features * plastic package has underwriters laboratory flammability classification 94v-0 * low power loss,high efficiency * for use in low voltage high frequency inverters, free wheeling,and polarity protection applications * guardring for over voltage protection * high temperature soldering guaranteed: 260c/10 seconds at terminals mechanical data case : sod-123fl/mini sma molded plastic over sky die terminals : tin plated, solderable per mil-std-750, method 2026 polarity : color band denotes cathode end mounting position: any s i t c u d o r p f o l a i r e t a m e h t t a h t e r a l c e d e w weight: 0.0155g ) d n u o p m o c y x o p e n e e r g ( e e r f n e g g o l a h handling precautin ::none 1.electrical characteristic maximum & thermal characteristics ratings at 25c ambient temperature unless otherwise specified. parameter symbol symbol b120f b130f b140f b145f b150f b160f B180F b1100f b1150f b1200f unit device marking code 12 13 14 145 15 16 18 110 115 120 maximum repetitive peak reverse voltage v rrm 20 30 40 45 50 60 80 100 150 200 v maximum rms voltage v rms 14 21 28 31.5 35 42 56 70 105 140 v maximum dc blocking voltage v dc 20 30 40 45 50 60 80 100 150 200 v maximum average forward rectified current at tc = 75c i f(av) a peak forward surge current 8.3ms single half sine-wave superimposed on rated load (jedec method) i fsm a typical thermal resistance (note 1) rj a rj c c/w operating junction temperature range t j c storage temperature range t stg c electrical characteristics ratings at 25c ambient temperature unless otherwise specified. parameter symbol symbol unit maximum instantaneous forward voltage at(if = 0.1 a, tj = 25c) (if = 0.7 a, tj = 25c) (if = 1.0 a, tj = 25c) v f - - 0.5 0.35 0.45 0.50 - - 0.90 - - 0.92 v maximum dc reverse current at rated dc blocking voltage ta = 25c tj = 125c i r ma typical junction capacitance at 4.0v, 1mhz c j pf notes: 1. 8.0mm2 (.013mm thick) land areas - - 0.85 1.0 30 110 40 ?55 to +150 ?65 to +175 - - 0.55 0.5 10 160 - - 0.7 b120f thru b1200f schottky barrier rectifiers rev erse voltage 20 to 200v forw ard current 1.0a b120f b130f b140f b145f b150f b160f B180F b1100f b1150f b1200f lea d(p b)-f r ee p b c at ho de ano d e weitron http:// www .weitron.com.tw 1/6 28-may-2016
2.ratings and characteristic curves ( ta = 25c unless otherwise noted ) fig. 1 ? forward current derating curve a ve ra ge f orw a rd rectified curre nt (a ) 0 25 50 75 100 125 150 175 1.0 0.5 0 60 hz resistive or inductive load case temperature:tc(c) fig 4. ? typical reverse characteristics ins tantane ous re ve rs e curre nt (m a ) 0 20 40 60 80 100 10 1.0 0.1 0.01 0.001 percent of rated peak reverse voltage (%) tj=125 tj=75 tj=25 fig 6. ? typical junction capacitance 0.1 1 10 100 1000 100 10 tj = 25 c f = 1.0 mhz vsig = 5 0 v reverse voltage (v) j unction ca pacitance (pf ) fig 5. ?typical transient thermal impedance t r ans i ent t h erm a l i m pedance( c / w) 10 1.0 0.1 100 0.01 0.1 1.0 10 t,pulse duration,sec fig. 2 ? maximum non-repetitive peak forward surge current 1 10 30 15 0 tj = tj max 8.3ms single half sine- number of cycles at 60hz p eak forw a rd s ur g e c urre nt (a ) tj = 25 c pulse wi dth = 300s 1% duty cycle ins tantane ous f orw a rd curre nt (a ) 10 1.0 0.1 0.01 100 fig 3. ? typical instantaneous forward characteristics 0.2 0.4 0.6 0.8 1.0 instantaneous forward voltage (v) tj = 25 c pulse wi dth = 300s 1% duty cycle b120f thru b1200f weitron http:// www .weitron.com.tw 2/6 28-may-2016
3. dimension: suggested solder pad layout dimensions in inches and (millimeters) sod-123fl m i n m a x m i n max a 3 . 5 3 . 9 0 . 1 3 8 0 . 1 5 9 b 0 . 7 5 0 . 9 5 0 . 0 2 9 0 . 0 3 7 c 2 . 6 3 . 0 0 . 1 0 3 0 . 1 1 9 d 1 . 6 2 . 0 0 . 0 6 3 0 . 0 7 9 e h 0 . 9 1 . 2 0 . 0 3 6 0 . 0 4 7 j 0 . 1 2 0 . 2 2 0 . 0 0 5 0 . 0 0 9 k 0 . 0 3 2 t y p 0 . 8 t y p i nch e s 0 . 4 5 t y p 0 . 0 1 8 t y p d i m m i l l i m e t e r s p a c k a g e a b c s o d - 123 f l 0 . 044(1 . 1 0 0 . 040(1 . 0 0 ) 0 . 079 ( 2 . 0 0 ) b a c b120f thru b1200f weitron http:// w w w .weitron.com.tw 3/6 28-may-2016 )
4.packing information uni t mm a 0 . 1 2 . 0 0 b 0 . 1 3 . 8 5 c 0 . 1 1 . 1 0 d 0 . 1 1 . 5 0 d 2 . 0 - d 1 m i n - d 2 . 0 178 . 0 0 d 1 m i n 6 2 . 0 0 d 2 0 . 5 1 3 . 0 0 e 0 . 1 1 . 7 5 f 0 . 1 3 . 5 0 p 0 . 1 4 . 0 0 p 0 0 . 1 4 . 0 0 p 1 0 . 1 2 . 0 0 t 0 . 1 0 . 2 3 w 0 . 3 8 . 0 0 w 1 1 . 0 1 1 . 4 0 s y m b o l t o l e r a n c e s o d -123 f l e m b o s s m e n t c e n t e r s p r o c k e t h o l e p o s i t i o n i t e m p u n c h h o l e p o s i t i o n c a rri e r w i d t h c a rri e r l e n g t h c a r r i e r d e p t h s p r o c k e t h o l e 1 3 " r e e l o u t s i d e d i a m e t e r 1 3 " r e e l i n n e r d i a m e t e r 7 " r e e l o u t s i d e d i a m e t e r o v e r a l l t a p e t h i c k n e s s 7 " r e e l i n n e r d i a m e t e r f e e d h o l e d i a m e t e r p u n c h h o l e p i t c h s p o c k e t h o l e p i t c h t a p e w i d t h r e e l w i d t h weitron http:// w w w .weitron.com.tw 4/6 28-may-2016 b120f thru b1200f
5.suggested thermal profile for soldering process 1 . storage e n v i ron m entte m pera t ure= 5 ~ 40 h u m idit y = 55 2 5 % 2. reflow soldering of surface-mount device 3. reflow soldering t i m e m a i n t a i n e d abo v e : - t e m p e r a t u r e ( t l ) - t i m e ( t l ) 2 1 7 6 0 - 260 s e c p e a k t e m p e r a t u r e ( t p ) 255 - 0 / + 5 t i m e 2 5 t o p e a k t e m p e r a t u r e r a m p - d o w n r a t e < 6 / s e c < 6 m i n u t e s a v e r age r a m p - u p r a t e ( t l t o t p ) < 3 / s e c p r o f i l e f e a t u r e t i m e w i t h i n 5 o f a c t u a l p e a k t e m p e r a t u r e ( t p ) 1 0 ~ 3 0 s e c t s m a x t o t l - r a m p - u p r a t e p r ehea t - t e m p e r a t u r e m i n ( t s m i n ) - t e m p e r a t u r e m a x ( t s m a x ) - t i m e ( m i n t o m a x ) ( t s ) 150 200 6 0 ~ 120 s e c s o l d e r i n g c ond i t i o n < 3 s e c b120f thru b1200f weitron http:// w w w .weitron.com.tw 5/6 28-may-2016
6.high reliability test capabilities solder resistance mil-std-750d method-2031 solderability at 2455 for 5 sec mil-std-202f method-208 high temperature reverse bias r =80% rate at t j =150 for 168h r mil-std-750d method-1038 forward operation life mil-std-750d method-1027 intermittent operation life mil-std-750d method-1036 pressure cooker 15p sig at t a =121 for 4hrs jesd22-a102 temperature cycling mil-std-750d method-1051 thermal shock mil-std-750d method-1056 forward surge mil-std-750d method-4066-2 humidity at t a =85r h =85% for 1000hrs mil-std-750d method-1021 high temperature storage life mil-std-750d method-1031 item test condition reference -55 to +125 dwelled for 30 min. and transferred for 5min. total 10 cycles 0 for 5min. rise to 100 for 5min. total 10 cycles 8.3ms single half sine-wave superimposed on rated load,one surge t a =25i f =i o on state:power on for 5 min. off state:power off for 5 min. on and off for 500 cycles at 2605 for 102sec immerse body into solder 1/16" 1/32" rated average rectifier current t a =25 for 500hrs weitron http:// www .weitron.com.tw 6/6 28-may-2016 b120f thru b1200f at 175 for 1000hrs v
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