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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive r ays 1/ 25 tsz22111 ? 14 ? 001 tsz02201-0t1t0c700150-1-2 09.dec.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. constant current led drivers 50v 200ma 1ch source driver fo r automotive bd 8372hfp-m bd8372efj-m general description bd 8372hfp-m and bd 8372efj-m are led source drivers capable of withstanding high input voltage (50v max). t he constant current output is set by either of two external resistors. it has built-in led open/short protection, external resistance open/short protection and overvoltage protection that can achieve high reliability. it is possible to control all leds together and turn off even if led causes short/open in a certain row when driving two or more leds by using multiple ics. features ? variable form constant- current source ? h/l current setting switch control ? led open/short protection circuit integrated ? iset open/short protection circuit integrated ? overvoltage mute and temperature protection function integrated ? abnormal output detection and output functions (pbus) applications for automotive (rear lamp, interior light, etc.). basic application circuit key specifications ? input voltage range: 5.5v to 40v ? max output current: 200ma(max) ? output current accuracy: 8%(max) ? operating temperature range: - 40 c to +125c packages w (typ) x d (typ) x h (max) hrp7 9.395mm x 10.540mm x 2.005mm htsop-j8 4.90mm x 6.00mm x 1.00mm hrp7 htsop- j8 bd8372hfp-m bd8372efj-m vin stop iseth isetl pbus gnd fin iout figure 1. typical application circuit datashee t datashee t downloaded from: http:///
2/ 25 bd8372hfp-m bd8372efj-m ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 09.dec.2015 rev.001 tsz02201-0t1t0c700150-1-2 pin configurations figure 2. hrp7 package pin configuration figure 3. htsop-j8 package pin configuration pin descriptions hrp7 htsop- j8 pin no. pin name descripti on pin no. pin name description 1 stop in put terminal for brake lamp 1 v in power supply input 2 pbus error detection i/o terminal 2 iout current output terminal 3 isetl current setting terminal (l mode) 3 gnd gnd 4 gnd gnd 4 gnd gnd 5 iseth current setting terminal (h mode) 5 stop in put terminal for brake lamp 6 vin power supply input 6 pbus error detection i/o terminal 7 iout current output terminal 7 isetl current setting terminal (l mode) 8 iseth current setting terminal (h mode) hrp7 (top view) htsop- j8 (top view) 1 2 3 4 8 7 6 5 downloaded from: http:///
3/ 25 bd8372hfp-m bd8372efj-m ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 09.dec.2015 rev.001 tsz02201-0t1t0c700150-1-2 block diagram vref vin stop current control vin vin-0.2v vref vref pbus led off h/l mode set iref_l iref_h iref_l iref_h protect led open mode led open det led short 0.8v 0.8v gnd iout isetl iseth 0.6v figure 4. block diagram downloaded from: http:///
4/ 25 bd8372hfp-m bd8372efj-m ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 09.dec.2015 rev.001 tsz02201-0t1t0c700150-1-2 absolute maximum ratings (ta=25 c ) parameter symbol rating unit power supply voltage v in -0.3 to + 50 v stop, iout, pbus terminal v stop , v iout , v pbus -0.3 to v in +0.3 v iseth, isetl terminal v iseth , v isetl -0.3 to +7 v power consumption pd hrp7 2.3 (note 1) w htsop- j8 1.1 (note 2) operating temperature range topr - 40 to + 125 c storage temperature range tstg - 55 to + 150 c junction temperature tjmax 150 c iout output maximum current i iout 200 ma (note 1) hrp7 ic mounted on glass epoxy 2-layer boar d area 15mmx15mm of the back copper foil, measuring 70mmx70mmx1.6mm. pd decreased at 18.4mw/ c for temperatures above ta= 25 c . (note 2) htsop-j8 ic mounted on glass epoxy 2-layer board area 15mmx15mm of the ba ck copper foil, measuring 70mmx70mmx1.6mm. pd decreased at 8. 8m w/ c for temperatures above ta= 25 c . caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in cas e the ic is operated over the absolute maximum ratings. recommended operating conditions (ta=- 40 c to +125 c ) (please set after considering power consumption for the power- supply voltage.) parameter symbol rating unit conditions min typ max power supply voltage v in 5.5 13 40 v - current setting resist or r iseth 10 - 100 k stop=h r isetl 10 - 100 k stop=l minimum capacitor connecting iout terminal c iout 0.1 - - f downloaded from: http:///
5/ 25 bd8372hfp-m bd8372efj-m ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 09.dec.2015 rev.001 tsz02201-0t1t0c700150-1-2 electrical characteristics (unless otherwise specified, ta=- 40 c to 125 c , v in =13v, r isetl =r iseth =40k, r pbus =10k) parameter symbol limit unit conditions min typ max circuit current i in - 2.9 5 ma iout output current h i out _ h 48.5 50 51.5 ma 50ma setting (i set =40k) stop=high, ta=25 c 46 50 54 ma 50ma setting (i set =40k ) stop=high, ta=-40c to +125c iout output current l i out _ l 4.85 5 5.15 ma 5ma setting (i set =40k) stop=low, ta=25 c 4.6 5 5.4 ma 5ma setting (i set =40k ) stop=low, ta=-40c to +125c iout drop voltage h v drh _ iout - 0.7 1.2 v 200ma setting(i set =10k ) stop=high iout drop voltage l v drl _ iout - 0.5 0.7 v 20ma setting(i set =10k ) stop=low iout off current i iout _ off - - 1 a v iout =2v, pbus=l, ta=25 c iout current at gnd short i iout _ short - - 40 a v iout =0v iset terminal voltage v iset - 0.8 - v at isetl or iseth pins iset short detection resistor r iset_short - 5.1k 7.5k at isetl or iseth pins iset open detection resistor r iset_open 125k 400k - at isetl or iseth pins iout led open detection v iout_open v in -0.3 v in -0.2 v in -0.1 v iout led short detection v iout_short 0.2 0.6 1.0 v stop input voltage h v ih _stop 4.0 - v in +0.2 v stop input voltage l v il _stop gnd - 1.0 v stop input current v in _stop - 40 100 a v stop =13v pbus input voltage h v ih _pbus 4.0 - v in +0.2 v pbus input voltage l v il _pbus gnd - 2.0 v pbus low voltage v ol _pbus - - 1.5 v i pbus =2 0ma pbus input current i in _pbus - 38 100 a v pbus =13v in under voltage open detection mask voltage v uvlo_iopen 7.5 8.0 8.5 v in over voltage mute current v in _ovpmute 16 19 24 v 200ma setting (i set =10k ) stop=high downloaded from: http:///
6/ 25 bd8372hfp-m bd8372efj-m ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 09.dec.2015 rev.001 tsz02201-0t1t0c700150-1-2 typical performance curves (reference data) (unless otherwise specified ta=25 c, v in =13v) figure 5 . i out vs r isetl (stop=l ow ) figure 6 . i out vs r iseth (stop=h igh ) figure 7 . i out vs v in (stop=l ow ) figure 8 . i out vs v in (stop=h igh ) v iout =3v r iseth =10k r iseth =2 0k r iseth =4 0k v iout =3v r isetl =10k r isetl =2 0k r isetl =4 0k downloaded from: http:///
7/ 25 bd8372hfp-m bd8372efj-m ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 09.dec.2015 rev.001 tsz02201-0t1t0c700150-1-2 typical performance curves (reference data) - continued (unless otherwise specified ta=25 c, v in =13v) figure 9. i out vs ta (stop=l ow ) figure 10 . i out vs ta (stop=h igh ) figure 11. i out v s r isetl (stop=l ow ) figure 12 . i out vs r iseth (stop=h igh ) downloaded from: http:///
8/ 25 bd8372hfp-m bd8372efj-m ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 09.dec.2015 rev.001 tsz02201-0t1t0c700150-1-2 timing chart vin stop iout pbus current control h/lmode switch led short led open vin stop pbus isetl iseth led short vin led open stop viout isetl iiouth iioutl vih_stop vil_stop iseth pbus i ioutl v in v iout i setl i set h i iouth v ih_stop v il_stop figure 13 . timing chart downloaded from: http:///
9/ 25 bd8372hfp-m bd8372efj-m ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 09.dec.2015 rev.001 tsz02201-0t1t0c700150-1-2 function description (unless otherwise specified, ta=25 c , v in =13v, r isetl =r iseth =40k, the numerical value in the table are typ values .) 1. table for operation stop v iout r isetl r iseth mode i out pbus l 2v125k (min) - i setl open 1a(m ax ) low output h - - r iseth < 7.5k (m ax ) i seth short 1a(m ax ) low out put h - - r iseth >125k (min) i seth open 1a(m ax ) low output l 2v 10 / 25 bd8372hfp-m bd8372efj-m ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 09.dec.2015 rev.001 tsz02201-0t1t0c700150-1-2 2. me thod of setting current the ic regulates the voltage at isetl/iseth to v iset (0.8v typ) across the external resistor to set i out . then i out is set by setting stop high or low. vin stop iout pbus +b led open current control h/lmode switch 0.8v(typ) gnd iref_l iref_l isetl iseth 0.8v(typ) r isetl r iseth figure 14. current setting method ? l mode (stop=low) ? h mode (stop=high) exp) exp) a r v i isetl iout 250 8.0 ? ? ma k v i k r out i isetl 5 250 40 8.0 6.1 ? ? ? ? ? ? a r v i iseth iout 2500 8.0 ? ? ma k v i k r out i iseth 50 2500 40 8.0 40 ? ? ? ? ? ? iut utput currentvs iset connect resistance 0.0010 0.0100 0.1000 1.0000 1.00e+03 1.00e+04 1.00e+05 1.00e+06 riset[ ] iout[a] h m o d e l m o d e r_iset setting range short protection open protection r iset [ ] i out [a] i out output current vs iset connect resistance downloaded from: http:///
11 / 25 bd8372hfp-m bd8372efj-m ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 09.dec.2015 rev.001 tsz02201-0t1t0c700150-1-2 3. current control at output saturat ion when v iout (=v f ) - v in > 0.5v (typ), the led current i f is decreased to a set current 20a (typ). therefore, v f decreases due to the decrease in the current. open detecti on can be prevented by keeping v iout v in -0.5v. the current controlled to i out <20a and the led current i f must be set so that v f does not exceed v uvlo_open by 20a. if v in < v uvlo_open this function is not active. viout(=vf) viout_open vuvlo_open vin iiout =if) led vf_if characteristic iout=20ua max to keep viutQvi -0.4v, the current is controlled. to iout=20ua(max) viout viout_open however, open detection is masked by vinvin-vdr_iout for a set current. current control + - + - iset current limit vin-0.2v vin- 0.5v led_open iout vin figure 15. current control at output saturation v iout >v iout_open v iout >v iout_open however, open detection is masked by v in v in -v dr_iout to a set current. led v f _i f characteristic downloaded from: http:///
12 / 25 bd8372hfp-m bd8372efj-m ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 09.dec.2015 rev.001 tsz02201-0t1t0c700150-1-2 4. protect bus (pbus) pbus is an i/o terminal that outputs any detected error by switchi ng pbus from hi- z (note 1) to low. the output current can also be turned off by pulling the pbus low. when drivin g multiple leds through multiple ics, as shown in the figure below, all the rows of leds can be turned off by any fault by conn ecting pbus terminal to each ic. (note1) pbus terminal is an open drain terminal. even when used separatel y, please be pulled up(10k) to power supply voltage . vin iout p b u s = hi - z ? l o w l e d o p e n stop pbus isetl iseth gnd +b iout vin stop pbus isetl iseth gnd l e d o f f iout vin stop pbus isetl iseth gnd l e d o f f p rot e ct b u s figure 16. pbus function example of operating protection for an led open condition viout pbus ch 2 ch 3 viout_short viout-open viout iiout viout iiout clamps to 1.4v led open iiout ch 1 low hi -z hi -z 00 viout_short 0 0 0 0 figure 17. example of protective operation when led becomes open on the first ic, pbus of ic1 is switched from hi-z to low. as pbus becomes low, the other ics detect the error and turns off their own leds. v iout clamps to 1.4v during the off period in order to prevent grou nd short protection. v iout_open v iout_short v iout_short i iout v iout i iout v iout v iout i iout downloaded from: http:///
13 / 25 bd8372hfp-m bd8372efj-m ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 09.dec.2015 rev.001 tsz02201-0t1t0c700150-1-2 5. protection function this ic has built-in short/open protection function for the e xternal components. any error detected will pull the pbus terminal low. figure 18 . led open detection function current control 0.6v pbus vin iout short off +b off control figure 19 . led short detection function current control 4.3v pbus vin iout off +b iset figure 20 . iset pin open detection function current control pbus vin iout off +b iset 0. 05 v figure 21 . iset pin short detection function current control vin-0.2v pbus vin iout ? off +b `? open (1) led open detecting function when any led connected at the iout becomes open, v iout will go high. when an error is detected at v iout < v iout_open the pbus is pulled low. (2) led short detecting function when the leds connected at the iout terminal are shorted to ground, v iout will go low. when an error is detected at v iout < v iout_short 0.6v (typ) the output current is turned off to prevent ic heating and the pbus is pulled low. (3) iset(h/l) open detecting function when the external resistance connected at isetl or iseth terminal > r iset_open 400k (typ), the output current is turned off to prevent ic heating and the pbus is pulled low. this dete ction is not affected by the current setting mode. (4) iset(h/l) short detecting function when the external resistance connected at isetl or iseth terminal < r iset_short 5.1k (typ), the output current is turned off to protect the leds and the pbus is pulled low. this detection is not affected by the current setting mode. downloaded from: http:///
14 / 25 bd8372hfp-m bd8372efj-m ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 09.dec.2015 rev.001 tsz02201-0t1t0c700150-1-2 6. over voltage protection overvoltage protection works in (r iseth =40k), 18v (typ) v in at i out =200ma setting and limits output current to suppress the upswing in heat generation of lsi. the overvoltage mute protection is effective only for (stop=high) at h mod e time. 200ma 10ma iomax vin 19v 0v 13v 40v 24v ?^?R? ?` figure 22. overvoltage mute function over voltage protection current limit i omax downloaded from: http:///
15 / 25 bd8372hfp-m bd8372efj-m ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 09.dec.2015 rev.001 tsz02201-0t1t0c700150-1-2 recommended application circuit bd8372 +b tail d1 d2 d3 stop fl1 2.5k @100mhz 10k 0.1 f 10k zd1 4.7 f 10k stop pbus isetl 39k iseth 39k gnd vin iout 0.1 f figure 23. recommended application circuit (note) emc iso 11452-2 (alse) iso 11452-4 ( bc i) iso 7637- 2 ? pulse1 ? pulse2a,2b (level4) ? pulse3a,3b (level4) no. component name component value product name company 1 d1 - rf201l2s rohm 2 d2 - rf201l2s rohm 3 d3 - rf201l2s rohm 4 z d1 - tnr12h- 220k nippon chemicon 5 fl1 - hmz2012r102a tdk 6 c vin 4.7f gcm32er71h475ka40 murata 7 c iout 0.1f gcm188r11h104ka42 murata 8 c stop 0.1f gcm188r11h104ka42 murata 9 risetl 39k mcr03 series rohm 10 riseth 39k mcr03 series rohm 11 r pbus 10k mcr03 series rohm 12 r1 10k mcr03 series rohm 13 r2 10k mcr03 series rohm table 1. bom list downloaded from: http:///
16 / 25 bd8372hfp-m bd8372efj-m ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 09.dec.2015 rev.001 tsz02201-0t1t0c700150-1-2 power dissipation hrp7 package htsop-j8 package (c aution 1) when mounted with 70.0mm x 70.0mm x 1.6mm glass epoxy substrate. (c aution 2) abobe copper foil area indicates backside copper foil area. (c aution 3) value changes according to number of substrate layers and copper foil area.note that this value is a measured value. not a guaranteed value. figure 24. thermal dissipation curve 5.0 0.0 4.0 0 25 50 75 100 125 150 temp ta [ ] power dissipation pd [w] 4. 16 w 2 layer copper foil 50 mm x 50 mm ja = 30 /w 3.0 2.0 1.0 2.3w 1.6w 2 layer copper foil 15 mm x 15 mm ja = 54 .4 /w 1 layer ja = 78 .1 /w 2.0 0.0 0 25 50 75 100 125 150 temp ta [ ] power dissipation pd [w] 1.0 2 layer copper foil 50 mm x 50 mm ja = 69 /w 2 layer copper foil 15 mm x 15 mm ja = 113 .6 /w 1 layer ja = 153 .2 /w 0. 82 w 1.1w 1. 81 w downloaded from: http:///
17 / 25 bd8372hfp-m bd8372efj-m ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 09.dec.2015 rev.001 tsz02201-0t1t0c700150-1-2 pd (power dissipation) and i omax (permissible current) the relation between pd and i omax by v f of led connecte d with iout is shown. figure 25. heat reduction curve hrp7 0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0.16 0.18 0.2 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 25 50 75 100 125 150 hrp7 iomax - ta pd -ta characteristics (pd=2.3w) pd[w] iomax[a] pd (2 layer copper foil 15mm ? 15mm) ja = w iomax (vf=6v) iomax (vf=3v) iomax (vf=9v) ta[ ] 0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0.16 0.18 0.2 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 25 50 75 100 125 150 htsop- j8 iomax - ta pd -ta characteristics (pd=1.1w) pd[w] iomax[a] pd (2 layer copper foil 15mm ? 15mm) ja = 11w iomax (vf=6v) iomax (vf=3v iomax (vf=9v) ta[ ] vin iout 8v 11 v iomax 13 .5v current control 13 v i omax 8v to 11v downloaded from: http:///
18 / 25 bd8372hfp-m bd8372efj-m ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 09.dec.2015 rev.001 tsz02201-0t1t0c700150-1-2 i/o equivalent circuit pin no. pin name i/ o equivalent circuit 1 stop 2 pbus 3 isetl 4 gnd - 300 k vin (6pin) gnd (4pin) stop (1pin) 100 k 5v vin (6pin) gnd (4pin) pbus ( 28 pin) 5v 200 k 5v vin (6pin) gnd (4pin) isetl (3pin) 5v 5v downloaded from: http:///
19 / 25 bd8372hfp-m bd8372efj-m ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 09.dec.2015 rev.001 tsz02201-0t1t0c700150-1-2 i/o equivalent circuit C continued pin no. pin name i/o equivale nt circuit 5 iseth 6 v in - 7 iout vin (6pin) gnd (4pin) iseth (5pin) 5v 5v vin (6pin) gnd (4pin) iout (7pin) 5v downloaded from: http:///
20 / 25 bd8372hfp-m bd8372efj-m ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 09.dec.2015 rev.001 tsz02201-0t1t0c700150-1-2 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance sup ply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the grou nd and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all pow er supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capa citors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small- signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding th is absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expe cte d characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one powe r supply. therefore, give special consideration to power co upling capacitance, power wiring, width of ground wiring, an d routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comple tely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mountin g the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins du ring assembly to name a few. downloaded from: http:///
21 / 25 bd8372hfp-m bd8372efj-m ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 09.dec.2015 rev.001 tsz02201-0t1t0c700150-1-2 operational notes C continued 11. unused input pins input pins of an ic are often connected to the gate of a mos tran sistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the smal l charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spec ified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate la yers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a par asitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physi cal damage. therefore, conditions that cause these diodes t o operate, such as applying a voltage lower than the gnd vo ltage to an input pin (and thus to the p substrate) should be avoided. figure 26 . e xample of monolithic ic structure 13. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevent s heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the ratin g is excee ded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit t hat will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal o peration. note that the tsd circuit operates in a situation that exceeds th e absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set des ign or for any purpose other than protecting the ic from heat damage. 14. sudden voltage surge on v in because mosfets are used in the output, a very steep change in the vcc voltage may cause the transistors to conduct large current. take this condition into account wh en selecting the value of external circuit constants for a certain application. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
22 / 25 bd8372hfp-m bd8372efj-m ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 09.dec.2015 rev.001 tsz02201-0t1t0c700150-1-2 ordering information b d 8 3 7 2 h f p - m t r form name package hfp : hrp7 packaging and forming specification tr : embossed tape and reel (hrp7) b d 8 3 7 2 e f j - m e 2 form name package efj : htsop- j8 packaging and forming specification e2: embossed tape and reel (htsop- j8 ) marking diagrams part number marking package part number bd8372hfp hrp7 reel of 2000 BD8372HFP-MTR bd8372 htsop- j8 reel of 2500 bd8372efj-me2 htsop-j8(top vie w) b d 8 3 7 2 part number marking lot number 1pin mark hrp 7 (top view) bd8372hfp part number marking lot number 1pin mark downloaded from: http:///
23 / 25 bd8372hfp-m bd8372efj-m ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 09.dec.2015 rev.001 tsz02201-0t1t0c700150-1-2 physical dimension, tape and reel information package name hrp7 downloaded from: http:///
24 / 25 bd8372hfp-m bd8372efj-m ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 09.dec.2015 rev.001 tsz02201-0t1t0c700150-1-2 physical dimension, tape and reel information C continued package name htsop- j8 downloaded from: http:///
25 / 25 bd8372hfp-m bd8372efj-m ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 09.dec.2015 rev.001 tsz02201-0t1t0c700150-1-2 revision history date revision changes 09.dec.2015 001 new release downloaded from: http:///
notice-paa-e rev.002 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extreme ly high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in advance. unless otherwise agreed in writin g by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific applic ations japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequ ate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or ex traordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or c onditions (as exemplified below), your independent verification and confirmation of product performance, reliabil ity, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organ ic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7 . de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mu st be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-paa-e rev.002 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contained in this docume nt a re presented only as guidance for products use. therefore, in case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label qr code printed on rohm products label is for rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any in tellectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert its intellectual property rights or other rights a gainst you or your customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in p art, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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