noise in the g round and supply lines of the digital block from af fecting the analog block. furthermore, connect a capacitor to ground a t all power supply pins. consider the effect of tem perature and aging on the capacitance value when using electroly tic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient c ondition. 4. ground wiring pattern when using both small-signal and large-current grou nd traces, the two ground traces should be routed s eparately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that t he ground traces of external components do not caus e variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedanc e. 5. thermal consideration should by any chance the power dissipation rating b e exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. the ab solute maximum rating of the pd stated in this spec ification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass ep oxy board. in case of exceeding this absolute maxim um rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approxim ately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possi ble that the internal logic may be unstable and inr ush current may flow instantaneously due to the internal poweri ng sequence and delays, especially if the ic has mo re than one power supply. therefore, give special consi deration to power coupling capacitance, power wirin g, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electr omagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connec ting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors compl etely after each process or step. the ic?s power su pply should always be turned off completely before connecting o r removing it from the test setup during the inspec tion process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid e nvironment) and unintentional solder bridge deposited in between pi ns during assembly to name a few.
datasheet 22/25 tsz02201-0818abz00050-1-2 ? 2014 rohm co., ltd. all rights reserved. 25.jul.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60015FV-LB operational notes ? continued 11. unused input terminals input terminals of an ic are often connected to the gate of a mos transistor. the gate has extremely h igh impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily cha rge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the tr ansistor and cause unexpected operation of the ic. so unless otherwise specified, unused input terminals should be connec ted to the power supply or ground line. 12. regarding input pins of the ic this ic contains p+ isolation and p substrate layer s between adjacent elements in order to keep them i solated. p-n junctions are formed at the intersection of the p l ayers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junctio n operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can re sult in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p subs trate) should be avoided. figure 43. example of ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the diele ctric constant considering the change of capacitanc e with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso).
datasheet 23/25 tsz02201-0818abz00050-1-2 ? 2014 rohm co., ltd. all rights reserved. 25.jul.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60015FV-LB ordering information b m 6 0 0 1 5 f v - lbe2 part number package fv:ssop-b10w product class lb for industrial applications packaging and forming specification e2: embossed tape and reel marking diagrams ssop-b10w(top view) 1pin mark part number marking b m 6 0 0 1 5 lot number
datasheet 24/25 tsz02201-0818abz00050-1-2 ? 2014 rohm co., ltd. all rights reserved. 25.jul.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60015FV-LB physical dimension, tape and reel information package name ssop-b10w
datasheet 25/25 tsz02201-0818abz00050-1-2 ? 2014 rohm co., ltd. all rights reserved. 25.jul.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BM60015FV-LB revision history date revision changes 25.jul.2016 001 new release
notice - p a a - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. ( n ote1) m edical equipment classifica tion of the specific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a cert ain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the f ollowing are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are no t designed under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any specia l or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, prior to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our products in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cle aning residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proof design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation o f performance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under de viant condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products, please consult with th e rohm representative in advance. for details , please refer to rohm mounting specification
notice - p a a - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin con sidering variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contain ed in this document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contain ed in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive pr oduct, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condi tion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connecti ons may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are e xposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaut ion for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all informa tion and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third pa rty regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or impli ed, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert its intellectual property rig hts or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the pr oducts may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatsoever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated com panies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number BM60015FV-LB package ssop-b10w unit quantity 1500 minimum package quantity 1500 packing type taping constitution materials list inquiry rohs yes BM60015FV-LB - web page

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