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ht6026 remote control encoder pin assignment block diagram rev. 1.10 1 february 20, 2009 general description the ht6026 is a cmos lsi encoder designed for use in remote control system. it is capable of encoding 9 bits of information which consists of n address bits and 9?n data bits. each address/data input is externally trinary programmable by external switches. the programma - ble address/data is transmitted along with the header bits via an rf or an infrared transmission medium upon receipt of a trigger signal (te ). the ht6026 is pin compatible with the mc145026. features operating voltage: 4v~18v low standby current low power and high noise immunity cmos technology 3 9 difference codes two transmission words minimum built-in oscillator needs only 5% resistor interface with rf or infrared transmission medium minimal external components 16-pin dip/nsop package applications burglar alarm system smoke and fire alarm system garage door controllers car alarm system security system cordless telephones other remote control systems

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pad assignment pad coordinates unit: m pad no. xy pad no. xy 1 598.00 689.00 9 160.00 687.00 2 674.00 433.00 10 670.00 687.00 3 674.00 126.00 11 670.00 347.00 4 674.00 162.00 12 670.00 172.00 5 674.00 449.00 13 670.50 689.50 6 598.00 687.00 14 270.00 689.00 7 342.00 687.00 15 84.00 689.00 8 127.00 687.00 16 299.00 689.00 chip size: 1650 1680 ( m) 2 * the ic substrate should be connected to vss in the pcb layout artwork. pin description pin no. pin name i/o internal connection description 1~7 ad0~ad6 i transmission gate input pins for address/data ad0~ad6 setting they can be externally set to v dd ,v ss or left open 8 vss negative power supply, ground 9~10 ad7~ad8 i transmission gate input pins for address/data ad7~ad8 setting they can be externally set to v dd ,v ss or left open 11 12 13 osc1 osc2 osc3 i o o oscillator oscillator input pin 14 te i cmos in pull-high transmission enable, active low 15 dout o cmos out encoder data serial transmission output 16 vdd positive power supply approximate internal connection circuits ht6026 rev. 1.10 2 february 20, 2009
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absolute maximum ratings supply voltage ...........................v ss 0.3v to v ss +24v storage temperature ........................... 50 cto125 c input voltage .............................v ss 0 . 3v to v dd +0.3v operating temperature .......................... 20 cto75 c note: these are stress ratings only. stresses exceeding the range specified under absolute maximum ratings may cause substantial damage to the device. functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil - ity. electrical characteristics ta=25 c symbol parameter test conditions min. typ. max. unit v dd conditions v dd operating voltage 4 18 v i stb standby current 5v oscillator stops 0.1 0.3 a 15v 0.1 0.5 a i dd operating current 5v no load, f osc =18khz 500 900 a 15v no load, f osc =22khz 2000 3000 a i dout output drive current 5v v oh =0.9 v dd (source) 1.0 1.7 ma 15v 8.0 14.0 ma 5v v ol =0.1 v dd (sink) 0.8 1.5 ma 15v 5.0 10.0 ma v ih h input voltage 0.7v dd v dd v v il l input voltage 0 0.3v dd v r te te pull-high resistance 5v v te =0v 800 k 15v 250 k f osc oscillator frequency 5v r ext =10k
c ext =2000pf r s= 20k 18 khz 15v 22 khz functional description operation the ht6026 encoder begins a one-word transmission cycle upon receipt of a transmission enable (te , active low). this cycle will repeat itself as long as the transmission enable (te ) is held low. once the transmission enable returns high, the encoder output completes its final n 2 word cycle, and then stops as shown in figure 1. the total number of transmission cycles allowed is always adjusted to an even number automatically. ht6026 rev. 1.10 3 february 20, 2009 7 7 ! " ! ! $ $ ' ! 8 8 7 9 7 0 7 * 0 : + + + ) ) ) ) , figure 1. transmission timing
information word an information word consists of 2 periods as shown: address/data waveform each programmable address/data pin can be externally set to one of the following three logic states: the transmitted information is as listed: pilot & sync. ad0 1 ad1 z ad2 1 ad3 z ad4 z ad5 z ad6 0 ad7 1 ad8 z z: floating ht6026 rev. 1.10 4 february 20, 2009
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; < * = , 2 < * = , 2 < * = , 6 7 6 ! 7 figure 2. composition of information > ! > > ? > & > < ! > @ ( figure 3. address/data bit waveform address/data programming (preset) the status of each address/data pin can be individually pre-set to logic high , low or floating . if a transmis- sion enable signal is applied, the encoder scans and transmits the status of 9-bit address/data serially in the order ad0 to ad8. but if the trigger signal is not applied, the chip only consumes a standby current which is less than 1 a (for v dd =5v). the address pins are usually pre-set to transmit data codes with their own particular security codes by the dip switches or pcb wiring, while the data is selected by the push button or electronic switches. the following figure demonstrates an application using the ht6026:
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transmission enable transmission is enabled by applying a low signal to the te pin. the ht6026 is enabled and outputs address/data codes from dout pin when the te is set to low and more than 65ns. flowchart oscillator frequency vs supply voltage ht6026 rev. 1.10 5 february 20, 2009 :
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package information 16-pin dip (300mil) outline dimensions ms-001d (see fig1) symbol dimensions in mil min. nom. max. a 780 880 b 240 280 c 115 195 d 115 150 e14 22 f45 70 g 100 h 300 325 i 430 ms-001d (see fig2) symbol dimensions in mil min. nom. max. a 735 775 b 240 280 c 115 195 d 115 150 e14 22 f45 70 g 100 h 300 325 i 430 ht6026 rev. 1.10 7 february 20, 2009 ( f # 4 - fig1. full lead packages ( f # 4 - fig2. 1 / 2 lead packages
mo-095a (see fig2) symbol dimensions in mil min. nom. max. a 745 785 b 275 295 c 120 150 d 110 150 e14 22 f45 60 g 100 h 300 325 i 430 ht6026 rev. 1.10 8 february 20, 2009
16-pin nsop (150mil) outline dimensions ms-012 symbol dimensions in mil min. nom. max. a 228 244 b 150 157 c12 20 c 386 394 d 69 e 50 f4 10 g16 50 h7 10 0 8 ht6026 rev. 1.10 9 february 20, 2009 ( f # 4 i
product tape and reel specifications reel dimensions sop 16n (150mil) symbol description dimensions in mm a reel outer diameter 330.01.0 b reel inner diameter 100.01.5 c spindle hole diameter 13.0 +0.5/-0.2 d key slit width 2.00.5 t1 space between flange 16.8 +0.3/-0.2 t2 reel thickness 22.20.2 ht6026 rev. 1.10 10 february 20, 2009
carrier tape dimensions sop 16n (150mil) symbol description dimensions in mm w carrier tape width 16.00.3 p cavity pitch 8.00.1 e perforation position 1.750.1 f cavity to perforation (width direction) 7.50.1 d perforation diameter 1.55 +0.1/-0.0 d1 cavity hole diameter 1.50 +0.25/-0.0 p0 perforation pitch 4.00.1 p1 cavity to perforation (length direction) 2.00.1 a0 cavity length 6.50.1 b0 cavity width 10.30.1 k0 cavity depth 2.10.1 t carrier tape thickness 0.300.05 c cover tape width 13.30.1 ht6026 rev. 1.10 11 february 20, 2009
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ht6026 rev. 1.10 12 february 20, 2009 copyright 2009 by holtek semiconductor inc. the information appearing in this data sheet is believed to be accurate at the time of publication. however, holtek as - sumes no responsibility arising from the use of the specifications described. the applications mentioned herein are used solely for the purpose of illustration and holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. holtek s products are not authorized for use as critical components in life support devices or systems. holtek reserves the right to alter its products without prior notification. for the most up-to-date information, please visit our web site at http://www.holtek.com.tw. holtek semiconductor inc. (headquarters) no.3, creation rd. ii, science park, hsinchu, taiwan tel: 886-3-563-1999 fax: 886-3-563-1189 http://www.holtek.com.tw holtek semiconductor inc. (taipei sales office) 4f-2, no. 3-2, yuanqu st., nankang software park, taipei 115, taiwan tel: 886-2-2655-7070 fax: 886-2-2655-7373 fax: 886-2-2655-7383 (international sales hotline) holtek semiconductor inc. (shanghai sales office) g room, 3 floor, no.1 building, no.2016 yi-shan road, minhang district, shanghai, china 201103 tel: 86-21-5422-4590 fax: 86-21-5422-4705 http://www.holtek.com.cn holtek semiconductor inc. (shenzhen sales office) 5f, unit a, productivity building, gaoxin m 2nd, middle zone of high-tech industrial park, shenzhen, china 518057 tel: 86-755-8616-9908, 86-755-8616-9308 fax: 86-755-8616-9722 holtek semiconductor inc. (beijing sales office) suite 1721, jinyu tower, a129 west xuan wu men street, xicheng district, beijing, china 100031 tel: 86-10-6641-0030, 86-10-6641-7751, 86-10-6641-7752 fax: 86-10-6641-0125 holtek semiconductor inc. (chengdu sales office) 709, building 3, champagne plaza, no.97 dongda street, chengdu, sichuan, china 610016 tel: 86-28-6653-6590 fax: 86-28-6653-6591 holtek semiconductor (usa), inc. (north america sales office) 46729 fremont blvd., fremont, ca 94538, usa tel: 1-510-252-9880 fax: 1-510-252-9885 http://www.holtek.com

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